基于第一性原理计算Mn掺杂MoS2对油中溶解气体的吸附性能

CO、C₂H₂、CH₄是溶解在变压器油中的典型故障特征气体,其种类和浓度能够反映油浸式变压器绝缘故障的不同类型和严重程度,进行油中溶解气体分析是在线检测变压器运行状态的重要方法.基于第一性原理,通过Mn-MoS₂单层对三种气体的吸附能、转移电荷、态密度和形变电荷密度等参数以及解吸性能分析和灵敏度计算,提出了一种基于Mn-MoS₂材料的气敏传感器对油中溶解气体进行分析的方法.结果表明Mn-MoS₂对CH₄是物理吸附,对CO和C₂H₂是化学吸附.对于Mn-MoS₂来说,CH₄在常温下吸附能力差且灵敏度低,CO在不同温度下均有较强的吸附能力,而C₂H₂在常温下吸附稳定,高温下易解吸且响应灵敏度高.因此,Mn掺杂的MoS₂体系可预期作为CO的气体吸附剂和检测C₂H     

Raman and optical absorption spectroscopic investigation of Yb-Er codoped phosphate glasses containing SiO_2

Yb-Er codoped Na2O-Al2O3-P2O5-xSiO2 glasses containing 0 - 20 mol% SiO2 were prepared successfully. The addition of SiO2 to the phosphate glass not only lengthens the bond between pS＋ and non-bridging oxygen but also reduces the number of P=O bond. In contrast with silicate glass in which there is only four-fold coordinated Si4＋, most probably there coexist [SiO4] tetrahedron and [SiO6] oetahedron in our glasses. Within the range of 0 - 20 mol% SiO2 addition, the stimulated emission cross-section of Era＋ ion only decreases no more than 10%. The Judd-Ofelt intensity parameters of Er3＋, Ω2 does not change greatly, but Ω4 and Ω6 decrease obviously with increasing SiO2 addition, because the bond between Er3＋ and O2- is more strongly eovalently bonded.     

稀土掺杂锰氧化物庞磁电阻效应

过去十多年来，具有庞磁电阻效应的稀土掺杂锰氧化物成为了凝聚态物理研究的重要领域。锰氧化物的载流子自旋极化率高，且在居里温度附近表现出很大的磁电阻效应，因此在自旋电子学中有潜在的应用前景。另一方面，锰氧化物是典型的强关联电子体系，它对目前有关强关联体系的认识提出了很大挑战。本文综述了锰氧化物的各种性质及其物理原因。全文首先概述了锰氧化物的庞磁电阻效应及其晶格和电子结构，简单介绍了其他一些庞磁电阻材料；随后综述了锰氧化物的电荷／轨道有序相及其输运性质；在第四部分简单介绍了锰氧化物中庞磁电阻效应的机制；最后讨论了锰氧化物的一些可能的应用，如低场磁电阻效应、磁隧道结、磁p-n结以及全钙钛矿的场效应管和自旋极化电子注入装置等。     

掺杂聚苯乙烯制备研究

讨论了惯性约束聚变研究中采用化学及物理手段在聚苯乙烯（PS）材料掺杂卤素、硅、氘等非金属元素以及铁、铬、钛等金属元素的原理和方法。利用硅烷偶联剂对氧化物表面进行了预处理,采用本体聚合的方式将氧化物掺杂在PS网络之中,简述了它们在ICF中的应用。     

Breakdown voltage analysis of Al0.25Ga0.75N/GaN high electron mobility transistors with partial silicon doping in the AlGaN layer

In this paper,two-dimensional electron gas（2DEG） regions in AlGaN/GaN high electron mobility transistors（HEMTs） are realized by doping partial silicon into the AlGaN layer for the first time.A new electric field peak is introduced along the interface between the AlGaN and GaN buffer by the electric field modulation effect due to partial silicon positive charge.The high electric field near the gate for the complete silicon doping structure is effectively decreased,which makes the surface electric field uniform.The high electric field peak near the drain results from the potential difference between the surface and the depletion regions.Simulated breakdown curves that are the same as the test results are obtained for the first time by introducing an acceptor-like trap into the N-type GaN buffer.The proposed structure with partial silicon doping is better than the structure with complete silicon doping and conventional structures with the electric field plate near the drain.The breakdown voltage is improved from 296 V for the conventional structure to 400 V for the proposed one resulting from the uniform surface electric field.     

分层掺B和吸附H2O碳纳米管的结构稳定性及电子场发射性能

运用基于第一性原理的密度泛函理论,系统研究了处于外电场中分层掺B并吸附不同数目H₂O碳纳米管体系的结构稳定性和电子场发射性能. 研究表明:第3层掺B并吸附5个H₂O的B₃CNT+5H₂O体系结构最稳定,管帽处Mulliken电荷最密集,尤其与单独掺B的B₃CNT和单独吸附H₂O的B₃CNT+5H₂O相比,其Fermi能级处态密度分别     

含氧空位的氟掺杂二氧化锰助力稳定锌离子电池

将无机盐NH₄F加入到MnO₂的前驱体溶液中,通过高效、简单的一步水热法制备了具有氧缺陷的F掺杂α-MnO₂纳米棒(记为F-MnO₂)。氧空位和F掺杂对提高F-MnO₂的导电性、促进离子扩散、提高倍率性能起着至关重要的作用。另外,由于F掺杂,形成了F—Mn键,这可以有效地抑制放电产物中Mn³⁺的Jahn-Teller畸变,从而提高结构的稳定性。得益于这些协同效应,组装的Zn||F-MnO₂全电池在0.5 A·g^-1下,首圈放电比容量高达274 mAh·g^-1,且具有较长的循环寿命和优异的倍率性能。同时,通过循环伏安(CV)和恒流充放电(GCD)曲线证明了F-MnO₂的储能机制为H⁺和Zn²⁺的共嵌入/脱出过程。     

用光刺激放电法研究纳米粉末掺杂低密度聚乙烯中陷阱能级

通过光刺激放电(PSD)技术研究了纳米粉末掺杂低密度聚乙烯(LDPE)中的陷阱能级.利用连续扫描法得到了不同掺杂比例的Al₂O₃,MgO纳米粉末掺杂试样以及相同掺杂比例的多种纳米粉末掺杂试样的PSD电流谱,定性地得出了试样陷阱能级的深浅变化.分步扫描法定量地描述了LDPE试样在Al₂O₃纳米掺杂前后陷阱能量分布的变化.结果表明,掺杂比例大于0.2%的Al₂O₃纳米粉末掺杂、大于0.5%的MgO纳米粉末掺杂能够显著地使得LDPE陷阱能级变深.结合纳米掺杂对LDPE空间电荷注入影响的相关报道,可推测纳米掺杂对空间电荷注入的抑制与试样中陷阱能级变深存在密切的关联.     

Photoluminescence and thermoluminescence properties of SnO2 nanoparticles embedded in Li20-K20-B203 with Cu-doping

Cu-doped borate glass co-doped with SnO2 nanoparticles is fabricated by melt quenching. The structure and morphology of the samples are examined by X-ray diffraction and field emission scanning electron microscopy. Up-conversion enhancement is observed in the photoluminescence （PL） and thermolumines- cence （TL） intensities of the glass. PL emission spectra are identified in the blue and green regions, and a fourfold increase in emission intensity may be observed in the presence of embedded SnO2 nanoparticles. The glow curve is recorded at 215℃, and fourfold increases in TL intensity are obtained by addition of 0.1 mol% SnO2 nanoparticles to the glass. Higher TL responses of the samples are observed in the energy range of 15-100 KeV. At energy levels greater than -0.1 MeV, however, flat responses are obtained. The activation energy and frequency factor of the second-order kinetic reaction are calculated by the peak shape method.     

An optical study of the D-D neutron irradiation-induced defects in Co-and Cu-doped ZnO wafers

Room-temperature photoluminescence and optical transmittance spectroscopy of Co-doped(1×1014,5×1016,and 1×1017cm-2) and Cu-doped(5×1016cm-2) ZnO wafers irradiated by D-D neutrons(fluence of 2.9×1010 cm-2) have been investigated.After irradiation,the Co or Cu metal and oxide clusters in doped ZnO wafers are dissolved,and the wu¨rtzite structure of ZnO substrate for each sample remains unchanged and keeps in high c-axis preferential orientation.The degree of irradiation-induced crystal disorder reflected from the absorption band tail parameter(E0) is far greater for doped ZnO than the undoped one.Under the same doping concentration,the Cu-doped ZnO wafer has much higher irradiation-induced disorder than the Co-doped one.Photoluminescence measurements indicate that the introduction rate of both the zinc vacancy and the zinc interstitial is much higher for the doped ZnO wafer with a high doping level than the undoped one.In addition,both crystal lattice distortion and defect complexes are suggested to be formed in doped ZnO wafers.Consequently,the Co-or Cu-doped ZnO wafer(especially with a high doping level) exhibits very low radiation hardness compared with the undoped one,and the Cu-doped ZnO wafer is much less radiation-hard than the Co-doped one.