Effect of Hyperbranched Polyester on Modification of Epoxy Resins Cured with Anhydride

Epoxy resins are widely used in coatings, adhesives and polymer composites, but the applications of cured epoxy resins are often restricted by their poor toughness. HBP can be used as toughener to improve the toughness of epoxy resins due to its high-dens…     

STUDY ON THE EPOXY RESIN TOUGHENED BY HYDROXY-TERMINATED BUTADIENE-ACRYLONITRILE COPOLYMER

Toughened epoxy resin with excellent properties was obtained by adding organic acid anhydride curing agent and hydroxy-terminated butadiene-acrylonitrile copolymer (HTBN), which is cheaper than CTBN. The anhydride reacts with both epoxy groups on epoxy resin and hydroxyl groups on HTBN. As a result the soft long chains of HTBN and the rigid chain of epoxy resin form one network, giving the resin toughness. Two-phase structure of the toughened resin was observed by SEM and TEM.     

A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties

A phosphorus-containing oligomer, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized through the reaction of phenyl dichlorophosphate and 1,3-dihydroxybenzene, and characterized by elemental analysis, Fourier transform IR spectroscopy, and ¹H NMR and ³¹P NMR spectroscopy. Consequently, the phosphate-based epoxy resins with a phosphorus content of 1 and 2 wt % were prepared via the reaction of diglycidyl ether of bisphenol-A with BHPP and bisphenol-A, and were confirmed with Fourier transform IR spectroscopy and gel permeation chromatography. Phenolic melamine, Novolak, and dicyanodiamide were used as curing agents to prepare the thermoset resins with the control and the phosphate-based epoxy resins. Thermal properties and thermal degradation behavior of these thermoset resins were investigated by using differential scanning calorimetry and thermogravimetric analysis. The thermoset resins cured with phenolic melamine exhibited higher glass-transition temperatures than the other cured resins owing to the high rigidity of their molecular chain. Thermogravimetric analysis studies demonstrated that the decomposition temperatures of the thermoset resins cured with Novolak were higher than those of the others. A synergistic effect from the combination of the phosphate-based epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermoset resins.     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

用三乙胺盐酸盐对酚醛环氧树脂开环合成水溶性感光高分子的研究

用三乙胺盐酸盐与酚醛环氧树脂开环反应合成了一种水溶性聚合物，研究了相转移催化剂、反应时间、反应温度、开环顺序等条件对反应程度的影响。研究了开环反应中丙烯酸及三乙胺盐酸盐与酚醛环氧树脂的比例对产物的水溶性及感兴性能的影响。     

Determination of the Thermal Degradation Kinetic Parameters of Carbon Fibre Reinforced Epoxy Using TG

In this work, a kinetic study on the thermal degradation of carbon fibre reinforced epoxy is presented. The degradation is investigated by means of dynamic thermogravimetric analysis (TG) in air and inert atmosphere at heating rates from 0.5 to 20°C min⁻¹ . Curves obtained by TG in air are quite different from those obtained in nitrogen. A three-step loss is observed during dynamic TG in air while mass loss proceeded as a two step process in nitrogen at fast heating rate. To elucidate this difference, a kinetic analysis is carried on. A kinetic model described by the Kissinger method or by the Ozawa method gives the kinetic parameters of the composite decomposition. Apparent activation energy calculated by Kissinger method in oxidative atmosphere for each step is between 40–50 kJ mol⁻¹ upper than E _a calculated in inert atmosphere. The thermo-oxidative degradation illustrated by Ozawa method shows a stable apparent activation energy (E _a ≈130 kJ mol⁻¹ ) even though the thermal degradation in nitrogen flow presents a maximum E _a for 15% mass loss (E _a ≈60 kJ mol⁻¹ ). This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis and characterization of novel epoxy monomers and liquid crystal thermosets

Four new epoxy monomers have been synthesized and characterized as part of a program to prepare novel liquid crystal thermoset (LCT) materials. Three of the new epoxy monomers contained a biphenyl mesogen and were not liquid crystalline (LC). The remaining epoxy monomer, which contained a 1,4-dibenzoyloxybenzene mesogen, was synthesized in an overall yield of 30% and displayed a broad (83°C) nematic liquid crystalline phase. The new liquid crystalline epoxy monomer was cured at 120°C and postcured at 175°C with a stoichiometric amount of 1,4-phenylenediamine. The thermal transitions of the resulting LCT were studied by differential scanning calorimetry (DSC), polarized light optical microscopy (POM), thermomechanical analysis (TMA), and wide angle x-ray diffraction (WAXD) as a function of cure time and temperature. A process characterization diagram was constructed which shows that LCTs based on this new LC monomer can be processed in the liquid crystalline phase over a broad range of times and temperatures. Qualitative agreement with previous epoxy LCT results was found, as LCT's with smectic phases and without clearing temperatures were observed at long cure times (high crosslink densities), whereas nematic phases with clearing temperatures predominated in networks at short cure times (low crosslink densities). © 1993 John Wiley & Sons, Inc.     

Curing behavior and toughening performance of epoxy resins containing hyperbranched polyester

The effects of the hyperbranched polyester with hydroxyl end groups (HBPE‐OH) on the curing behavior and toughening performance of a commercial epoxy resin (diglycidyl ether of bisphenol A, DGEBA) were presented. The addition of HBPE‐OH into DGEBA strongly increased its curing rate and conversion of epoxide group due to the catalytic effect of hydroxyl groups in HBPE‐OH and the low viscosity of the blend at curing temperature. The improvements on impact strength and critical stress intensity factor (or fracture toughness, K_1c) were observed with adding HBPE‐OH. The impact strength was 8.04 kJ m^?1 when HBPE‐OH reached 15 wt% and the K_1c value was approximately two times the value of pure epoxy resin when HBPE‐OH content was 20 wt%. The morphology of the blends was also investigated, which indicated that HBPE‐OH particles, as a second phase in the epoxy matrix, combined with each other as the concentration of HBPE‐OH increased. Copyright © 2004 John Wiley & Sons, Ltd.     

Investigation of the Curing Mechanism in the GPTS/APTS Binder System

The acid catalyzed sol-gel reaction in the mixed binder system, 3-glycidoxypropyltrimethoxysilane (GPTS)/3-aminopropyltriethoxysilane (APTS) was investigated and one step and two step synthesis process were compared. Hydrolysis product was observed using the ¹H, ¹³C NMR and Raman spectra. Especially, based on the Raman spectra, epoxy ring opening was observed, varying the ratio of GPTS to APTS. The two step process made clear sol, while the one step process resulted in a milky suspension. According to the Raman spectra, the epoxy ring opening reaction kinetics proceeded slower in the two step process than one step process. Throughout the two step process, it was possible to apply the binder for the coating of substrate.     

Dielectric Loss and Electrical Conductivity Behaviors of Epoxy Composites Containing Semiconducting ZnO Varistor Particles

Polymer nanodielectrics render a great material platform for exhibiting the intrinsic nature of incorporated particles, particularly semiconducting types, and their interfaces with the polymer matrix. Incorporating the oxide fillers with higher loading percentages (>40 vol%) encounters particular challenges in terms of dispersion, homogeneous distribution, and porosity from the process. This work investigated the dielectric loss and electrical conduction behaviors of composites containing semiconducting ZnO varistor particles of various concentrations using the epoxy impregnation method. The ZnO varistor particles increased the dielectric permittivity, loss, and electrical conductivity of the epoxy composites into three different regimes (0–50 vol%, 50–70 vol%, 70–100 vol%), particularly under an electric bias field or at higher temperatures. For lower loading fractions below 50 vol%, the dielectric responses are dominated by the insulating epoxy matrix. When loading fractions are between 50 and 70 vol%, the dielectric and electric responses are mostly associated with the semiconducting interfaces of ZnO varistor particles and ZnO–epoxy. At above 70 vol%, the apparent increase in the dielectric loss and conductivity is primarily associated with the conducting ZnO core forming the interconnected channels of electric conduction. The foam-agent-assisted ZnO varistor particle framework appears to be a better way of fabricating composites of filler loading above 80 vol%. A physical model using an equivalent capacitor, diode, and resistor in the epoxy composites was proposed to explain the different property behaviors.