Improving dispersion and integration of single‐walled carbon nanotubes in epoxy composites by using a reactive noncovalent dispersant

Uniform dispersion and strong interfacial interaction are two critical prerequisites for application of single‐walled carbon nanotubes (SWNTs) in polymer composites. To endow the composites with multifunctional feature, no damage on the chemical/electronic structure of SWNTs is also usually required. With these ends in view, two epoxide‐containing pyrene derivatives (EpPys) were designed, synthesized, and used as reactive noncovalent dispersants for developing multifunctional epoxy/SWNT composites. One having longer chain length between epoxide group and pyrene moiety, that is, EpPy‐16, shows higher dispersing efficiency and provides the nanotube dispersion with better stability, thus picking up for subsequent studies. Systematic characterization on SWNT/EpPy‐16 hybrid demonstrates that 13.2 wt % of EpPy‐16 is adsorbed on the SWNT surface through strong π‐stacking interaction, and intrinsic electronic structure of SWNTs is basically reserved. The solution‐based process adopted here preserves the good SWNT dispersing state in dispersion into the composites. Simultaneously, enhanced interfacial interaction is also realized by using EpPy‐16, which interacts noncovalently with SWNT but connects covalently to epoxy network. As a result, the composites acquire 37 and 22% increments in tensile strength and Young's modulus, respectively, relative to that of neat resin. A low‐electrical percolation threshold of 0.1 wt % SWNTs and improved thermal properties were also observed. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Thermal properties and flame retardancy of novel epoxy based on phosphorus‐modified Schiff‐base

Through addition reaction of Schiff‐base terephthalylidene‐bis‐(p‐aminophenol) ( DP‐1 ) and diethyl phosphite (DEP), a novel phosphorus‐modified epoxy, 4,4'‐diglycidyl‐(terephthalylidene‐bis‐(p‐aminophenol))diphosphonate ether ( EP‐2 ), was obtained. An modification reaction between EP‐2 and DP‐1 resulted in an epoxy compound, EP‐3 , possessing both phosphonate groups and C?N imine groups. The structure of EP‐2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), ¹H, ¹³C, and ³¹P NMR analyses. The thermal properties of phosphorus‐modified epoxies cured with 4,4'‐diaminodiphenylmethane (MDA) and 4,4'‐diaminodiphenyl ether (DDE) were studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The activation energies of dynamic thermal degradation (E_d) were calculated using Kissinger and Ozawa's methods. The thermal degradation mechanism was characterized using thermogravimetric analysis/infrared spectrometry (TG‐IR). In addition, the flame retardancy of phosphorus‐modified epoxy thermosets was evaluated using limiting oxygen index (LOI) and UL‐94 vertical test methods. Via an ingenious design, phosphonate groups were successfully introduced into the backbone of the epoxies; the flame retardancy of phosphorus‐modified epoxy thermosets was distinctly improved. Due to incorporation of C?N imine group, the phosphorus‐modified epoxy thermosets exhibited high thermal stabilities; the values of glass‐transition temperatures (T_gs) were about 201–210°C, the values of E_d were about 220–490 kJ/mol and char yields at 700°C were 49–53% in nitrogen and 45–50% in air. These results showed an improvement in the thermal properties of phosphorus‐modified epoxy by the incorporation of C?N imine groups. Copyright © 2010 John Wiley & Sons, Ltd.     

Thermomechanical behaviors and dielectric properties of polyaniline‐doped para‐toluene sulfonic acid/epoxy resin composites

Composites based on conductive organic/inorganic fillers dispersed in insulating matrix have been widely investigated because of their widespread applications such as electromagnetic shielding, electrostatic discharge, and sensors. In this context, novel composite materials based on epoxy resin matrix charged with polyaniline (PANI)‐doped para‐toluene sulfonic acid were elaborated. Fourier transform infrared spectroscopy, X‐ray diffraction and scanning electron microscopy were used to check the structure and the morphology of the samples. Viscoelastic behavior and thermal stability of the composites were explored by dynamic mechanical thermal analysis and thermogravimetric analysis. It was shown that the PANI particles exhibited a partial crystalline structure and were homogeneously dispersed in epoxy matrix. Consequently, this structure affected the thermal stability and viscoelastic properties of the composites. Furthermore, the dielectric and electrical properties were investigated up to 1 MHz. Measurements of dielectric properties revealed that with loading fillers in matrix, the dielectric parameters increased to high values at low frequency then decreased at values around 40 and 32 of real and imaginary parts, respectively, at 1 MHz with 15% of PANI content. Copyright © 2011 John Wiley & Sons, Ltd.     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Studies on thermal and morphological properties of 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane-epoxy-bismaleimide matrices

A new cyanate ester monomer, 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane has been synthesized and characterized. Epoxy modified with 4, 8 and 12% (by weight) of cyanate ester were made using epoxy resin and 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane and cured by using diaminodiphenylmethane. The cyanate ester modified epoxy matrix systems were further modified with 4, 8 and 12% (by weight) of bismaleimide (N,N′-bismaleimido-4,4′-diphenylmethane). The formation of oxazolidinone and isocyanurate during cure reaction of epoxy and cyanate ester blend was confirmed by IR spectral studies. Bismaleimide-cyanate ester-epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. Thermal studies indicate that the introduction of cyanate ester into epoxy resin improves the thermal degradation studies at the expense of glass transition temperature. Whereas the incorporation of bismaleimide into epoxy resin enhances the thermal properties according to its percentage content. However, the introduction of both cyanate ester and bismaleimide influences the thermal properties according to their percentage content. DSC thermogram of cyanate ester modified epoxy and bismaleimide modified epoxy show unimodel reaction exotherms. The thermal degradation temperature and heat distortion temperature of the cured bismaleimide modified epoxy and cyanate ester-epoxy systems increased with increasing bismaleimide content. The morphology of the bismaleimide modified epoxy and cyanate ester-epoxy systems were also studied by scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

环氧琥珀酸(盐)测定方法探讨

本文以含0.1 mol/L盐酸的氯化镁饱和溶液为加成试剂,进行了环氧基测定的探讨,并考察了反应时间、反应温度对分析准确度的影响。实验结果标明,在反应温度60℃条件下,反应45 min后,分析相对误差降至1%以内;与离子色谱测定方法比较,其测定结果吻合,可用于工业化生产中环氧琥珀酸(盐)的测定。     

富勒烯化聚环氧丙基咔唑的合成与表征

通过Ｆｒｉｅｄｅｌ－Ｃｒｒａｆｔｓ反应制备了富勒烯化的聚环氧丙基咔唑，聚合物中Ｃ６０的含量最高可达７．６ｗｔ％。通过凝胶渗透色谱法测定了聚合物分子量，并采用＾上Ｈ和＾１３Ｃ－ＮＭＲ，ＩＲ，热分析及光谱等手段对其结构进行了分析与表征。     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002