Influences of increasing gate stem height on DC and RF performances of InAlAs/InGaAs InP-based HEMTs

The T-gate stem height of In Al As/In Ga As In P-based high electron mobility transistor(HEMT) is increased from165 nm to 250 nm. The influences of increasing the gate stem height on the direct current(DC) and radio frequency(RF)performances of device are investigated. A 120-nm-long gate, 250-nm-high gate stem device exhibits a higher threshold voltage(Vth) of 60 m V than a 120-nm-long gate devices with a short gate stem, caused by more Pt distributions on the gate foot edges of the high Ti/Pt/Au gate. The Pt distribution in Schottky contact metal is found to increase with the gate stem height or the gate length increasing, and thus enhancing the Schottky barrier height and expanding the gate length,which can be due to the increased internal tensile stress of Pt. The more Pt distributions for the high gate stem device also lead to more obvious Pt sinking, which reduces the distance between the gate and the In Ga As channel so that the transconductance(gm) of the high gate stem device is 70 m S/mm larger than that of the short stem device. As for the RF performances,the gate extrinsic parasitic capacitance decreases and the intrinsic transconductance increases after the gate stem height has been increased, so the RF performances of device are obviously improved. The high gate stem device yields a maximum ft of 270 GHz and fmax of 460 GHz, while the short gate stem device has a maximum ft of 240 GHz and the fmax of 370 GHz.     

Extrinsic equivalent circuit modeling of InP HEMTs based on full-wave electromagnetic simulation

With the widespread utilization of indium-phosphide-based high-electron-mobility transistors (InP HEMTs) in the millimeter-wave (mmW) band, the distributed and high-frequency parasitic coupling behavior of the device is particularly prominent. We present an InP HEMT extrinsic parasitic equivalent circuit, in which the conductance between the device electrodes and a new gate-drain mutual inductance term L_mgd are taken into account for the high-frequency magnetic field coupling between device electrodes. Based on the suggested parasitic equivalent circuit, through HFSS and advanced design system (ADS) co-simulation, the equivalent circuit parameters are directly extracted in the multi-step system. The HFSS simulation prediction, measurement data, and modeled frequency response are compared with each other to verify the feasibility of the extraction method and the accuracy of the equivalent circuit. The proposed model demonstrates the distributed and radio-frequency behavior of the device and solves the problem that the equivalent circuit parameters of the conventional InP HEMTs device are limited by the device model and inaccurate at high frequencies when being extracted.     

An electromagnetic simulation assisted small signal modeling method for InP double-heterojunction bipolar transistors

We present a convenient and practical electromagnetic (EM) assisted small-signal model extraction method for InP double-heterojunction bipolar transistors (DHBTs). Parasitic parameters of pad and electrode fingers are extracted by means of 3D EM simulation. The simulations with a new excitation scheme are closer to the actual on-wafer measurement conditions. Appropriate simulation settings are calibrated by comparing measurement and simulation of OPEN and SHORT structures. A simpler $\pi $-type topology is proposed for the intrinsic model, in which the base-collector resistance $R_\mu$, output resistance $R_{\rm ce}$ are deleted, and a capacitance $C_{\rm ce}$ is introduced to characterize the capacitive parasitic caused by the collector finger and emitter ground bar. The intrinsic parameters are all extracted by exact equations that are derived from rigorous mathematics. The method is characterized by its ease of implementation and the explicit physical meaning of extraction procedure. Experimental validations are performed at four biases for three InGaAs/InP HBT devices with $0.8\times 7 $μm, 0$.8\times 10 $μm and $0.8\times 15 $μm emitter, and quite good fitting results are obtained in the range of 0.1-50 GHz.     

A Physics-Based Charge-Control Model for InP DHBT Including Current-Blocking Effect

We develop a physies-based charge-control lnP double hereto junction bipolar transistor model including three important effects： current blocking, mobile-charge modulation of the base-collector capacitance and velocity-field modulation in the transit time. The bias-dependent base-collector depletion charge is obtained analytically, which takes into account the mobile-charge modulation. Then, a measurement based voltage-dependent transit time formulation is implemented. As a result, over a wide range of biases, the developed model shows good agreement between the modeled and measured S-parameters and cutoff frequency. Also, the model considering current blocking effect demonstrates more accurate prediction of the output characteristics than conventional vertical bipolar inter company results.     

Beam Steering Analysis in Optically Phased Vertical Cavity Surface Emitting Laser Array

Beam steering in implant defined coherently coupled vertical cavity surface emitting laser(VCSEL) arrays is simulated using the FDTD solution software. Angular deflection dependent on relative phase differences among elements, inter-element spacing, element size and emitted wavelength is analyzed detailedly and systematically.We design and fabricate 1×2 implant defined VCSEL arrays for optimum beam steering performance. Electronically controlled beam steering with a maximum deflection angle of 1.6° is successfully achieved in the 1×2 VCSEL arrays. The percentage of the power in the central lobe is above 39% when steering. The results show that the steering is controllable. Compared with other beam steering methods, the fabrication process is simple and of low cost.     

非应变盖层对应变结构中净应力的影响 *

分析了应变外延层中非应变盖层厚度和在应变层上下界面的失配位错数目差对净应力的影响 ,对现有的单结点和双结点位错模型的净应力的表达式进行了修正 ,得到一个能将单、双结点模型统一起来且对任意盖层厚度都适用的表达式 .从而进一步完善了描述应变外延层中失配位错的产生和运动机制的理论     

Enhancement of radiation hardness of InP-based HEMT with double Si-doped plane

An anti-radiation structure of In P-based high electron mobility transistor(HEMT) has been proposed and optimized with double Si-doped planes. The additional Si-doped plane under channel layer has made a huge promotion in channel current, transconductance, current gain cut-off frequency, and maximum oscillation frequency of In P-based HEMTs. Moreover, direct current(DC) and radio frequency(RF) characteristic properties and their reduction rates have been compared in detail between single Si-doped and double Si-doped structures after 75-keV proton irradiation with dose of 5× 10¹¹ cm^-2,1× 10¹² cm^-2, and 5× 10¹² cm^-2. DC and RF characteristics for both structures are observed to decrease gradually as irradiation dose rises, which particularly show a drastic drop at dose of 5× 10¹² cm^-2. Besides, characteristic degradation degree of the double Si-doped structure is significantly lower than that of the single Si-doped structure, especially at large proton irradiation dose. The enhancement of proton radiation tolerance by the insertion of another Si-doped plane could be accounted for the tremendously increased native carriers, which are bound to weaken substantially the carrier removal effect by irradiation-induced defects.     

非应变盖层的应变外延层结构中失配位错的分布

利用连续介质模型,计算有非应变盖层的应变外延层结构中单位面积的能量．引入上下界面失配位错数目的比例因子η,利用能量最低原理,求得η的表达式．研究表明,失配位错在上下界面的分布与应变的弛豫程度和盖层的厚度有关．随应变弛豫程度和非应变盖层厚度的增加,失配位错在上界面的数目增多,应变弛豫机制以单结点为主过渡到以双结点为主     

Characterization of low-resistance ohmic contacts to heavily carbon-doped n-type InGaAsBi films treated by rapid thermal annealing

Carbon-doped In Ga As Bi films on In P:Fe(100)substrates have been grown by gas source molecular beam epitaxy(GSMBE).The electrical properties and non-alloyed Ti/Pt/Au contact resistance of n-type carbon-doped In Ga As Bi films were characterized by Van der Pauw-Hall measurement and transmission line method(TLM)with and without rapid thermal annealing(RTA).It was found that the specific contact resistance decreases gradually with the increase of carrier concentration.The electron concentration exhibits a sharp increase,and the specific contact resistance shows a noticeable reduction after RTA.With RTA,the In Ga As Bi film grown under CBr4 supply pressure of 0.18 Torr exhibited a high electron concentration of 1.6×10²¹ cm^-3 and achieved an ultra-low specific contact resistance of 1×10^-8Ω·cm²,revealing that contact resistance depends greatly on the tunneling effect.     

Investigation of chlorine-based etchants in wet and dry etching technology for an InP planar Gunn diode

Mesa etching technology is considerably important in the Gunn diode fabrication process. In this paper we fabricate InP Gunn diodes with two different kinds of chlorine-based etchants for the mesa etching for comparative study. We use two chlorine-based etchants, one is HCl-based solution (HCl/H 3 PO 4 ), and the other is Cl 2 -based gas mixture by utilizing inductively coupled plasma system (ICP). The results show that the wet etching (HCl-based) offers low cost and approximately vertical sidewall, whilst ICP system (Cl 2 -based) offers an excellent and uniform vertical sidewall, and the over-etching is tiny on the top and the bottom of mesa. And the fabricated mesas of Gunn diodes have average etching rates of ～ 0.6 μm/min and ～ 1.2 μm/min, respectively. The measured data show that the current of Gunn diode by wet etching is lower than that by ICP, and the former has a higher threshold voltage. It provides a low-cost and reliable method which is potentially applied to the fabrication of chip terahertz sources.