Ti1—xAlxN涂层的组织结构及Al元素的作用机理

通过不同Al含量的Ti-Al粉末冶金靶,采用多孤离子镀技术制备了Ti1-xAlxN涂层。用SEM、XRD、GAXRD以及XTEM等手段研究了涂层的组织结构及Al元素的作用。研究表明,TiAlN涂层呈柱状多晶组织,（Ti,Al)N为涂层的主要组成相;随着Al含量的增加,涂层中的（Ti,Al)N相将减少,且其晶格常数将降低。     

氦离子注入4H-SiC晶体的纳米硬度研究

4H-SiC晶体经能量为100 keV,剂量为3×10¹⁶ cm^-2的氦离子高温（500 K）注入后,再在773—1273 K温度范围内进行了退火处理,最后使用纳米压痕仪测量了样品注入面的硬度.测试结果表明,在500—1273 K温度范围内样品的硬度随退火温度升高呈现先增大后减小再增大的趋势,其中773 K退火样品的硬度增大明显.分析认为,退火样品的硬度变化是由退火过程中缺陷复合与氦泡生长导致样品内部的Si—C键密度、键长和键角改变引起的. 关键词： SiC 注入 氦泡 纳米压痕     

94MeV Xe离子辐照引起的薄膜硅光学带隙变化研究

室温下,用94MeV的Xe离子辐照纳米晶和非晶硅薄膜以及单晶硅样品,辐照量分别为1.0×1011,1.0×1012和1.0×1013ions/cm2。所有样品均在室温下用UV/VIS/NIR光谱仪进行检测分析。通过对比研究了纳米晶、非晶、单晶硅样品的光学带隙随Xe离子辐照量的变化。结果表明,不同结构的硅材料中Xe离子辐照引起的光学带隙变化规律差异显著:随着Xe离子辐照量的增加,单晶硅的光学带隙基本不变,非晶硅薄膜的光学带隙由初始的约1.78eV逐渐减小到约1.54eV,而纳米晶硅薄膜的光学带隙则由初始的约1.50eV快速增大至约1.81eV,然后再减小至约1.67eV。对硅材料结构影响辐照效应的机理进行了初步探讨。     

等离子体增强化学气相沉积法制备氧化锌薄膜

通过引入金属有机源——二乙基锌和二氧化碳,用等离子体增强化学气相沉积(PECVD)的方法在低温下制备高质量(002)取向的氧化锌薄膜,详细研究了衬底温度对薄膜质量的影响.实验发现,衬底温度对氧化锌的取向性和晶粒的大小都有显著的影响.随着温度的提高,氧化锌的取向性增强,温度为230℃时得到单一(002)取向的六角结构的氧化锌薄膜,其XRD的半高宽为0.26.°从其透射谱可以观察到典型的激子吸收线,从光致发光谱上可以观察到一个强而窄(半高宽度大约为125 m eV)的3.26 eV紫外激子发射.     

基于HIRFL 的高温应力材料载能离子辐照实验装置

针对未来先进核能装置候选结构材料在高温和应力等条件下抗辐照性能的评价与快速筛选的需求,基于兰州重离子研究装置( HIRFL ) 可提供的离子束流条件,设计制作了国内第一套高温应力材料载能离子辐照装置。该装置由束流扫描及探测系统、高温系统、应力系统、真空冷却系统和远程控制系统等5 部分组成,可以同时提供高温和拉/ 压应力下材料的离子束均匀辐照件,温区覆盖了室温至1 200 °C范围,拉/ 压应力范围为0 ~1176 N,x-y 方向均匀扫描面积可大于40 mmx40 mm。利用该装置,已经成功进行了多次高温和应力条件下载能离子辐照先进核能装置候选材料的实验研究,并取得了初步成果。In order to expedite the evaluation of properties of irradiated materials and the selection of candidate materials for future nuclear energy systems, we developed a specific ion irradiation equipment installed on the Heavy Ion Research Facility of Lanzhou ( HIRFL ) for materials under high temperature and stress. This equipment consists of ion beam scanning and detector system, high temperature load system, stress load system, water cooling system as well as telecommunication and control system. It can supply a wide range of temperature (from room temperature to 1 200 °C ) and stress ( pull / push from 0 to 1 176 N) simultaneously for materials under ion irradiation. The x-y scanning area with high uniformity is larger than 40 mm40 mm. This is the first suit of ion irradiation equipment made in China that can be used to study co-operating effects of high temperature and stress in an irradiated material. It has been successfully used several times for materials irradiations under high temperatures and stress, which proved that the new equipment has very good performances in experiments.     

ZnO在辐射场中的光激发特性研究

采用密度泛函理论的BPV86方法, 在6-311G++(d, p)基组水平上优化了不同外电场(0～0.080 a.u.)下氧化锌分子的基态稳定构型, 在此基础上利用同样的方法计算了氧化锌分子的分子结构、偶极矩、总能量、能隙以及红外光谱和紫外-可见吸收光谱强度。结果表明, 在外电场的作用下, 分子结构变化明显, 与电场呈现强烈的依赖关系。随着正向外加电场的增加, ZnO分子键长一直在增大, 电偶极距也是一直增大, 分子总能量不断减小, 分子能隙不断减小, 红外光谱吸收峰出现红移现象。随着外电场的加强, 分子紫外可见吸收光谱振子强度先增大后减小再增大再减小反复变化, 其波峰则出现蓝移现象。     

DSP与CAN控制器的接口及实现

介绍了TI公司的TMS320C32DSP与PHILIPS公司的CAN控制器SJA1000的接口方法，并给出了具体的实现方法和软件编程。     

Study of He-induced nano-cavities as sinks of oxygen for forming silicon-on-insulator

In the present work, a Cz-Silicon wafer is implanted with helium ions to produce a buried porous layer, and then thermally annealed in a dry oxygen atmosphere to make oxygen transport into the cavities. The formation of the buried oxide layer in the case of internal oxidation （ITOX） of the buried porous layer of cavities in the silicon sample is studied by positron beam annihilation （PBA）. The cavities are formed by 15 keV He implantation at a fluence of 2×10^16 cm^-2 and followed by thermal annealing at 673 K for 30 min in vacuum. The internal oxidation is carried out at temperatures ranging from 1073 to 1473 K for 2 h in a dry oxygen atmosphere. The layered structures evolved in the silicon are detected by using the PBA and the thicknesses of their layers and nature are also investigated. It is found that rather high temperatures must be chosen to establish a sufficient flux of oxygen into the cavity layer. On the other hand high temperatures lead to coarsening the cavities and removing the cavity layer finally.     

Suppression of persistent photoconductivity in high gain Ga2O3 Schottky photodetectors

The defect-related photoconductivity gain and persistent photoconductivity (PPC) observed in Ga₂O₃ Schottky photodetectors lead to a contradiction between high responsivity and fast recovery speed. In this work, a metal-semiconductor-metal (MSM) Schottky photodetector, a unidirectional Schottky photodetector, and a photoconductor were constructed on Ga₂O₃ films. The MSM Schottky devices have high gain (> 13) and high responsivity (> 2.5 A/W) at 230-250 nm, as well as slow recovery speed caused by PPC. Interestingly, applying a positive pulse voltage to the reverse-biased Ga₂O₃/Au Schottky junction can effectively suppress the PPC in the photodetector, while maintaining high gain. The mechanisms of gain and PPC do not strictly follow the interface trap trapping holes or the self-trapped holes models, which is attributed to the correlation with ionized oxygen vacancies in the Schottky junction. The positive pulse voltage modulates the width of the Schottky junction to help quickly neutralize electrons and ionized oxygen vacancies. The realization of suppression PPC functions and the establishment of physical models will facilitate the realization of high responsivity and fast response Schottky devices.     

用FPGA实现数字逻辑分析仪设计

介绍采用FPGA设计数字逻辑分析仪的系统结构、硬件设计方法和计算机测试程序。结果表明,这种数字逻辑分析仪的性能优于普通示波器,其性能、价格比优于逻辑分析仪。