测定核黄素的化学发光新方法

研究了核黄素的化学发光性质，建立了一种测定核黄素的化学发光新方法，并应用于实际样品中核黄素的测定，与文献相比，本方法无需避光，而且分析体系和样品处理简单；干扰小，牛血清白蛋白、抗坏血酸、天冬氨酸等８种生物有机物质和 Ｃｕ（Ⅱ）、Ｚｎ（Ⅱ）、Ｆｅ（Ⅲ）等１５种常见金属离子的允许量较大；核黄素溶液浓度在０． １０～５０ ｍｇ／Ｌ范围内，与化学发光强度成正比，方法线性范围宽；测定１．０ｍｇ／Ｌ核黄素溶液１２次，求得相对标准偏差为２．９％，方法精密度高；方法的检测限为０．０７５ ｍｇ／Ｌ，灵敏度高。     

蔥与菲的激发等离子体质谱的分析和比较

蒽和菲是一对同分异构体,由于它们的结构都很稳定,所以在常规的电子轰击质谱中,它们的分子离子峰都很突出,两者的谱图没有明显的差异,不能成为一种鉴别手段.我们最近在自制的仪器上,记录了以近红外激光作用于这两个稠环芳香烃所产生的正负离子质谱,两者的谱图具有明显的不同,其中包含了较为丰富的结构信息,显示了这一研究手段的结构分析能力。     

锂离子选择性微电极在生物体液中的响应

最近几年已报道了几种锂离子选择性电极.本文作者曾研制了以苯基膦酸二辛酯(DOPP)为溶剂,四苯硼酸盐为活性物质的PVC膜锂离子选择电极.本文在此基础上研制了锂离子选择性微电极,比较了以四苯硼酸钾(KTPB)及四苯硼酸钠(NaTPB)为活性物质的锂微电极的性能.同时考察了微电极在细胞内液、血清及生理盐液中对锂离子的响应特性.     

Preparation and Crystal Structure of PrNb_5O_(14)

ＰｒｅｐａｒａｔｉｏｎａｎｄＣｒｙｓｔａｌＳｔｒｕｃｔｕｒｅｏｆＰｒＮｂ_５Ｏ_（１４）￥ＭａｏＪｉａｎｇ－Ｇａｏ；ＺｈｕａｎｇＨｏｎｇ－Ｈｕｉ；ＨｕａｎｇＪｉｎ－Ｓｈｕｎ（ＳｔａｔｅＫｅｙＬａｂｏｒａｔｏｒｙｏｆＳｔｒｕｃｔｕｒａｌＣｈｅｍｉｓｔｒｙ...     

Electrochemical study of bergenin on a poly(4-(2-pyridylazo)-resorcinol) modified glassy carbon electrode and its determination in tablets and urine

A very sensitive electroanalytical method was employed to determine bergenin in phosphate buffer with a pH of 6.0, bergenin was accumulated at a 4-(2-pyridylazo)-resorcinol (PAR) polymer film modified glassy carbon electrode (GCE) surface under the condition of open-circuit. In the following anodic sweep from −0.4 to 0.8 V, bergenin adsorbed at the PAR polymer film modified electrode surface, was oxidized and yielded a sensitive oxidation peak at 0.595 V. Due to its unique structure and extraordinary properties, the PAR polymer film shows higher accumulation efficiency toward bergenin compared with a bare GCE. Hence, the amount of bergenin at the PAR polymer film modified GCE surface increases significantly, and finally the oxidation peak current improves greatly. The experimental conditions, such as supporting electrolyte, pH value, accumulation time and scan rate, were optimized for the measurement of bergenin, and a sensitive electroanalytical method was proposed for bergenin determination. The oxidation peak current varies linearly with the concentration of bergenin over the range of 2.0 × 10⁻⁷ to 1.2 × 10⁻⁵ mol/L, and the detection limit is 2.0 × 10⁻⁸ mol/L after 3 min open-circuit accumulation. The relative standard deviation of the same electrode in 10 successive scans is 1.8% for 1.0 × 10⁻⁶ mol/L bergenin and 2.1% for interelectrodes, indicating excellent reproducibility. This new method was successfully demonstrated with bergenin tablets and diluted urine.     

The Aggregation Kinetics of Colloidal Particles of Basic Yttrium Carbonate

Studyofthegrowthprocessofcolloidalparticlesofnonequilibriumandirreversibilityisanactiveareaofresearch.Therecognitionofcolloidalaggregatesasfractalobjectshasinspiredalargenumberofexperimentalandtheoreticalstudiesonthestructuralandkineticaspectsofaggregationprocesses"'.Morerecently,kineticsofhematiteaggregationbypolyacrylicacidhavebeenstudiedbyzhangandBume3.Theprimaryhematiteparticleswerequiteuniformandfairlyspherical.Inthispaper,wewillreportthesizeevolutionoffractalaggregatesofinitiallypolydis…     

Oxidation resistant germanium nanowires: bulk synthesis, long chain alkanethiol functionalization, and Langmuir-Blodgett assembly

A simple method is developed to synthesize gram quantities of uniform Ge nanowires (GeNWs) by chemical vapor deposition on preformed, monodispersed seed particles loaded onto a high surface area silica support. Various chemical functionalization schemes are investigated to passivate the GeNW surfaces using alkanethiols and alkyl Grignard reactions. The stability of functionalization against oxidation of germanium for various alkyl chain lengths is elucidated by X-ray photoelectron spectroscopy. Among all schemes tested, long chain alkanethiols (> or = C12) are found to impart the most stable GeNW passivation against oxidation upon extended exposure to ambient air. Further, the chemically functionalized oxidation-resistant nanowires are soluble in organic solvents and can be readily assembled into close-packed Langmuir-Blodgett films potentially useful for future high performance electronic devices.     

ATMP(氨基三甲叉膦酸)及其顺磁性Co(Ⅱ)配合物的核磁共振研究

本文用¹H、³¹P和¹³C核磁共振谱研究了ATMP(氨基三甲叉膦酸,以简式H₆L表示)及其顺磁性Co(Ⅱ)配合物。测定了不同C_co/C_ATMP摩尔比在不同pH值下的各向同性位移。定性地讨论顺磁性Co(Ⅱ)配合物在不同pH条件下的组成、电荷和空间构型变化对化学位移的影响。运用快速交换反应中化学位移与配合物浓度的关系,确定不同pH下的条件稳定常数。     

Design of a novel chip on glass package solution for CMOS image sensor device

This paper presents a chip-on-glass (COG) package solution for CMOS image sensors based on highly precise and reliable bumping and flip-chip bonding techniques. The package is fabricated using three core techniques, namely the damage-free image sensor bumping technique, the wafer form glass substrate patterned technique, and the damage-free flip-chip bonding technique. Since the proposed package concept is new, the effects of the package geometry and material properties on the package reliability are uncertain in the initial design stage. A three-dimensional nonlinear finite element model of the proposed CMOS image sensor package is created. In the simulations, the applied thermal load is cooled from 200 °C to ambient temperature (25 °C) to model the thermal deformation and warpage of the package during the practical ACF assembly cooling process. The design parameters influencing the reliability of the package, i.e. the material properties of the ACF, the thickness of the image chip and the thickness of the optical glass are investigated. Two control levels are specified for the chip, glass, and ACF factors and a 2³ factorial design is created to determine the appropriate combination of material properties and geometric size. It is found that the glass thickness and the ACF properties significantly affect the thermal deformation of the package, while the chip and glass factors, and the interaction between them, significantly affect the warpage. Regression models are developed to perform a series of surface response simulations. Using the developed statistical tests and regression models, suitable material selection criteria and geometric sizes can be specified to satisfy various reliability considerations in the initial design stage.