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81.
文章从经典的模糊C均值算法开始通过改变其中相似性的度量形式,介绍了一种模糊C球壳聚类(FCSS)算法。在将该算法应用于细胞显微图像半径统计时,采用基于形态学的图像预处理措施,可以获得FCSS算法中有关原型模式的知识,加快收敛速度并避免随机初始化造成的局部极小问题。 相似文献
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83.
Xiangdong Xu Hockleong Kweh Zhengcao Zhang Zhihong Liu Wei Zhou Wei Zhang Peixin Qian 《Applied Surface Science》2006,252(20):7594-7598
Large-scale preparation of thin strain-relaxed SiGe is achieved by combining ion implantation and ultrahigh vacuum chemical vapor deposition. The resulting materials were analyzed by double crystal X-ray diffraction, micro-Raman spectroscopy, and tapping mode atomic force microscope. Results revealed that 100-nm-thick Si0.7Ge0.3 layers with the diameter of 125 mm and full strain relaxation are successfully prepared by pre-modifying the Si substrates using 50 keV Ar+ ions. The strain relaxation is also disclosed to change with both ion species and energy. However, post-modification of SiGe by ion implantation will cause serious damage to the crystal structures, and result in the formation of poly-crystal SiGe. 相似文献
84.
提出一种极近距离雷达概念,并导出其作用距离公式,在此基础上研制出一台3mm波段极近距离多普勒雷达样机.试验结果表明该雷达结构简单,成本低廉,在作用距离为零点几米至几米范围内可获得较高的定距精度. 相似文献
85.
铁电致冷材料及其应用 总被引:4,自引:1,他引:3
利用铁电材料的电热效应(即逆热释电效应)可以制作新型致冷器。近年的研究进展表明,铁电致冷有可能发展成为一种新型的室温致冷技术。本文扼要介绍了铁电致冷的基本原理、可行性,以及铁电致冷材料和相关技术的发展,并展望了铁电致冷材料的发展前景。 相似文献
86.
Chan C.C. Zheng Ming Zhao Qian C. Meng S. 《Industrial Electronics, IEEE Transactions on》2002,49(6):1342-1344
Based on the concepts of cascade multilevel converters and one-cycle technique, comparisons are conducted to characterize the distortion of the pulsewidth modulation (PWM) and one-cycle control methods that were applied to converters. Simulation results for the different control schemes are obtained in PSIM software initially to see the effect of one-cycle control different from that of PWM control. Through the comparisons, the advantages and disadvantages are identified for each method. The one-cycle scheme is better than PWM control in reducing undesirable harmonics and tracing dynamic waveforms. Simulation and experimental results are also provided to verify the conclusions. 相似文献
87.
Leung V.C.M. Qian N. Malyan A.D. Donaldson R.W. 《Selected Areas in Communications, IEEE Journal on》1994,12(8):1376-1388
A distributed circuit-switched approach for supporting the deployment of high speed wireless personal communication services in urban areas through the interconnection of base stations via metropolitan area networks (MANs) is proposed. Broadband MANs minimize traffic congestion by dynamic sharing of link capacity and by serving as distributed switches for partitioning call control functions. While the DQDB protocol readily supports distributed packet-switching over the IEEE 802.6 MAN, isochronous traffic such as voice and video is best supported by circuit-switched connections. The authors present an enhanced bi-state pre-arbitrated (PA) transport mechanism, and associated call control and handoff management techniques, which enable distributed circuit-switching over the MAN. These capabilities are not currently addressed in the 802.6 standards. The bi-state PA transport mechanism facilitates statistical multiplexing of variable rate isochronous traffic sources. The network capacity is constrained by the call setup delay performance, and is analyzed by simulations. Alternative signaling architectures, involving different placements of call control network elements, are evaluated. The effects of erasure nodes, and close bus versus open bus architectures, are considered. The overlap inter-MAN call setup procedure is proposed to reduce delays. Different call handoff procedures are formulated according to the type of handoff and the resulting change in call connectivity. Most handoffs are intra-MAN, requiring simple procedures with short delays 相似文献
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As a room temperature bonding method, surface activated bonding (SAB) method has been introduced to be one of the most appropriate interconnection methods for the next generation of electronic packaging. Thus it is important to study the reliability of SAB interconnection in long term life test.In this paper, interconnections of Au bump and Cu film bonded by SAB method were performed in high temperature thermal aging test. Degradation of properties such as electrical resistance, shear strength of bump and interface microstructure during aging process were studied to investigate the failure mechanism of the interconnection. Intermetallic compound Cu3Au was found formed at the interface during thermal aging, and it causes evolvement of the properties and failure mode of the interconnection changing in shear test. Results reveal that SAB is suitable for the interconnection between Au bump and Cu film and it is reliable in thermal reliability test. 相似文献