微杯电子纸及其后加工制程

SiPix利用独特的微杯(Microcup)结构和顶部灌注封装技术，通过连续整卷高速涂布的制程成功地制造出高性能的双稳性、装填电泳微粒的电子纸。SiPix可提供下列两种规格形式任意的EPD卷式成品：(A)用于有源矩阵EPD和直接驱动产品的可剥离保护膜／已灌装及密封的Microcup／无图案导体膜夹层卷；及（P）用于无源矩阵的行导体膜／已灌装及密封的Microcup／列导体膜夹层卷。已经开发出将EPD卷制成不同的显示模块或产品的简单的后续加工制程。     

分布式无线传感器网络通信协议研究

在归纳分布式无线传感器网络研究进展的基础上，给出了综合分布式无线传感器网络技术各个方面的协议体系结构，并在新的体系结构下，系统地阐述了分布式无线传感器网络通信协议研究的进展，介绍了典型的应用案例和国外相关计划的研究情况。最后，指明了这一处于发展初期的研究领域的未来发展方向。     

Performance of Indoor Infrared Wireless CDMA Systems with Angle Diversity

Indoor infrared communication systems is one of the possible ways of offering data rates in excess of 100 Mbit/s without the need for wiring. Multiple users can share an infrared channel by code division-multiple access (CDMA) techniques. However, the CDMA system performance is limited by both background noise and co-channel interference. In this paper we study the use of angle diversity for mitigating the effects of the noise and interference. The system considered uses on-off shift keying modulation with multibeam transmitters and imaging receivers. The overall system performance for different diversity combining techniques is evaluated and compared to a system without diversity. Numerical results for a 2-user CDMA system indicate that signal to noise and interference ratio (SNIR) improvement (over systems with no diversity) of 5 dB is obtained for at least 50% of an ensemble of 10000 sample evaluations. The generalized selection combining (GSC)--a new diversity technique yet to be implemented for infrared systems--offers the best performance even with its reduced complexity.     

16信道0.35μmCMOS/VCSEL光发射模块

研究了垂直腔面发射激光器 (VCSEL)及其列阵器件的光谱特性、调制特性、高频特性及与微电子电路的兼容性 ,将 1× 16的VCSEL与CMOS专用集成电路进行多芯片组装 (MCM ) ,混合集成为 16信道VCSEL光发射功能模块 .测试过程中 ,功能模块的光电特性及其均匀性良好 ,测量的 - 3dB频带宽度大于 2GHz.     

Hf-doped and NH/sub 3/-nitrided high-K gate dielectric thin film with least drain current degradation and flatband voltage shift

A novel technique to form high-K dielectric of HfSiON by doping base oxide with Hf and nitridation with NH/sub 3/, sequentially, is proposed. The HfSiON gate dielectric demonstrates excellent device performances such as only 10% degradation of saturation drain current and almost 45 times of magnitude reduction in gate leakage compared with conventional SiO/sub 2/ gate at the approximately same equivalent oxide thickness. Additionally, negligible flatband voltage shift is achieved with this technique. Time-dependent dielectric breakdown tests indicate that the lifetime of HfSiON is longer than 10 years at V/sub dd/=2 V.     

激光熔覆专用铁基合金粉末的研究进展

指出了目前防止熔覆层开裂所采取的主要措施中存在的问题,阐述了激光熔覆和热喷涂对于所用合金粉末性能要求之异同,评述了激光熔覆专用铁基合金粉末的研制现状,提出了成分与组织设计的新思想。     

Micromachining of circular ring microstructure by femtosecond laser pulses

In this paper, integration of interference phenomenon into femtosecond laser micromachining was reported as the femtosecond laser pulses were reshaped spatially to perform ablation. The generation of circular interference pattern was demonstrated by overlapping infrared femtosecond laser pulses. The interference pattern was subsequently focused on a copper substrate to ablate microstructures of concentric circular rings. The present technique is expected to open up new applications in the areas of rapid fabrication of micro-Fresnel lenses, hybrid microlenses and lens arrays.     

CPL冷凝单管融化过程的双倒易边界元分析

1引言CPL（毛细泵两相流回路）能传输较高的热负荷，而且不需要循环泵、阀门等运动部件，重量轻可靠性好；在飞行器热控制方面有很好的应用前景[1]。CPL在恶劣的空间环境中运行，需要防止工作介质出现冷冻，为此，我们已经用解析[2]和数值的方法[3]进行了初步的分析，得到了一些可供工程设计参考应用的结果。另外，在恶劣的空间环境中，如果出现冻结，需要融化起动，热管的安全设计需要研究它的融化特性，以确保热管在空间能正常运行。双倒易边界元方法用Laplace基本解[4]，通过对一类偏微分方程两侧进行转化，将它全部转化为纯边界积分…     

LDD方法在提高电路工作电压中的应用研究

研究了利用轻掺杂漏结构来制作高电源电压器件的工艺方法。分析了ＬＤＤ结构参数对器件击穿特性的影响，并结合实验结果对Ｎ＾－区的注入剂量，长度及引入的串联电阻进行了优化设计。     

工艺因素对金属封装外引线弯曲疲劳的影响

考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。