关于我省数字化城市建设的几点思考

通过对国内外数字化城市建设现状的分析 ,结合我省实际情况 ,提出我省建设数字化城市的对策及建设内容和原则 ,强调政府的组织行为 ,发挥社会各界的积极性 ,充分利用现有资源 ,以建设数字化城市门户网站为先导 ,快速启动全省数字化城市建设。     

多带抗噪声语音识别算法研究

根据Flether等人的研究,基于感知独立性假设的子带识别方法被用于抗噪声鲁棒语音识别。本文拓展子带方法,采用基于噪声污染假定的多带框架来减少噪声影响。论文不仅从理论上分析了噪声污染假定多带框架在识别性能上的潜在优势,而且提出了多带环境下的鲁棒语音识别算法。研究表明：多带框架不仅回避了独立感知假设要求,而且与子带方法相比,多带方法能更好的减少噪声影响,提高系统识别性能。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于CB的串行口和接口板端口程序应用

串行口及接口板端口是计算机通信的主要途径 ,也是目前计算机工程测控中通用的基本方法。C Builder (简称CB)编程语言以其功能完备、开发效率高的特点而成为目前流行的程序开发工具 ,介绍了利用CB语言编写串行口和端口通信的程序的方法 ,并对具体的各方法编写了相应的示例。     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

Blind feedforward cyclostationarity-based timing estimation for linear modulations

By exploiting a general cyclostationary (CS) statistics-based framework, this letter develops a rigorous and unified asymptotic (large sample) performance analysis setup for a class of blind feedforward timing epoch estimators for linear modulations transmitted through time nonselective flat-fading channels. Within the proposed CS framework, it is shown that several estimators proposed in the literature can be asymptotically interpreted as maximum likelihood (ML) estimators applied on a (sub)set of the second- (and/or higher) order statistics of the received signal. The asymptotic variance of these ML estimators is established in closed-form expression and compared with the modified Crame/spl acute/r-Rao bound. It is shown that the timing estimator proposed by Oerder and Meyr achieves asymptotically the best performance in the class of estimators which exploit all the second-order statistics of the received signal, and its performance is insensitive to oversampling rates P as long as P/spl ges/3. Further, an asymptotically best consistent estimator, which achieves the lowest asymptotic variance among all the possible estimators that can be derived by exploiting jointly the second- and fourth-order statistics of the received signal, is also proposed.     

热作模具钢表面激光堆焊耐磨合金层的研究

本文主要通过在H13钢上用大功率CO_2激光束进行堆焊,阐述了激光堆焊工艺变化对堆焊组织和性能的影响,在本试验条件下,得到了高密度弥散金属化合物组织的激光堆焊层,平均硬度为HV800,与基体呈冶金结合,耐磨性比H13模具钢提高149%。     

MIM隧道发光结的负阻现象

本文介绍了薄膜隧道发光结的基本结构、发光机理，阐述了其Ｉ－Ｖ特性中的负阻现象。简单介绍了ＭＩＭ结构负阻的几种解释，根据热像仪照片和低温测试结果分析，再结合Ｄｅａｒｍａｌｅｙ导电模型，我们提出了ＭＩＭ负阻的物理模型，理论与实验符合较好，最后分析了负阻现象的应用前景。     

用于提高国产氩离子激光器相干长度的相干扩展器

本文报导了最近研制成功的用于提高国产氩离子激光器相干长度的相干扩展器。利用这种基于F-P理论的相干扩展器可以使国产氩离子激光器的相干长度由不足5cm一下提高到m的量级,功率损耗在25%～40%之间,有着很好的应用前景。