Synthesis and magnetic properties of multilayer Ni/Cu and NiFe/Cu nanowires

Highly ordered composite nanowires with multilayer Ni/Cu and NiFe/Cu have been fabricated by pulsed electrodeposition into nanoporous alumina membrane. The diameter of wires can be easily varied by pore size of alumina, ranging from 30 to 100 nm. The applied potential and the duration of each potential square pulse determine the thickness of the metal layers. The nanowires have been characterized by transmission electron microscopy (TEM), magnetic force microscopy (MFM), and vibrating sample magnetometer (VSM) measurements. The MFM images indicate that every ferromagnetic layer separated by Cu layer was present as single isolated domain-like magnet. This technique has potential use in the measurement and application of magnetic nanodevices.     

Wide-band fiber optic signal processor

Operation of a 16-tap fiber-optic delay line configured as a bandpass filter with a fundamental frequency of 2.0 GHz over the frequency range from 0 to 12.5 GHz is discussed. Equal tap weights and spacings were used to facilitate comparison of experimental and predicted results. More than 10¹¹ analog multiplications per second are performed in this relatively simple signal processing system. Other processors for performing functions such as matched filtering and correlation can be implemented by appropriate choice of the mirror reflectances and fiber lengths     

Particle size analysis by sedimentation field flow fractionation. Performance and application

Recently commercial equipment using sedimentation field flow fractionation (SFFF) has become available for analysis of particulate materials in the sub-micron range. This paper describes the DuPont instrument and discusses its performance. A particular study is described on the comparison of the SFFF technique with that of quasi-elastic light scattering (QELS). The paper concludes that the instrument is capable of measuring particle size distributions with high resolution and precision, provided that no particles above the upper size limit — about 1 μm — are present.     

Spurenbestimmung von Blei, Cadmium und Mangan in Honigen und Zuckern

Ohne Zusammenfassung

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Trace analysis of lead, cadmium and manganese in honey and sugar

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Wir danken dem Fonds der Chemischen Industrie für finanzielle Unterstützung.     

Annealing and measurement temperature dependence of W2B5-based rectifying contacts to n-GaN

The thermal stability and measurement temperature dependence of Schottky contact characteristics on n-GaN using a W₂B₅/Ti/Au metallization scheme was studied using current-voltage (I-V), scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) measurements. The elemental profile obtained from samples annealed at 350 °C showed some titanium diffusion into the gold layer but little other difference from the as-deposited wafer. Annealing at 700 °C produced significant diffusion of titanium. The Schottky barrier height increased with anneal temperature up to 200 °C, reaching a maximum value of 0.65 eV, but decreased at higher annealing temperatures. The reverse breakdown voltage from diodes fabricated using the W₂B₅-based contacts showed a similar dependence. The reverse current magnitude was larger than predicted by thermionic emission alone. The barrier height showed only minor changes with measurement temperature up to 150 °C.     

Hydrogen ion source with a cold magnetron cathode and magnetic plasma compression

A hydrogen ion source designed for the injector of a 16-MeV linear proton accelerator with an average beam current of ∼100 μA is presented. New design approaches allowing an improvement in the operating parameters of the ion source are proposed. The results of experimental tests of a source prototype operating in a pulsed mode with a repetition rate of 1–10 Hz and pulse duration of 100–600 μs are described.     

Adhesion of polyimide films to microelectronic article components

Reactions between polypyromellitamido acid and component materials of microelectronic articles were examined by thermogravimetric analysis. Modes of modification of the surfaces of semiconductor structures to be used in formation of a system of interconnections with polyimide as interlayer insulator to obtain a high adhesion between the layers via their chemical reactions.