泛代数的二次扩张

在本文中引入了泛代数的二次扩张的概念，解决了ＴＵ－ＥＣ（Ａ）和ＵＴ－ＥＣ（Ａ）的存在、真类和基数问题，范畴ＴＵ－ＥＣ（Ａ）（及ＵＴ－ＥＣ（Ａ）），并得到了有关二次扩张的几个同构定理，还对一点二次扩张作了讨论。     

Crystallization process of Bi(Pb)-Sr-Ca-Cu-O glass

A crystallization study has been carried out for rapidly solidified Bi₂Pb_0.5Sr₂Ca₄Cu₅O_x glass. Glass transition temperature T _g, crystallized superconducting phases and microstructural changes were measured and analysed by differential thermal analysis (DTA), X-ray diffraction (XRD), and scanning electron microscopy (SEM). The crystallization mechanism of the three superconducting phases — (2201) 20 K phase, (2212) 80 K phase, and (2223) 110 K phase — has been discussed, and a time-temperature-transformation diagram for the glass has been constructed.     

Characteristic of a broadband Ti:LiNbO3 optical modulator with buried electrodes and etched grooves in the buffer layer

Traveling wave Ti:LiNbO₃ Mach-Zehnder optical modulators with buried electrodes and etched grooves in the SiO₂ buffer layer are analyzed by the finite element method. The tradeoff between the bandwidth BW and the half-wave voltage Vπ is discussed. The value of BW/Vπ is used to weight the total performance of the modulator. Taking a thick buffer layer and etching deep grooves in the buffer layer are demonstrated as two effective methods to improve the performance of the modulator. A 3-dB optical bandwidth of 18 GHz with half-wave voltage 5V at a wavelength of 1.55 pm could be obtained even though the electrode is not very thick. When the requirement of half-wave voltage is not very critical, a bandwidth of more than 100 GHz can be obtained.     

生物小分子与铜锌超氧化物歧化酶相互作用的波谱学研究及其应用

本工作以ESR和NMR为主要手段,并结合其它生化方法,考察了氨基酸、核酸碱基、糖等生命基本物质,和抗坏血酸等生命必需物质与钢锌超氧化物歧化酶的相互作用,实验观测到氨基酸、核酸碱基和抗坏血酸在水溶液中可以与酶中的Cu²⁺作用而使其脱离活性部位,以小分子络合物形式游离在溶液中,同时使酶失活,脱离活性部位的Cu²⁺的比例和酶的失活程度取决于小分子配体的加入量及其与Cu²⁺的络合能力。此外,首次尝试使用ESR方法,并借助氨基酸与酶的作用,考察了铜锌超氧化物歧化酶在盐酸胍变性和热变性过程中的构象变化行为,结果表明这一方法是直观而有效的。     

IS—95CDMA系统的容量分析

容量的需求是推动ＣＤＭＡ数字蜂窝移动通信开发的主要动力。系统的容量受许多因素的影响，本文针对ＩＳ－９５ＣＤＭＡ系统在采用了功率控制、话音激活和扇区划分技术的情况下，对系统的容量进行了分析，同时也分析了功率控制精度对容量的影响。     

语音时域分割研究

在语音时域挑选剩余可懂度低的可用置换集合,置换集合是语音TDS系统中不可缺少的重要环节,本文给出了可用置换选取的条件、客观评价标准和方法。     

在（311）面上所生长的Al_xGa_（1－x）As／GaAs单量子阱特性

文章报道了用分子束外延（ＭＢＥ）法在６００℃和６５０℃下，在Ｓｉ掺杂的ＧａＡｓ衬底的（３１１）Ａ和（３１１）Ｂ面上成功地生长了高质量的ＡｌｘＧａ１－Ａｓ／ＧａＡｓ单量子阱材料。计算了光荧光（ＰＬ）峰值能量，并与实验作了比较。讨论了（３１１）Ａ和（３１１）Ｂ面上的不同生长特性。     

The effects of plasma etching induced gate oxide degradation onMOSFET's 1/f noise

The effects of the plasma etching process induced gate oxide damages on device's low frequency noise behavior are investigated on MOSFET's fabricated with different field plate perimeter to gate area ratio antennas. Abnormal 1/f noise spectrum with a shoulder centered in the frequency range of 100 and to 1 kHz was frequently observed in small geometry devices, and it is attributable to a nonuniform distribution of oxide traps induced by plasma etching process     

中子辐照对Pd80Si20与Pd77.5Cu6Si16.5非晶态合金结构的影响

本工作用X射线衍射技术示差扫描量热法(DSC)和内耗测量等手段研究金属-类金属非晶态合金Pd₈₀Si₂₀和Pd_77.5Cu₆Si_16.5中子辐照前后的微观结构变化。结果表明,辐照在两种样品的对关联函数g(r)以及径向分布函数RDF(r)上都引起明显的变化;辐照后样品的晶化温度和晶化热有所提高,结构变得更加无序,Pd₈₀Si₂₀非晶态合金的内耗在T关键词：     

Plasma immersion ion implantation for SOI synthesis: SIMOX and ion-cut

We have demonstrated feasibility to form silicon-on-insulator (SOI) substrates using plasma immersion ion implantation (PIII) for both separation by implantation of oxygen and ion-cut. This high throughput technique can substantially lower the high cost of SOI substrates due to the simpler implanter design as well as ease of maintenance. For separation by plasma implantation of oxygen wafers, secondary ion mass spectrometry analysis and cross-sectional transmission electron micrographs show continuous buried oxide formation under a single-crystal silicon overlayer with sharp Si/SiO₂ interfaces after oxygen plasma implantation and high-temperature (1300°C) annealing. Ion-cut SOI wafer fabrication technique is implemented for the first time using PIII. The hydrogen plasma can be optimized so that only one ion species is dominant in concentration and there are minimal effects by other residual ions on the ion-cut process. The physical mechanism of hydrogen induced silicon surface layer cleavage has been investigated. An ideal gas law model of the microcavity internal pressure combined with a two-dimensional finite element fracture mechanics model is used to approximate the fracture driving force which is sufficient to overcome the silicon fracture resistance.