On the performance of band-limited asynchronous DS-CDMA over nakagami-m channels

In this paper we investigated the BER performance of DS-CDMA using various chip-waveforms, which include three time-limited chip-waveforms and two band-limited chip-waveforms. Closed-form formulae were derived for evaluating the achievable bit-error rate performance with the aid of the standard Gaussian approximation, when communicating over a Nakagami-m channel. The time-limited waveforms impose a low implementational complexity, since they maybe over sampled and read from a look-up table. However, they are outperformed by the frequency-domain raised-cosine waveform as well as the optimum waveform specifically designed by Cho and Lehnert for achieving the lowest possible bit error rate     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

单向实时数字视频传输中帧同步锁定技术研究

提出一种适用于单向实时数字视频传输系统的帧同步锁定方案。其方法在接收端采用本地参考时钟、状态机、锁相环，并结合CIMT编码方式实现系统自动维持帧同步锁定，而无需周期性加入帧同步码。对该帧同步锁定方案与周期性加入帧同步码强制锁定方案进行性能比较．并将其应用到单向实时数字视频光纤传输系统中。实验证明，系统自动实现帧同步锁定的方案是单向实时数字视频传输系统实现帧同步锁定的最佳方案。     

微流控分析芯片制作中的低温键合技术

微流控分析芯片制作方法的研究是微流控分析的基础。制作性能良好的微流控分析芯片时,基片与盖片的键合技术十分重要。本文针对近年来发展迅速的低温键合技术,对各种方法进行了评价,并对其发展前景进行了展望。     

一种用于TCP/IP减荷的体系结构

TCP/IP减荷的目的是为了将系统主处理器从用于协议处理的繁重的内核中断服务中解脱出来。笔者从对TCP/IP减荷的需求出发,分析了TCP/IP减荷在设计方面的要求,进而提出了一种用于TCP/IP减荷的体系结构。     

玻璃微珠的表面化学镀银及红外辐射性能研究

采用化学镀方法在玻璃微珠表面镀银,考察了预处理条件、反应温度和反应时间等因素对玻璃微珠表面镀银的影响,并通过扫描电镜和X-射线衍射分析仪,对镀银后玻璃微珠的表面形貌和结构进行了观察和表征。将镀银玻璃微珠用于涂料中,考察了玻璃微珠在涂料中的应用及其红外辐射率的变化,探讨了化学镀条件对涂料红外辐射率的影响,结果表明,在控制反应温度和浓度的条件下,可使镀银玻璃微珠的红外辐射率由原来的1.02降为0.70,将其应用于涂料后,涂层的红外辐射率为0.80。     

A dual-mode bandpass filter with enhanced capacitive perturbation

A dual-mode ring bandpass filter with two pairs of capacitors has been designed. The capacitors are used to control the location of the even- and odd-mode frequencies independently, allowing weak coupling for narrow-band filter design with realizable capacitance values. Theoretical expressions have been derived for these frequencies. A 4% bandwidth bandpass filter centered at 1.9 GHz was designed and tested with good agreement between theoretical and measured results.     

大规模定制环境下 ERP 的发展

ERP─EnterpriseResourcePlanning企业资源计划系统 ,是指建立在信息技术基础上 ,以系统化的管理思想 ,为现代企业决策层及员工提供决策运行手段的管理平台。从竞争环境的角度出发 ,提出了大规模定制已经逐渐成熟并最终取代大规模生产成为新的生产经营模式的观点 ,同时 ,分析了在大规模定制下传统ERP的局限 ,从管理和技术的角度探讨新一代ERP的特点及发展。     

电视电缆故障点的确定

根据惠斯通电桥工作原理，采用回路法可以简便快捷地确定电视地下电缆接地、短路故障点的位置。电容法也是一种常用的检查开路的检测方法。这样维修人员可以迅速排除故障，保证电视节目的正常传送。