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51.
本文对前缘弯掠斜流转子叶顶间隙内的流动特性进行了数值分析。结果表明:叶顶间隙气流与主流发生卷吸而生成泄漏涡。泄漏涡作用的区域具有较低的压力分布。在叶片通道内,泄漏涡沿着与转子旋向相反的方向朝相邻叶片的压力面移动。大间隙时的泄漏涡比小间隙时强烈。低流量时泄漏涡的作用区域比高流量时大。在各种流量特性下,叶顶尾缘近吸力面区域都存在着二次间隙流。  相似文献   
52.
具P-Laplacian算子型周期边值问题解的存在性   总被引:8,自引:0,他引:8  
本文利用拓扑度理论和一些分析技巧讨论了具p—Laplacian算子型周期边值问题(φp(χ’))’+d/dt gradF(χ)+gradG(χ)=e(t),χ(0)=χ(T),χ’(0)=χ’(T)解的存在性,在对阻尼项d/dtgradF(χ)没有任何限制的前提下,给出了解存在的充分条件.  相似文献   
53.
Wang  Qing-Lun  Zhao  Bin  Liao  Dai-Zheng  Yan  Shi-Ping  Cheng  Peng  Jiang  Zong-Hui 《Transition Metal Chemistry》2003,28(3):326-330
The copper(II) complex Na2[Cu(pba)] · 6H2O has been synthesized and its structure determined. It consists of a novel two-dimensional network of [Cu(pba)]2– anions connected to each other through the sodium ion as a bridge. Spectroscopic and magnetic properties have been measured and a spin distribution calculation has been carried out with the GAUSSIAN-94. Theoretical calculations indicate the rather larger spin density on nitrogen atoms should be responsible for the satellite lines appearing beside the main hyperfine coupling signs of copper(II). The antiferromagnetic interaction may be due to the intermolecular interaction and/or different copper(II) ions through the Na+ bridge in the same layer.  相似文献   
54.
浮栅ROM器件辐射效应机理分析   总被引:1,自引:0,他引:1       下载免费PDF全文
分析了浮栅ROM器件的辐射效应机理,合理地解释了实验中观察到的现象.指出辐射产生的电子空穴对在器件中形成的氧化物陷阱电荷和界面陷阱电荷是导致存储单元及其外围电路出现错误的原因.浮栅ROM器件的中子、质子和60Co γ辐射效应都是总剂量效应 . 关键词: FLASH ROM EEPROM 中子 质子 60Co γ')" href="#">60Co γ 总剂量效应  相似文献   
55.
基于μC/GUI的嵌入式图形界面设计   总被引:6,自引:2,他引:4  
刘滨  刘兵  赵艳华 《液晶与显示》2005,20(6):558-563
μC/GUI是一种基于嵌入式应用的通用图形接口软件,文章在详细介绍μC/GUI特点的基础上给出了基于NHC_01型彩色液晶模块的移植实例,并提供了液晶模块与ARM7内核处理器的硬件接口框图。通过分析μC/GUI的动态内存管理机制,给出了一种基于窗口的嵌入式通用图形界面设计方法。  相似文献   
56.
In this work, we study dynamic provisioning of multicast sessions in a wavelength-routed sparse splitting capable WDM network with an arbitrary mesh topology where the network consists of nodes with full, partial, or no wavelength conversion capabilities and a node can be a tap-and-continue (TaC) node or a splitting and delivery (SaD) node. The objectives are to minimize the network resources in terms of wavelength-links used by each session and to reduce the multicast session blocking probability. The problem is to route the multicast session from each source to the members of every multicast session, and to assign an appropriate wavelength to each link used by the session. We propose an efficient online algorithm for dynamic multicast session provisioning. To evaluate the proposed algorithm, we apply the integer linear programming (ILP) optimization tool on a per multicast session basis to solve off-line the optimal routing and wavelength assignment given a multicast session and the current network topology as well as its residual network resource information. We formulate the per session multicast routing and wavelength assignment problem as an ILP. With this ILP formulation, the multicast session blocking probability or success probability can then be estimated based on solving a series of ILPs off-line. We have evaluated the effectiveness of the proposed online algorithm via simulation in terms of session blocking probability and network resources used by a session. Simulation results indicate that our proposed computationally efficient online algorithm performs well even when a fraction of the nodes are SaD nodes.  相似文献   
57.
A theoretical construction of one-to-many (OTM) and many-to-one (MTO) chaos synchronization communications using semiconductor lasers is presented. One center laser provides strong injections (strong link) to other side lasers, and the side lasers also provide weak injections (weak link) to the center one. Simulation results show that the side lasers synchronize with the center laser through injection-locking. In addition, messages transmitted via the strong links or the weak links experience strong chaos pass filtering, enabling us to realize OTM and MTO communications.  相似文献   
58.
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.  相似文献   
59.
宽带固定增益放大器THS4302特性及应用   总被引:1,自引:0,他引:1  
THS4302是TI公司推出的新型固定增益放大器,具有2.4GHz的带宽和 5V/V的固定增益。其性能是现有同类产品的四倍,可为高速应用系统提供高速低噪声的模拟解决方案。文中介绍了THS4302的特点、工作原理及使用注意事项,并在此基础上给出了几种典型应用。  相似文献   
60.
李文涛  丁美新  何斌 《电子工程师》2004,30(2):61-63,74
利用CPLD芯片实现单片机与ISA总线接口之间的高速并行通信,给出系统的总体设计方法及程序框图。采用这种通信方式,在12MHz晶振的MCS51单片机控制的数据采集系统中,可以满足与PCI04 ISA总线接口实时通信的要求,通信速率达200khit/s。在开发工具MAX plusⅡ下,完成了整个设计的输入、编译和仿真,达到了预期效果。本设计方案能够推广应用到计算机的高速并行通信中。  相似文献   
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