Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

脉冲式半导体激光器准直光学系统的设计

根据具体的探测环境和探测精度,通过理论分析,提出了脉冲式半导体激光器准直光束的单透镜设计方法和柱面透镜的设计方法,并且给出了具体的设计参数。可以获得高斯光束的准直发散角为1.48mrad;高斯光束的腰粗为0.325mm。     

闪光灯泵浦Nd3+:GGG激光特性研究

用闪光灯泵浦掺钕钆镓石榴石(Nd^3 ：GGG)激光晶体，研究了脉冲宽度0．5ms、1ms、1．5ms和2ms的放电泵浦下激光输出，实验获得了1．92J的最大激光能量．     

视频流无缝拼接中的帧转换

帧转换在MPEG-2视频流无缝拼接中有着非常重要的作用。文中就压缩域视频流的无缝拼接中的帧转换技术进行了深入的分析。文中以12帧IBBP结构的GOP为例分析了拼接点处应采用的帧转换方案,在此基础上给出帧转换的具体实现,并通过一个帧转换实验对之进行了验证。     

热作模具钢表面激光堆焊耐磨合金层的研究

本文主要通过在H13钢上用大功率CO_2激光束进行堆焊,阐述了激光堆焊工艺变化对堆焊组织和性能的影响,在本试验条件下,得到了高密度弥散金属化合物组织的激光堆焊层,平均硬度为HV800,与基体呈冶金结合,耐磨性比H13模具钢提高149%。     

MIM隧道发光结的负阻现象

本文介绍了薄膜隧道发光结的基本结构、发光机理，阐述了其Ｉ－Ｖ特性中的负阻现象。简单介绍了ＭＩＭ结构负阻的几种解释，根据热像仪照片和低温测试结果分析，再结合Ｄｅａｒｍａｌｅｙ导电模型，我们提出了ＭＩＭ负阻的物理模型，理论与实验符合较好，最后分析了负阻现象的应用前景。     

正交特征群

本文在证明了有限Ａｂｅ１群Ｇ与它的特征群Ｇ√存在同构的一个必要充分条件之后，构造了一类正交特征群，从而概括了相当一大类正交变换（它包括了离散付里叶变换、阿达玛变换、数论变换、Ｃｈｒｅｓｔｅｎｓｏｎ变换）这对构成有限域与整环上的正交变换具有指导作用。     

一类带等式约束非光滑最优化问题的逐次二次规划方法

本文对一类带等式的非光滑最优化问题给出了一种逐次二次规划方法。这类问题的目标函数是非光滑合成函数，约束函数是非线性光滑函数。该方法通过逐次解二阶规划寻找搜索方向，使用ｌ１－罚函数的非精确线搜索得到新的迭代点。我们证明了算法的全局收敛性并给出了数值试验结果。