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101.
R. Urata R. Takahashi T. Nakahara K. Takahata H. Suzuki 《Photonics Technology Letters, IEEE》2006,18(1):67-69
We propose an optically clocked transistor array optoelectronic integrated circuit (OEIC) for both serial-to-parallel and parallel-to-serial conversion (demux/mux), enabling an interface between high-speed asynchronous burst optical labels and CMOS circuitry for optical label swapping. Dual functionality of the OEIC reduces size, power, and cost of the optical label swapper. The capability for greater than 20-Gb/s conversion operation is demonstrated. 相似文献
102.
S.J. Choi K. Djordjev Zhen Peng Qi Yang Sang Jun Choi P.D. Dapkus 《Photonics Technology Letters, IEEE》2004,16(10):2266-2268
All-buried InP-InGaAsP ring resonators laterally coupled to bus waveguides are demonstrated. The buried configurations offer a lower built-in refractive index step along the resonator periphery, which affords enhanced optical coupling coefficients between the waveguides and reduced scattering losses caused by the resonator sidewall imperfections. Very low optical intensity attenuations of 0.4 cm/sup -1/ and coupling-limited quality factors of greater than 10/sup 5/ are observed from 200-/spl mu/m-radii ring resonators. The measured spectral linewidth is as narrow as 0.0145 nm. 相似文献
103.
A decision support system for interactive decision making - Part II: analysis and output interpretation 总被引:2,自引:0,他引:2
Liping Fang K.W. Hipel D.M. Kilgour Xiaoyong Peng 《IEEE transactions on systems, man and cybernetics. Part C, Applications and reviews》2003,33(1):56-66
For pt.I see ibid., p.42-55 (2003). The development of a comprehensive decision support system, GMCR II, for the systematic study of real-world interactive decision problems is presented. The companion paper (Part I), discusses how GMCR II elicits, stores, and manages conflict models; here (Part II), the focus is on GMCR IIs analysis and output interpretation subsystems. Specifically, this paper describes the powerful and efficient analysis engine contained in GMCR II, its informative output presentation and interpretation facilities, and a number of follow-up analyses. Furthermore, an illustrative case study is used to demonstrate how GMCR II can be conveniently applied in practice. 相似文献
104.
D. Li K. Imasaki S. Miyamoto S. Amano T. Mochizuki 《Journal of Infrared, Millimeter and Terahertz Waves》2004,25(7):1069-1073
We studied on realization of short pulse gamma ray and X-ray simultaneously induced by a femtosecond laser on NewSUBARU storage ring. Based on the fact that the transverse dimensions of electron beam are much shorter than the longitudinal one, the laser light is arranged to collide the electron beam at a right angle to generate femtosecond pulse gamma ray, furthermore, the modulated part of the electron bunch gives rise to short pulse X-ray by synchrotron radiation from a downstream bending magnet. The temporal characteristic of the radiation is analyzed in this paper, as well as the performances are estimated. 相似文献
105.
The extended quadratic residue code is the only (48,24,12) self-dual doubly-even code 总被引:3,自引:0,他引:3
Houghten S.K. Lam C.W.H. Thiel L.H. Parker J.A. 《IEEE transactions on information theory / Professional Technical Group on Information Theory》2003,49(1):53-59
An extremal self-dual doubly-even binary (n,k,d) code has a minimum weight d=4/spl lfloor/n/24/spl rfloor/+4. Of such codes with length divisible by 24, the Golay code is the only (24,12,8) code, the extended quadratic residue code is the only known (48,24,12) code, and there is no known (72,36,16) code. One may partition the search for a (48,24,12) self-dual doubly-even code into three cases. A previous search assuming one of the cases found only the extended quadratic residue code. We examine the remaining two cases. Separate searches assuming each of the remaining cases found no codes and thus the extended quadratic residue code is the only doubly-even self-dual (48,24,12) code. 相似文献
106.
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108.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
109.
In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications 相似文献
110.
Asakawa K. Matake S. Hotta Y. Hiraoka T. 《Advanced Packaging, IEEE Transactions on》2006,29(2):211-217
A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires. 相似文献