A tree partitioning dynamic policy for OVSF codes assignment in wideband CDMA

This paper proposes some novel techniques to accommodate users with different rate requirements in a wideband code-division multiple-access system employing orthogonal variable spreading factor codes. Two simple static code assignment strategies are first considered, and an improvement based on multicode assignment. Then the new idea of tree partitioning is introduced and used to devise a dynamic code reassignment algorithm. The behavior of these different techniques is experimentally investigated, in terms of call blocking probability and number of required reassignments. The tree partitioning method exhibits very good performances.     

Control system design on a power-split CVT for high-power agricultural tractors

The problem considered in this paper is the design and tuning of the control system of a power-split continuously variable transmission (CVT) used in high-power tractors. Power-split CVTs are characterized by the combination of a traditional mechanical transmission and by a continuously-variable transmission. This guarantees, at the same time, smooth variations of the transmission-ratio and high efficiency of the overall transmission system. The control architecture of an hydrostatic power-split CVT is constituted by three main parts: 1) servo-controller on the current of the valve which drives the hydraulic transmission; 2) a servo-controller on the hydraulic transmission-ratio; and 3) a synchronizer which coordinates the hydraulic and the mechanical parts of the CVT. In this work, these three controllers are fully developed, including: design, implementation, and evaluation on an experimental system.     

Experimental real-time detector of GSM terminals

The authors present an experimental real-time GSM terminal detector, to be installed in a restricted area. The detector triggers terminal signaling, which can be captured.     

A fuzzy logic based-method for prognostic decision making in breast and prostate cancers

Accurate and reliable decision making in oncological prognosis can help in the planning of suitable surgery and therapy, and generally, improve patient management through the different stages of the disease. In recent years, several prognostic markers have been used as indicators of disease progression in oncology. However, the rapid increase in the discovery of novel prognostic markers resulting from the development in medical technology, has dictated the need for developing reliable methods for extracting clinically significant markers where complex and nonlinear interactions between these markers naturally exist. The aim of this paper is to investigate the fuzzy k-nearest neighbor (FK-NN) classifier as a fuzzy logic method that provides a certainty degree for prognostic decision and assessment of the markers, and to compare it with: 1) logistic regression as a statistical method and 2) multilayer feedforward backpropagation neural networks an artificial neural-network tool, the latter two techniques having been widely used for oncological prognosis. In order to achieve this aim, breast and prostate cancer data sets are considered as benchmarks for this analysis. The overall results obtained indicate that the FK-NN-based method yields the highest predictive accuracy, and that it has produced a more reliable prognostic marker model than both the statistical and artificial neural-network-based methods.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Sigma-delta modulators operating at a limit cycle

A new type of sigma-delta modulator that operates in a special mode named limit-cycle mode (LCM) is proposed. In this mode, most of the SDM building blocks operate at a frequency that is an integer fraction of the applied sampling frequency. That brings several very attractive advantages: a reduction of the required power consumption per converted bandwidth, an immunity to excessive loop delays and to digital-analog converter waveform asymmetry and a higher tolerance to clock imperfections. The LCMs are studied via a graphical application of the describing function theory. A second-order continuous time SDM with 5 MHz conversion bandwidth, 1 GHz sampling frequency and 125 MHz limit-cycle frequency is used as a test case for the evaluation of the performance of the proposed type of modulators. High level and transistor simulations are presented and compared with the traditional SDM designs.     

A multiwinding modeling method for high frequency transformers and inductors

This paper presents a method to obtain an electric model for transformers and inductors, including both frequency and geometry effects in the windings, which can be linked with existing core models. One-dimensional distributions for magnetic and electric fields are assumed, and from Maxwell's equations an equivalent electric circuit is easily obtained. This equivalent circuit has been included in analog simulators (Spice, AnalogWorkBench, Saber ...), and comparisons between measured and simulated results are shown, both in time domain and in AC sweep, which verify the model accuracy. The model described in this paper allows designers to deal with key issues in the design of high-frequency magnetic components (copper losses, leakage inductance, skin and proximity effects) by using analog simulators, which are usually more familiar to them than finite-element analysis tools.     

Optical-transmission characteristics of optical-fiber cables and installed optical-fiber cable networks for WDM systems

Many cables containing 1.3-/spl mu/m zero-dispersion single-mode (SM) optical fibers are installed in trunk and access networks. Recently, there have been a number of studies on wavelength-division-multiplexing (WDM) systems designed to increase transmission capacity and flexibility. If we can construct WDM systems using SM optical-fiber cable networks designed to transmit using wavelengths in the 1.3-/spl mu/m window (O-band), this will prove very effective in reducing construction costs. It is therefore important to examine the wavelength dependence of the transmission characteristics of SM optical-fiber cables and networks that have already been installed and in which several optical fibers are joined. In this paper, we describe the measured optical characteristics of SM optical-fiber cables and installed optical-fiber cable networks at various wavelengths. The optical characteristics were stable in the 1.46 to 1.625-/spl mu/m wavelength range and we confirmed that the installed SM optical-fiber cable networks could be used for WDM system applications.     

Evaluation and optimization of package processing and design through solder joint profile prediction

Solder joints are generated using a variety of methods to provide both mechanical and electrical connection for applications such as flip-chip, wafer level packaging, fine pitch, ball-grid array, and chip scale packages. Solder joint shape prediction has been incorporated as a key tool to aid in process development, wafer level and package level design and development, assembly, and reliability enhancement. This work demonstrates the application of an analytical model and the Surface Evolver software in analyzing a variety of solder processing methods and package types. Bump and joint shape prediction was conducted for the design of wafer level bumping, flip-chip assembly, and wafer level packaging. The results from the prediction methodologies are validated with experimentally measured geometries at each level of design.