The constant modulus array for cochannel signal copy and directionfinding

The constant modulus (CM) array is a blind adaptive beamformer capable of recovering a narrowband signal among several cochannel sources without using a pilot or training signal. It is a conventional weight-and-sum adaptive beamformer whose weights are updated by the constant modulus algorithm. An adaptive signal canceller follows the beamformer to remove the captured signal from the array input and to provide an estimate of its direction vector. Based on a Wiener model, we investigate the steady-state properties of the CM array and the signal canceller. For mutually uncorrelated sources and noise, it is shown that the signal canceller exactly removes the source captured by the array. Thus, identical stages of the CM array and signal canceller may be used in a multistage system to recover several cochannel sources. Computer simulations are presented to verify the analytical results and to illustrate the transient behavior of the system     

Autonomous vehicles

There are various kinds of autonomous vehicles (AV's) which can operate with varying levels of autonomy. This paper is concerned with underwater, ground and aerial vehicles operating in a fully autonomous (nonteleoperated) mode. Further this paper deals with AV's as a special kind of device, rather than full-scale manned vehicles operating unmanned. The distinction is one in which the AV is likely to be designed for autonomous operation rather than being adapted for it as would be the case for manned vehicles. We provide a survey of the technological progress that has been made in AV's, the current research issues and approaches that are continuing that progress, and the applications which motivate this work. It should be noted that issues of control are pervasive regardless of the kind of AV being considered, but that there are special considerations in the design and operation of AV's depending on whether the focus is on vehicles underwater on the ground, or in the air. We have separated the discussion into sections treating each of these categories     

Pocket pagers in lots of one CIM

The Fusion program, a method for agile, flexible computer integrated manufacturing (CIM) at Motorola's Paging Products Group, is discussed. Fusion's CIM and automated assembly system can manufacture a wide variety of different products on the same production line. The development of the Fusion program and how it differs from its predecessor, the Bandit program, are described     

A simple and effective precoding scheme for noise whitening onintersymbol interference channels

A precoding scheme for noise whitening on intersymbol interference (ISI) channels is presented. This scheme is compatible with trellis-coded modulation and, unlike Tomlinson precoding, allows constellation shaping. It can be used with almost any shaping scheme, including the optimal SVQ shaping, as opposed to trellis precoding, which can only be used with trellis shaping. The implementation complexity of this scheme is minimal-only three times that of the noise prediction filter, hence effective noise whitening can be achieved by using a high-order predictor     

Wideband HEMT MMIC low-noise amplifier with temperaturecompensation

A wideband low-noise pseudomorphic HEMT MMIC variable-gain amplifier has been designed and fabricated. The amplifier has a nominal gain of 13 dB across the band 2-20 GHz, with gain flatness better than ±0.4 dB. The noise figure is less than 3 dB across the band 6-16 GHz. An on-chip temperature-sensing diode is used to provide a linear temperature correction which has been used to reduce the gain variation of the amplifier by a factor of 2 across the temperature range -50°C to +95°C     

The effect of radiofrequency modulation of 57Fe hyperfine interaction by rotating magnetic field

The effect of ⁵⁷Fe hyperfine interaction radiofrequency (rf) modulation by external rotating magnetic field was studied in thin Permalloy foil by means of Mössbauer spectroscopy. The rf effect was investigated as a function of intensity for several rf field frequencies. The experiments show that the external rotating rf field causes considerable changes in the hyperfine pattern. The obtained spectra are in disagreement with those obtained by Perlow [Phys. Rev. 172 (1968) 319]. They also are inconsistent with magnetostriction hypothesis. Proceeding from the Mössbauer spectrum analysis one may conclude that the magnetization of investigated foil changes its direction in a complex manner. However, the undertaken experiments show that the essential number of Mössbauer nuclei experience the rotating magnetic field influence.     

Inductively coupled plasma etching of InGaP, AllnP, and AlGaP in Cl2 and BCl3 chemistries

Dry etching of InGaP, AlInP, and AlGaP in inductively coupled plasmas (ICP) is reported as a function of plasma chemistry (BCl₃ or Cl₂, with additives of Ar, N₂, or H₂), source power, radio frequency chuck power, and pressure. Smooth anisotropic pattern transfer at peak etch rates of 1000–2000Å·min^?1 is obtained at low DC self-biases (?100V dc) and pressures (2 mTorr). The etch mechanism is characterized by a trade-off between supplying sufficient active chloride species to the surface to produce a strong chemical enhancement of the etch rate, and the efficient removal of the chlorinated etch products before a thick selvedge layer is formed. Cl₂ produces smooth surfaces over a wider range of conditions than does BCl₃.     

Adiabatic couplers: design rules and optimization

Explicit analytic design rules are derived for both 3 dB and full adiabatic couplers. The design rules are in excellent agreement with numerical calculations using the beam propagation method (BPM). It is shown that the length scaling for 3 dB couplers compared to full couplers makes the former more difficult to design. The design for each case is optimized to obtain the upper limit of performance and a comparison is carried out between two different design geometries for both 3 dB and full adiabatic couplers     

Sub-quarter micron silicon integrated circuits and single wafer processing

This paper describes the role of single wafer processing in the development of sub-quarter micron silicon integrated circuits (ICs). The issues related to device processing, choice of materials, performance, reliability, and manufacturing are covered. Single wafer processing based rapid photothermal processing (dominant photons with wavelength less than about 800 nm) is an ideal answer to almost all the thermal processing requirements of current and future Si ICs. For process integration, a new model for process optimization based on minimization of thermal stress is proposed. For breaking the sub-100 nm manufacturing barriers, high throughput lithography based on direct writing is a proposed solution.     

Multi-emitter Si/GexSi1-x heterojunctionbipolar transistor with no base contact and enhanced logic functionality

We demonstrate multi-emitter Si/Ge_xSi_1-x n-p-n heterojunction bipolar transistors (HBT's) which require no base contact for transistor operation. The base current is supplied by the additional emitter contact under reverse bias due to the heavy doping of the emitter-base junction. Large-area HBT test structures exhibit good transistor characteristics, with current gain β≈400 regardless of whether the base current is supplied by a test base electrode or one of the emitter contacts. These devices have enhanced logic functionality because of emitter contact symmetry. Since device fabrication does not require base electrode formation, the number of processing steps can be reduced without significant penalty to HBT performance