Degree-of-polarization and eye-closure penalty associated with optical signals with orthogonal polarizations

We perform a systematic measurement of the degree-of-polarization (DOP) and eye-closure penalty for optical signals with orthogonal polarizations. We find that the symmetry of DOP is maintained for the orthogonal polarizations under both first and higher order polarization-mode dispersion (PMD), whereas the symmetry of eye-closure penalty is broken under second-order PMD. An orthogonal polarization pair can have large disparity of eye-closure penalty despite an identical DOP. We also demonstrate a novel approach to estimate the maximum eye-closure penalty asymmetry with three orthogonal polarizations on the Poincare/spl acute/ sphere.     

An optically clocked transistor array with dual serial-to-parallel and parallel-to-serial conversion capability for optical label swapping

We propose an optically clocked transistor array optoelectronic integrated circuit (OEIC) for both serial-to-parallel and parallel-to-serial conversion (demux/mux), enabling an interface between high-speed asynchronous burst optical labels and CMOS circuitry for optical label swapping. Dual functionality of the OEIC reduces size, power, and cost of the optical label swapper. The capability for greater than 20-Gb/s conversion operation is demonstrated.     

Organic Nanoparticles: Preparation,Self‐Assembly,and Properties

The strong tendency of organic nanoparticles to rapidly self‐assemble into highly aligned superlattices at room temperature when solution‐cast from dispersions or spray‐coated directly onto various substrates is described. The nanoparticle dispersions are stable for years. The novel precipitation process used is believed to result in molecular distances and alignments in the nanoparticles that are not normally possible. Functional organic light‐emitting diodes (OLEDs)—which have the same host–dopant emissive‐material composition—with process‐tunable electroluminescence have been built with these nanoparticles, indicating the presence of novel nanostructures. For example, only changing the conditions of the precipitation process changes the OLED emission from green light to yellow.     

焊膏印刷工艺参数的选择与优化

表面贴装工艺流程的关键工序之一就是焊膏印刷,其工艺控制的好坏直接影响着装配的线路板的质量。通过对印刷工艺参数的分析,利用试验设计的方法来找出关键工艺参数,并加以优化设定,从而为控制工序参数奠定基础。     

High-efficiency LEDs of 1.6–2.4 µm spectral range for medical diagnostics and environment monitoring

High efficient LED structures covering the spectral range of 1.6–2.4 μm have been developed on the basis of GaSb and its solid solutions. The electroluminescent characteristics and their temperature and current dependences have been studied. The radiative and nonradiative recombination mechanisms and their effect on the quantum efficiency have been investigated. A quantum efficiency of 40–60% has been obtained in the quasi-steady mode at room temperature. A short-pulse optical power of 170 mW was reached. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 37, No. 8, 2003, pp. 996–1009. Original Russian Text Copyright ? 2003 by Stoyanov, Zhurtanov, Astakhova, Imenkov, Yakovlev.     

Optimal mean-square prediction of the mobile-radio fading envelope

Long-range prediction of the mobile-radio fading envelope is an enabling technology for many fading compensation approaches. Because the fading envelope is well modeled as a bandlimited process, it has special predictability properties. In this paper, we find a linear predictor that is optimal in the mean-square sense when the predictor impulse response is energy constrained. This solution may be used to determine the minimum mean squared error of a prediction based on past values that are corrupted with estimation errors.     

A fuzzy logic based-method for prognostic decision making in breast and prostate cancers

Accurate and reliable decision making in oncological prognosis can help in the planning of suitable surgery and therapy, and generally, improve patient management through the different stages of the disease. In recent years, several prognostic markers have been used as indicators of disease progression in oncology. However, the rapid increase in the discovery of novel prognostic markers resulting from the development in medical technology, has dictated the need for developing reliable methods for extracting clinically significant markers where complex and nonlinear interactions between these markers naturally exist. The aim of this paper is to investigate the fuzzy k-nearest neighbor (FK-NN) classifier as a fuzzy logic method that provides a certainty degree for prognostic decision and assessment of the markers, and to compare it with: 1) logistic regression as a statistical method and 2) multilayer feedforward backpropagation neural networks an artificial neural-network tool, the latter two techniques having been widely used for oncological prognosis. In order to achieve this aim, breast and prostate cancer data sets are considered as benchmarks for this analysis. The overall results obtained indicate that the FK-NN-based method yields the highest predictive accuracy, and that it has produced a more reliable prognostic marker model than both the statistical and artificial neural-network-based methods.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

FIRE: fractal indexing with robust extensions for image databases

As already documented in the literature, fractal image encoding is a family of techniques that achieves a good compromise between compression and perceived quality by exploiting the self-similarities present in an image. Furthermore, because of its compactness and stability, the fractal approach can be used to produce a unique signature, thus obtaining a practical image indexing system. Since fractal-based indexing systems are able to deal with the images in compressed form, they are suitable for use with large databases. We propose a system called FIRE, which is then proven to be invariant under three classes of pixel intensity transformations and under geometrical isometries such as rotations by multiples of /spl pi//2 and reflections. This property makes the system robust with respect to a large class of image transformations that can happen in practical applications: the images can be retrieved even in the presence of illumination and/or color alterations. Additionally, the experimental results show the effectiveness of FIRE in terms of both compression and retrieval accuracy.