新型的芯片间互连用CMOS/BiCMOS驱动器

从改善不同类型 IC芯片之间的电平匹配和驱动能力出发 ,设计了几例芯片间接口 (互连 )用 CMOS/Bi CMOS驱动电路 ,并提出了采用 0 .5 μm Bi CMOS工艺 ,制备所设计驱动器的技术要点和元器件参数。实验结果表明所设计驱动器既具有双极型电路快速、大电流驱动能力的特点 ,又具备 CMOS电路低压、低功耗的长处 ,因而它们特别适用于低电源电压、低功耗高速数字通信电路和信息处理系统。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Comments on "An efficient PML implementation for the ADI-FDTD method"

For original paper see Wang and Teixeira (IEEE Microwave Wireless Comp. Lett., vol.13, p.72-4, 2003 February). In this paper, a more precise way to evaluate the actual performance of the perfectly matched layer (PML) used for the alternating direction implicit finite-difference time-domain (ADI-FDTD) method is presented. It is shown that the intrinsic numerical dispersion error of the ADI-FDTD method must be taken into account when the actual performance of the ADI-PML (as well as the ADI-FDTD method) is evaluated. Most importantly, it is demonstrated that the ADI-PMLs implemented with either the traditional manner or the way proposed in have almost the same level of accuracy when the performance of the ADI-PML is correctly evaluated.     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

从PZT体系看无铅压电陶瓷的可能应用

总结了主要以(Bi0.5Na0.5)TiO3和NaNbO3为基的无铅压电陶瓷的性能，以Pb(Ti，Zr)TiO3基二元系、三元系压电陶瓷的性能与应用为参考，分析了无铅压电陶瓷可能的器件应用。此外，还对拓宽无铅压电陶瓷应用需要改进的性能提出了建议。     

量子密码技术开辟通信安全新时代

量子密码技术被认为是绝对安全的加密技术。近年来,在美国、德国、日本和中国,相关研究都取得了明显进展。2004年6月,世界上第一个量子密码通信网络在美国马萨诸塞州剑桥城正式投入运行,标志着这一技术迈上了新台阶。据相关机构估算,量子保密通信系统一旦商用,将形成高达10亿美元的市场。     

蓝牙与IEEE802.11g系统的共存

蓝牙与IEEE802.11g无线局域网(Wireless Local Area Network,WLAN)都工作在2.4GHz频段上,因此它们之间存在一定的干扰。分析了蓝牙与IEEE802.11g通信系统之间的干扰,并提出了解决这一问题的两种方法:自适应跳频和删除标记法,并对两种方法的性能做了比较。     

脉冲式半导体激光器准直光学系统的设计

根据具体的探测环境和探测精度,通过理论分析,提出了脉冲式半导体激光器准直光束的单透镜设计方法和柱面透镜的设计方法,并且给出了具体的设计参数。可以获得高斯光束的准直发散角为1.48mrad;高斯光束的腰粗为0.325mm。     

闪光灯泵浦Nd3+:GGG激光特性研究

用闪光灯泵浦掺钕钆镓石榴石(Nd^3 ：GGG)激光晶体，研究了脉冲宽度0．5ms、1ms、1．5ms和2ms的放电泵浦下激光输出，实验获得了1．92J的最大激光能量．     

Belief-Propagation-Approximated Decoding of Low-Density Parity-Check Codes

In this paper, we propose a new reduced-complexity decoding algorithm of Low-Density Parity-Check (LDPC) codes, called Belief-Propagation-Approximated (BPA) algorithm, which utilizes the idea of normalization and translates approximately the intricate nonlinear operation in the check nodes of the original BP algorithm to only one operation of looking up the table. The normalization factors can be obtained by simulation, or theoretically. Simulation results demonstrate that BPA algorithm exhibits fairly satisfactory bit error performance on the Additive White Gaussian Noise (AWGN) channel.