Et2Zn-mediated stoichiometric C(sp)-H silylation of 1-alkynes and chlorosilanes

A first example of an Et₂Zn mediated silylation of 1-aklynes is reported. A series of functional groups are tolerated in this reaction. Mechanistic studies support Zn alkynilides as intermediates in the reaction. This reaction protocol provides a practical method for the preparation of alkynylsilanes and expands the application of organometallic zinc in organic synthesis.     

Measurement of Residual Dipolar Couplings of Organic Molecules in Multiple Solvent Systems Using a Liquid-Crystalline-Based Medium

Residual dipolar coupling (RDC), a robust anisotropic NMR parameter for structural elucidation of organic molecules, is only accessible in an anisotropic environment. Herein, we introduce a novel alignment medium based on the molecular self-assembly of oligopeptide amphiphile (OPA). This medium is compatible with different intermediate and polar solvent systems, such as CD₃OD, [D₆]DMSO, and D₂O. The preparation of the OPA-based medium is simple and rapid, while only very weak background signals were observed from OPAs. Furthermore, we show that the purity of OPA has only a minor influence on the quality of the RDC data. These advantages allow RDC measurements of organic molecules with different polarities and solubilities with high efficiency and accuracy.     

移动通信系统中功率控制研究

在阐述功率控制在移动通信系统中的发展过程的基础上，着重研究了WCDMA系统的功率控制，最后对功率控制未来的研究方向做了简要的分析。     

博宁联合化疗治疗骨转移癌的疗效分析

目的 :分析单纯化疗与博守联合化疗对实体瘤骨转移引起疼痛治疗的效果。方法 :42例病人随机分为单纯化疗组和化疗联合博宁组 ,对疼痛缓解程度和活动能力改善等进行对照研究。结果 :化疗联合应用博宁组疼痛缓解率及肿瘤变化方面明显优于单纯联合化疗组 (P <0 .0 5 ) ,而在活动能力改善方面则无明显差别。结论 :博宁联合化疗治疗骨转移癌引起的疼痛效果优于单纯联合化疗     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Reduced-rate retransmissions for spread-spectrum packet radio multimedia networks

A reduced-rate retransmission (RRR) scheme is proposed for improving the throughput performance of spread-spectrum packet radio networks. The scheme takes advantages of the available multi-rate scalable source coding techniques. It assumes that several versions of a data packet with different sizes (number of information bits) are available. The transmission of a packet starts from its full-size version. If the full-size version is not correctly received, its half-size version is used in the retransmission. If further retransmissions are needed, the quarter-size version and so on are used. The shrunk packets are transmitted either in a minislot if the processing gain is kept the same, or occupying a slot duration by increasing the processing gain proportionally. In both cases, the effective signal to interference ratio for a packet is increased. As a result, the system throughput is improved. Theoretical and numerical results are provided in this paper which illustrate the throughput improvement. Another advantage of the proposed RRR scheme is that the packet-size reduction provides finer granules for link adaptation. Therefore, it is especially suitable for multimedia applications for which codes of variable rate for the source data are available and which can tolerate gracefully degraded quality of service. The performance of the proposed scheme in fading channels is also addressed.     

Global stability of Internet congestion controllers with heterogeneous delays

In this paper, we study the problem of designing globally stable, scalable congestion control algorithms for the Internet. Prior work has primarily used linear stability as the criterion for such a design. Global stability has been studied only for single node, single source problems. Here, we obtain conditions for a general topology network accessed by sources with heterogeneous delays. We obtain a sufficient condition for global stability in terms of the increase/decrease parameters of the congestion control algorithm and the price functions used at the links.     

双层有机电致发光器件有机层厚度优化的数值研究

在陷阱电荷限制电流传导理论的基础上,提出了双层有机电致发光器件的数值模型,研究了结构为"阳极/空穴输运层(HTL)/发光层(EML)/阴极"的器件中电流密度和量子效率随有机层的特征陷阱能量、陷阱密度和载流子迁移率的依赖关系. 研究发现,对于给定的HTL和EML的特征陷阱能量、陷阱密度和载流子迁移率,存在一个最优的HTL和EML之间的厚度比率,在此最优厚度比下,器件的电流密度和量子效率达到最大.通过有机层厚度的优化,器件的电流密度和量子效率可提高多达两个数量级.另外,还研究了最优厚度比随有机层特征陷阱能量、总陷阱密度和载流子迁移率之间的定量关系.     

X射线光刻掩模背面刻蚀过程中的形变仿真

开发了理论模型以验证有限元方法用于X射线光刻掩模刻蚀过程数值仿真的正确性。利用相同的有限元技术，对X射线光刻掩模的背面开窗、Si片刻蚀过程进行数值仿真。结果表明，图形区域的最大平面内形变(IPD)出现在上、下边缘处，最大非平面形变(OPD)出现在左、右边缘处。此外对Si片单载荷步刻蚀和多载荷步刻蚀的仿真进行比较，结果表明图形区域最终的形变量与Si片刻蚀的过程无关。