Improvement of AlGaInP light emitting diode by sulfide passivation

The brightness of AlGaInP light emitting diodes (LEDs) has been raised by a factor of 1.12 at 20 mA by sulfide passivation. Meanwhile, the sulfide also can decrease leakage current of AlGaInP LEDs at -2 V to nearly one thousandth of that in the as-fabricated device. The possible causes for the brightness increase of AlGaInP LEDs after sulfide treatment including surface roughness, reduction of Fresnel loss, and effective injection of carriers were demonstrated.     

Thermal conductivity of doped PbTe-based solid solutions with off-center impurities

The coefficients of thermopower and electrical and thermal conductivity in the PbTe_0.8Se_0.1 S _0.1 solid solution with electron concentration (4.6–54) × 10¹⁸ cm^?3 are studied in the range of 85–300 K (and in some cases up to 700 K). The temperature dependences of electrical and thermal conductivity indicate that the low-temperature electron and phonon scattering initiated by the off-center impurity of sulfur exists. The temperature dependences of the electronic and lattice components of thermal conductivity are calculated in the approximation of a parabolic spectrum and electron scattering by acoustic phonons and neutral substitutional impurities. The lattice thermal conductivity is found to have a feature in the form of a shallow minimum in the range of 85–250 K. A similar feature, while not so clearly pronounced, is found to exist also in Pb_1?x Sn_xTe_1?x Se_x alloys (x≥0.15) with an off-center tin impurity. An analysis of the possible origins of this effect suggests that, at low temperatures, the Lorentz numbers L of the materials under study are smaller than the L₀ numbers employed which correspond to the above scattering mechanisms. The cause of the decrease in L is related to electron scattering at two-level systems, a mechanism whose effect grows with increasing electron energy. An analysis of experimental data obtained at high temperatures, as well as on undoped samples with the lowest possible carrier concentrations, yields the values of L for samples with different electron densities. The minimum value L/L₀ = 0.75 is obtained for a lightly doped sample at ～130 K.     

A simple impulsiveness correction factor for control of electromagnetic interference in dynamic wireless applications

The emerging software defined radio technologies will be an enabler for a new generation of dynamic wireless systems. It will also open up the possibility of allocating frequencies in a, more dynamic way than today. From an intersystem-interference point of view, this can cause unforeseen problems to occur due to the increased complexity in such applications. In such applications, a measure indicating whether or not a frequency band is possible to use from an electromagnetic interference point of view, must be found. A simple approach is to use the measured total average interference power within the receiver band. Since the interference impact on modern digital communication systems from an interference signal does not only depend on the power but also on the actual waveform of the interference signal, some kind of quality measure of the average-power approach would be convenient to use. In this paper, we introduce a simple quality measure of the average-power approach so that a rough adjustment for the interference-waveform properties can be done.     

Quadrature Mismatch Shaping for Digital-to-Analog Converters

Quadrature sigma-delta analog-to-digital converters require a feedback path for both the I and the Q parts of the complex feedback signal. If two separate multibit feedback digital-to-analog converters (DACs) are used, mismatch among the unit DAC elements leads to additional mismatch noise in the output spectrum as well as an I/Q imbalance. This paper proposes new quadrature bandpass (QBP) mismatch shaping techniques. In our approach, the I and Q DACs are merged into one complex DAC, which leads to near-perfect I/Q balance. To select the unit DAC elements of the complex multibit DAC, the well-known butterfly shuffler and tree structure are generalized towards a complex structure, and necessary constraints for their correct functioning are derived. Next, a very efficient first-order QBP shaper implementation is proposed. Finally, the newly presented complex structures are simulated to prove their effectiveness and are compared with each other with respect to performance     

High Rate Data Synchronization in GALS SoCs

Globally asynchronous, locally synchronous (GALS) systems-on-chip (SoCs) may be prone to synchronization failures if the delay of their locally-generated clock tree is not considered. This paper presents an in-depth analysis of the problem and proposes a novel solution. The problem is analyzed considering the magnitude of clock tree delays, the cycle times of the GALS module, and the complexity of the asynchronous interface controllers using a timed signal transition graph (STG) approach. In some cases, the problem can be solved by extracting all the delays and verifying whether the system is susceptible to metastability. In other cases, when high data bandwidth is not required, matched-delay asynchronous ports may be employed. A novel architecture for synchronizing inter-modular communications in GALS, based on locally delayed latching (LDL), is described. LDL synchronization does not require pausable clocking, is insensitive to clock tree delays, and supports high data rates. It replaces complex global timing constraints with simpler localized ones. Three different LDL ports are presented. The risk of metastability in the synchronizer is analyzed in a technology-independent manner     

Impact of lead-free soldering processes on the performance of signal relay contacts

Various legislations, rules and regulations in Europe [Restrictions of the use of certain hazardous substances in electrical and electronic equipment (ROHS)] and Japan (Recycling Law for Home Electric Appliances) have either targeted restrictions or a full ban on the use of lead, to be enforced from 2001, 2005, and 2006 onwards. Next to these regulations, marketing arguments are becoming more and more important for so called "GREEN" products. Up to now, mainly tin-lead alloys have been used in electronics. The process temperatures usually applied have been in the range of 230/spl deg/C. All currently discussed lead-free alternatives for professional electronics need process temperatures which are at least 30/spl deg/C higher. In addition, the process duration is significantly longer. The combination of higher process temperatures and longer duration together results in a significant thermal stress on the precision mechanics of the relay. In order to guarantee proper functioning of the relay after the solder process with maximum process temperatures of 255/spl deg/C, the dimensional changes of the plastic parts must be less than a few micrometers in order to guarantee stable contact forces. The outgassing of the used insulating and sealing materials must be minimal in order not to pollute or contaminate the contacts. With the lead-free version of the IM relay, an identical performance and the same reliability during electrical and climatic endurance tests can be expected, even though relays were processed with typical lead-free soldering processes with temperatures up to 255/spl deg/C.     

Alternating-direction implicit (ADI) formulation of the finite-difference time-domain (FDTD) method: algorithm and material dispersion implementation

The alternating-direction implicit finite-difference time-domain (ADI-FDTD) technique is an unconditionally stable time-domain numerical scheme, allowing the /spl Delta/t time step to be increased beyond the Courant-Friedrichs-Lewy limit. Execution time of a simulation is inversely proportional to /spl Delta/t, and as such, increasing /spl Delta/t results in a decrease of execution time. The ADI-FDTD technique greatly increases the utility of the FDTD technique for electromagnetic compatibility problems. Once the basics of the ADI-FDTD technique are presented and the differences of the relative accuracy of ADI-FDTD and standard FDTD are discussed, the problems that benefit greatly from ADI-FDTD are described. A discussion is given on the true time savings of applying the ADI-FDTD technique. The feasibility of using higher order spatial and temporal techniques with ADI-FDTD is presented. The incorporation of frequency dependent material properties (material dispersion) into ADI-FDTD is also presented. The material dispersion scheme is implemented into a one-dimensional and three-dimensional problem space. The scheme is shown to be both accurate and unconditionally stable.     

Parameterisation of slant-Haar transforms

A parameterisation of the slant-Haar transform is presented, which includes an existing version of the slant-Haar transform. An efficient algorithm for the slant-Haar transform is developed and its computational complexity is estimated. The parametric slant-Haar transforms are compared to the Karhunen-Loeve transform. The parametric slant-Haar is shown to perform better than the commonly used slant-Haar and slant-Hadamard transforms for the first-order Markov model and also performs better than the discrete cosine transform for images approximated by the generalised image correlation model     

Analytical multipoint moment matching reduction of distributed thermal networks

In this paper, the multipoint moment matching method for model order reduction of discretized linear thermal networks is extended to distributed linear thermal networks. As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived analytically. This direct construction of the reduced network, from the exact analytical solutions, avoids the inevitable inaccuracies inherent in conventional surface and volume meshing. It allows nearly exact reduced thermal network construction by domain decomposition for arbitrarily complicated structures.