ANALYSIS AND PROCESSING OF LMF－COSTAS STEPPED FREQUENCY RADAR SIGNAL

Linear Modulated Frequency (LMF) Costas Stepped Frequency Radar (SFR) signal is introduced. Its ambiguity function is derived and analyzed in detail and its feasibility is validated in theory. The scheme of the proposed signal processing is also presented. The results of theoretic analysis and simulation show that, by using the proposed signal and increasing the bandwidth of the total stepped frequency, the ambiguity sidelobe is well suppressed and the range-velocity coupling in the stepped frequency radar is also greatly weakened.     

PERFORMANCE OF THREE STAGE TURBO－EQUALIZATION－DECODING

An increasing demand for high data rate transmission and protection over bandlimited channels with severe inter-symbol interference has resulted in a flurry of activity to improve channel equalization. In conjunction with equalization, channel coding-decoding can be employed to improve system performance. In this letter, the performance of the three stageturbo-equalization-decoding employing log maximum a posteriori probability is experimentally evaluated by a fading simulator. The BER is evaluated using various information sequence and interleaver sizes taking into account that the communication medium is a noisy inter symbol interference channel.     

DISPERSION COMPENSATION CFBG IN100km 10Gbit／s RECIRCULATING SYSTEMS

A 10Gbit/s recirculating system is configured with Chirped Fiber Bragg Grating (CFBG) for the dispersion compensation. For the first time, the transmission distance in the loop reaches 1000km with bit error rate of 10-9. The effect of the group delay ripple of the fiber grating is also investigated in the recirculating systems, and it is shown that the transmission distance is limited to 4 cycles (4×167.1km ) in the loop with the power penalty fluctuation below 1.0dB. Thus the group delay ripple should be reduced to allow for the wavelength drift of±5GHz. At the end of this letter, the principles are given for designing long haul recirculating systems with dispersion compensation CFBG.     

Channel Sounding with Partial Channel Information in the Uplink of OFDM-Based Wireless Systems

In this paper, we consider a new channel sounding scheme for opportunistic scheduling with the use of reduced channel information in the uplink of orthogonal frequency division multiplexing (OFDM)-based wireless systems. To reduce signaling overhead for the sounding, we propose a two step channel sounding process considering the correlation characteristic in the time and frequency domain; called pre-sounding and main-sounding. Signal-to-noise power ratio (SNR) of each subchannel is first estimated through the pre-sounding process. Then, a main-sounding signal is sent over subchannels having high SNR but not highly correlated to each other. Since it is possible to extract the whole channel information from partial one by exploiting the channel correlation, the proposed scheme can significantly reduce the sounding signaling overhead without noticeable performance degradation compared to the full sounding scheme. Simulation results show that the proposed scheme provides significant performance improvement over conventional schemes especially when the channel is highly correlated in the time and frequency domain.     

A linear 60 GHz 65 nm-CMOS power amplifier realization and characterization for OFDM signal

A millimeter-wave Power Amplifier (PA) based on a 65nm CMOS technology from STMicroelectronics has been designed. The targeted feature is the unlicensed band around 60 GHz suitable for wireless personal area network application (WPAN). To optimize the linearity, the PA is designed under class A biasing to have an output compression point (OCP₁) close to its saturated Power (P _sat). S-parameters and large signal measurement results are demonstrated and compared with electromagnetic simulations. The PA offers a P _sat of 8.3 dBm, an OCP₁ of 6 dBm and a gain of 6.7 dB. The die area is 0.29 mm² with pads. Considering those results, one-tone simulations are not sufficient to characterize the linearity performances of the PA in its real conditions of use. Consequently, two-tone simulations are firstly performed. After, linearity figures of merit (FoM) are discussed applying an orthogonal frequency-division multiplexing (OFDM) modulated signal. The PA offers an adjacent channel power ratio (ACPR) of 15 dB and an error vector magnitude (EVM) of 20% at PA compression operating mode.     

FPGA architecture of the LDPS Motion Estimation for H.264/AVC Video Coding

Motion estimation is a highly computational demanding operation during video compression process and significantly affects the output quality of an encoded sequence. Special hardware architectures are required to achieve real-time compression performance. Many fast search block matching motion estimation (BMME) algorithms have been developed in order to minimize search positions and speed up computation but they do not take into account how they can be effectively implemented by hardware. In this paper, we propose three new hardware architectures of fast search block matching motion estimation algorithm using Line Diamond Parallel Search (LDPS) for H.264/AVC video coding system. These architectures use pipeline and parallel processing techniques and present minimum latency, maximum throughput and full utilization of hardware resources. The VHDL code has been tested and can work at high frequency in a Xilinx Virtex-5 FPGA circuit for the three proposed architectures.     

Evaluation of the Thermal Comfort of a Thermoelectric Ceiling Cooling Panel (TE-CCP) System

This present work evaluates the cooling performance and thermal comfort of a thermoelectric ceiling cooling panel (TE-CCP) system composed of 36 TE modules. The cold side of the TE modules was fixed to an aluminum ceiling panel to cool a test chamber of 4.5 m³ volume, while a copper heat exchanger with circulating cooling water at the hot side of the TE modules was used for heat release. Thermal acceptability assessment was performed to find out whether the indoor environment met the ASHRAE Standard-55's 80% acceptability criteria. The standard was met with the TE-CCP system operating at 1 A of current flow with a corresponding cooling capacity of 201.6 W, which gives the COP of 0.82 with an average indoor temperature of 27°C and 0.8 m/s indoor air velocity.     

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Due to the toxicity of lead (Pb), Pb-containing solder alloys are being phased out from the electronics industry. This has lead to the development and implementation of lead-free solders. Being an environmentally compatible material, the lead-free Sn-3.0Ag-0.5Cu (wt.%) solder alloy is considered to be one of the most promising alternatives to replace the traditionally used Sn-Pb solders. This alloy composition possesses, however, some weaknesses, mainly as a result of its higher melting temperature compared with the Sn-Pb solders. A possible way to decrease the melting temperature of a solder alloy is to decrease the alloy particle size down to the nanometer range. The melting temperature of Sn-3.0Ag-0.5Cu lead-free solder alloy, both as bulk and nanoparticles, was investigated. The nanoparticles were manufactured using the self-developed consumable-electrode direct current arc (CDCA) technique. The melting temperature of the nanoparticles, with an average size of 30 nm, was found to be 213.9°C, which is approximately 10°C lower than that of the bulk alloy. The developed CDCA technique is therefore a promising method to manufacture nanometer-sized solder alloy particles with lower melting temperature compared with the bulk alloy.     

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

The microstructure and microhardness of Sn-xAg and Sn-xCu solders were investigated as functions of alloy composition and cooling rate. The Ag compositions examined varied from 0.5 wt.% to 3.5 wt.%, while Cu varied from 0.5 wt.% to 2.0 wt.%. Three cooling rates were employed during solidification: 0.02°C/s (furnace cooling), about 10°C/s (air cooling), and 100°C/s or higher (rapid solidification). Sn grain size and orientation were observed by cross-polarization light microscopy and electron-backscattering diffraction (EBSD) techniques. The microhardness was measured to correlate the mechanical properties with alloy compositions and cooling rates. From this study, it was found that both alloy composition and cooling rate can significantly affect the Sn grain size and hardness in Sn-rich solders. The critical factors that affect the microstructure–property relationships of Sn-rich solders are discussed, including grain size, crystal orientation, dendrite cells, twin boundaries, and intermetallic compounds (IMC).     

<Emphasis Type="Italic">Ab Initio</Emphasis> Studies of Hydrogen Defects in CdTe

Using first-principles calculations based on density functional theory, we have investigated the nature of H defects in CdTe. The formation energy calculations indicate that the ground state position of the H inside the CdTe lattice depends on charge state: the lowest energy position for H⁰ and H⁺ is at the bond center site, while H⁻ prefers the tetrahedral interstitial site with Cd nearest neighbors (T_Cd). We find that H in CdTe acts as an amphoteric impurity. In p-type samples, H is in a positive charge state, acting as a donor to neutralize the free holes in the valence band, and in n-type samples H acquires an electron, compensating the donors in the sample.