Full-diversity, high-rate space-time block codes from division algebras

We present some general techniques for constructing full-rank, minimal-delay, rate at least one space-time block codes (STBCs) over a variety of signal sets for arbitrary number of transmit antennas using commutative division algebras (field extensions) as well as using noncommutative division algebras of the rational field /spl Qopf/ embedded in matrix rings. The first half of the paper deals with constructions using field extensions of /spl Qopf/. Working with cyclotomic field extensions, we construct several families of STBCs over a wide range of signal sets that are of full rank, minimal delay, and rate at least one appropriate for any number of transmit antennas. We study the coding gain and capacity of these codes. Using transcendental extensions we construct arbitrary rate codes that are full rank for arbitrary number of antennas. We also present a method of constructing STBCs using noncyclotomic field extensions. In the later half of the paper, we discuss two ways of embedding noncommutative division algebras into matrices: left regular representation, and representation over maximal cyclic subfields. The 4/spl times/4 real orthogonal design is obtained by the left regular representation of quaternions. Alamouti's (1998) code is just a special case of the construction using representation over maximal cyclic subfields and we observe certain algebraic uniqueness characteristics of it. Also, we discuss a general principle for constructing cyclic division algebras using the nth root of a transcendental element and study the capacity of the STBCs obtained from this construction. Another family of cyclic division algebras discovered by Brauer (1933) is discussed and several examples of STBCs derived from each of these constructions are presented.     

High-efficiency LEDs of 1.6–2.4 µm spectral range for medical diagnostics and environment monitoring

High efficient LED structures covering the spectral range of 1.6–2.4 μm have been developed on the basis of GaSb and its solid solutions. The electroluminescent characteristics and their temperature and current dependences have been studied. The radiative and nonradiative recombination mechanisms and their effect on the quantum efficiency have been investigated. A quantum efficiency of 40–60% has been obtained in the quasi-steady mode at room temperature. A short-pulse optical power of 170 mW was reached. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 37, No. 8, 2003, pp. 996–1009. Original Russian Text Copyright ? 2003 by Stoyanov, Zhurtanov, Astakhova, Imenkov, Yakovlev.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.     

Sigma-delta modulators operating at a limit cycle

A new type of sigma-delta modulator that operates in a special mode named limit-cycle mode (LCM) is proposed. In this mode, most of the SDM building blocks operate at a frequency that is an integer fraction of the applied sampling frequency. That brings several very attractive advantages: a reduction of the required power consumption per converted bandwidth, an immunity to excessive loop delays and to digital-analog converter waveform asymmetry and a higher tolerance to clock imperfections. The LCMs are studied via a graphical application of the describing function theory. A second-order continuous time SDM with 5 MHz conversion bandwidth, 1 GHz sampling frequency and 125 MHz limit-cycle frequency is used as a test case for the evaluation of the performance of the proposed type of modulators. High level and transistor simulations are presented and compared with the traditional SDM designs.     

Fabrication, assembly, and characterization of molecular electronic components

One of the ultimate miniaturizations in nanotechnology is molecular electronics, where devices will consist of individual molecules. There are many complications associated with the use of molecules in electronic devices, such as the electronic perturbations in the molecule associated with being bonded to an electrode, how electrons traverse the metal-molecule junction, and the difficulty of macroscopically addressing single to very few molecules. Whether fabricating a test structure or a usable device, the use of self-assembly is fundamental to the fabrication of molecular electronic devices. We will discuss how to fabricate self-assembled monolayers into test assemblies and how to use intermolecular interactions to direct molecules into desired positions to create nanostructures and to connect functional molecules to the outside world. These assemblies serve as test structures for measurements on single or bundled molecules. The development of several experimental techniques, including various scanning probes, mercury drop junctions, break junctions, nanopores, crossed wires, and other techniques using nanoparticles have enabled the ability to test these structures and make reproducible measurements on single molecules. Many of these methods have been developed to test molecules with potential for integration into devices such as oligo (phenylene-ethynylene) molecules and other /spl pi/-conjugated molecules, in ensemble or single-molecule measurements.     

On optimal sequential prediction for general processes

This paper considers several aspects of the sequential prediction problem for unbounded, nonstationary processes under pth power loss /spl lscr//sub p/(u,v)=|u-v|/sup p/, 1相似文献   

Application of convolutional error correcting codes in ultrawideband M-ary PPM signaling

The interference issues related to ultrawideband (UWB) radio pose tight restrictions on the maximum data rate of UWB radio telecommunication systems. A possible solution is to reduce the required signal to interference ratio (SIR) that gives satisfactory performance to the UWB system. In this letter, we propose coded M-ary UWB radio communication systems. Two classes of convolutional codes, namely, low-rate superorthogonal codes and high-rate punctured codes are considered for this purpose. Simulation results on the bit error rate of the proposed system indicates that the system is capable to work in lower SIR's and therefore supports higher data transmission rates in a real interference environment compared to the previously proposed UWB communication systems.     

Reducible rank codes and their applications to cryptography

We present a new family of so-called reducible rank codes which are a generalization of rank product codes . This family includes maximal rank distance (MRD) codes for lengths n>N in the field F/sub N/. We give methods for encoding and decoding reducible rank codes. A public key cryptosystem based on these codes and on the idea of a column scrambler is proposed. The column scrambler "mixes" columns of a generator (parity-check) matrix of a code. It makes the system more resistant to structural attacks such as Gibson's attacks. Possible attacks on the system are thoroughly studied. The system is found to be secure against known attacks for public keys of about 16 kbits and greater.     

A multiwinding modeling method for high frequency transformers and inductors

This paper presents a method to obtain an electric model for transformers and inductors, including both frequency and geometry effects in the windings, which can be linked with existing core models. One-dimensional distributions for magnetic and electric fields are assumed, and from Maxwell's equations an equivalent electric circuit is easily obtained. This equivalent circuit has been included in analog simulators (Spice, AnalogWorkBench, Saber ...), and comparisons between measured and simulated results are shown, both in time domain and in AC sweep, which verify the model accuracy. The model described in this paper allows designers to deal with key issues in the design of high-frequency magnetic components (copper losses, leakage inductance, skin and proximity effects) by using analog simulators, which are usually more familiar to them than finite-element analysis tools.