Computer simulation of the growth of heterostructure systems

We have investigated the growth of heterostructures with high lattice mismatch and the growth of quantum wires on the top of ridges and through shadowing masks. Simulations are performed within a Monte Carlo scheme using tetrahedral lattice structure of semiconductor materials. It is shown that results of different simulations present similarities that we attribute to the primary role of kinetic effects as the driving force during epitaxial growth. The formation of 3D islands showing (111) facets, or (111) side walls when depositing through a shadowing mask, has been observed. The facets are of better quality than the top (001) surface because of the higher mobility of atoms on these facets.     

Electromagnetic shielding of HF lamps using wire structures:simulation and measurement

High-frequency (HF) operated lamps, such as HF fluorescent lamps, have several advantages over conventional ones but they contaminate the environment with their EM field emissions. The shielding of the electromagnetic emission should be realized without much effect on the emission of the light. Enclosing the lamps in a housing made of widely spaced thin wires could be an appropriate way to shield the electromagnetic field. The paper studies the effectiveness of some wire structures for shielding the electromagnetic emission from HF fluorescent lamps. An analytical study, method of moments (MoM), and measurements have been carried out to evaluate the strength of the near-field and the shielding effectiveness of the structures     

Performance of the PAC optical packet network

For multiuser packet communications with unpredictable user demands (e.g., in a local or metropolitan area network), coordination and control of access to the frequency-division multiplexing (FDM) channels are difficult. B. Glance (J. Lightwave Technol., vol.10, pp.1323-1328, Sep 1992) proposed using a simple protection-against-collision (PAC) circuit to solve this media access problem and achieve full optical connectivity. The PAC system has the potential to interconnect hundreds of ports, each transmitting at several gigabits per second. Performance aspects of the PAC optical packet network are discussed here. The delay-throughout performance of this network is analyzed for uniform traffic patterns. The results show that in geographically distributed applications the maximum achievable throughput (normalized to the transmission rate) is typically between 0.4 and 0.5 per channel. In a centralized switch the (normalized) maximum achievable throughput can approach 0.8 per channel     

Spatial retardation of carrier heating in scaled 0.1-μmn-MOSFET's using Monte Carlo simulations

A comprehensive Monte Carlo simulator is employed to investigate nonlocal carrier transport in 0.1 μm n-MOSFET's under low-voltage stress. Specifically, the role of electron-electron (e-e) interactions on hot electron injection is explored for two emerging device designs biased at a drain voltage V_d considerably less than the Si/SiO₂ injection barrier height φ_b. Simulation of both devices reveal that 1) although qV_d<φ_b, carriers can obtain energies greater than φ_b, and 2) the peak for electron injection is displaced approximately 20 nm beyond the peak in the parallel channel electric field. These phenomena constitute a spatial retardation of carrier heating that is strongly influenced by e-e interactions near the drain edge. (Virtually no injection is observed in our simulations when e-e scattering is not considered.) Simulations also show that an aggressive design based on larger dopant atoms, steeper doping gradients, and a self-aligned junction counter-doping process produces a higher peak in the channel electric field, a hotter carrier energy distribution, and a greater total electron injection rate into the oxide when compared to a more conventionally-doped design. The impact of spatially retarded carrier heating on hot-electron-induced device degradation is further examined by coupling an interface state distribution obtained from Monte Carlo simulations with a drift-diffusion simulator. Because of retarded carrier heating, the interface states are mainly generated further over the drain region where interface charge produces minimal degradation. Thus, surprisingly, both 0.1 μm n-MOSFET designs exhibit comparable drain current degradation rates     

Electrical characterization of very-narrow-gap bulk HgCdTe single crystals by variable magnetic field hall measurements

Variable-magnetic-field Hall measurements (0 to 1.5 T) are performed on very-narrow-gap bulk-grown Hg_1−xCd_xTe single crystals (0.165 ≤ x ≤ 0.2) at various temperatures (10 to 300K). The electron densities and mobilities are obtained within the one-carrier (electrons) approximation of the reduced-con-ductivity-tensor scheme. The present data together with the selected data set reported by other workers exhibit a pronounced peak when the electron mobility is plotted against the alloy composition x-value which has been predicted to be due to the effective-mass minimum at the bandgap-crossing (E_g ≈ 0). The observed position (x ≈ 0.165), height (≈4 x 10² m²Vs), and width (≈0.01 in x) of the mobility-peak can be explained by a simple simulation involving only ionized-impurity scattering. A lower bound of the effective mass is introduced as a fitting parameter to be consistent with the finiteness of the observed electron mobility and is found to be of the order of 10⁻⁴ of the mass of a free electron.     

Photolithographic packaging with selectively occupied repeatedtransfer (PL-Pack with SORT) for scalable film optical linkmultichip-module (S-FOLM)

"Photolithographic packaging (PL-pack) with selectively occupied repeated transfer (SORT)" is proposed for optoelectronic microsystem integration. PL-pack with SORT integrates different types of thin-film device pieces into one substrate with desired configurations using an all-photolithographic process. A process design example is presented for a scalable film optical link multichip-module (S-FOLM). A preliminary estimation reveals that PL-Pack with SORT will achieve III-V epitaxial material saving of <1/100 and module cost reduction of <1/10, compared with flip-chip-bonding-based packaging. The result indicates that the process will save on cost and resources simultaneously. A critical issue is how to simplify the procedure for distributing thin-film device pieces onto a substrate. SORT is found to reduce the distribution step count typically by factor of <1/10-1/10000 compared with the conventional one-by-one method. PL-pack with SORT will be extended to the 3R process (reduce, reuse, recycle), which is generally applied to a variety of device/module fabrications     

Pseudo-Strong Regularity Around a Set

A generalization of strong regularity around a vertex subset C of a graph Γ, which makes sense even if Γis non-regular, is studied. Such a structure appears, together with a kind of distance-regularity around C , when an spectral bound concerning the so-called predistance polynomial of C is attained. As a main consequence of these results, it is shown that a regular (connected) graph Γwith d + 1 distinct eigenvalues is distance-regular, and its distance- d graph Γ d is strongly regular with parameters a = c , if and only if the number of vertices at distance d from each vertex satisfies an expression which depends only on the order of Γand the different eigenvalues of Γ.     

Unique ESD failure mechanisms during negative to Vcc HBM tests

HBM ESD tests on two types of 0.6 μm DRAM devices showed that internal circuit or output driver failures would occur after the input or I/O pins were ESD stressed negative with respect to Vcc at ground. These failures occurred at lower than expected ESD stress voltages due to power-up circuit interactions that either turned-on unique internal parasitic ESD current paths or disrupted the normal operation of the output pin’s ESD protection circuit. ESD analysis found there exists a set of power-up sensitive circuits and if placed near a Vcc bond pad can result in low voltage ESD failures.     

Analysis of intensity interference caused by cross-phase modulationin dispersive optical fibers

Under a set of broadly justified simplifying assumptions, an analytical approach to the problem of cross phase modulation in optical fibers is presented. Simple analytical expressions describing intensity interference caused by cross-phase modulation (XPM) are derived. It turns out that within a physically realizable range of parameters the power penalties induced by XPM have a linear dependence on the power of the interfering signal. Examples of specific systems are presented and discussed