一种零知识证明协议的安全分析与改进

论文指出了文献[1]中的零知识证明协议在公钥参数选取上的安全漏洞,并从求解离散对数的角度进行了分析证明。然后吸取了DSA数字签名算法中安全密钥选取高效简单的优点,提出了一种比Schnorr身份识别方案快1／3的简单、安全、高效的零知识证明身份识别方案。     

网络安全事件的关联分析方法的比较研究

随着当前攻击手段和技术的日益复杂化,一次入侵事件往往需要多个步骤才能完成,这些步骤都是彼此相关的。但是传统的入侵检测集中于检测底层的入侵或异常,所检测到的结果也仅仅是一次完整入侵的一部分,所以不能将不同的报警结合起来以发现入侵的逻辑步骤或者入侵背后的攻击策略。关联分析技术将不同分析器上产生的报警进行融合与关联分析,极大地减少了报警的数量,降低了入侵检测的误报率,并且适当的减少了入侵检测的漏报率。文中在对网络安全事件关联分析方法的系统结构进行分析后,着重介绍了当前比较流行的几种网络安全事件关联分析方法,最后对各种方法进行了比较研究。     

信息系统灾难恢复能力评估方法研究

论文提出了一种信息系统灾难恢复能力评估方法:信息资产分析方法、本地灾难恢复和远程灾难恢复等级的划分方法,并在此基础上,利用AHP层次分析法,构建了一套灾难恢复能力评估指标体系。该方法可以使评估结果具有更好的针对性和全面性。     

基于击键动力学和口令的双因素用户验证

提出基于击键动力学和口令的一种新的身份验证方法，该方法监视用户在输入口令时的用户击键特征的有关数据，通过采用监视键盘输入时一种新的三键持续时间的击键特征表示，用一种表示用户节奏的相对击键速度的距离衡量方式，在正常样本上建立用户模式，然后用新样本与用户模式的距离匹配情况来验证用户身份的合法性。实验表明该方法简单实用，识别效率高。     

"十一五"规划国家级重点通信项目

《信息产业科技发展“十一五”规划》提出设立部分重大项目,力争实现重点突破,形成一批具有自主知识产权的核心技术和创新产品,打造较为完整的产业链,形成世界一流的产业群。这其中,与通信相关的重点项目主要有:宽带无线移动通信、下一代网络、家庭网络、智能终端、数字电视等。本部分将对我国在以上领域的现状、项目的具体内容和目标、实现这些目标的具体计划以及相关厂商在各领域的努力和成绩进行介绍。     

Finding all hops shortest paths

In this letter, we introduce and investigate a new problem referred to as the All Hops Shortest Paths (AHSP) problem. The AHSP problem involves selecting, for all hop counts, the shortest paths from a given source to any other node in a network. We derive a tight lower bound on the worst-case computational complexities of the optimal comparison-based solutions to AHSP.     

Study of Disk-Loaded Waveguide Filled with Plasma

Recently disk-loaded waveguide has been widely used in high-power traveling wave tubes (HPTWT). It has been shown in many experiments that the interaction efficiency and output power can be increased greatly by injecting plasma into the vacuum microwave device. Using field analysis, the dispersion characteristics and the interaction impedance of the disk-loaded waveguide filled with plasma are analyzed in a strong longitudinal magnetic field. In conclusion, the frequency of the TM₀₁ mode increases as the density of the plasma increases. It also can be found when the plasma density increases to a large scale, the TM₀₁ mode of the disk-loaded waveguide overlaps the TG mode, these two modes couple each other and form the new hybrid modes.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

A novel compact ring dual-mode filter with adjustable second-passband for dual-band applications

In this letter, a novel compact ring dual-mode with adjustable second-passband for dual-band applications are presented. A ring resonator with two different geometric dimensions are derived and designed to have identical fundamental and the first higher-order resonant frequencies, and to establish appropriate couplings in the structure. Moreover, the proposed filter has smaller size as compared with the basic topology of stopband filters and stepped-impedance-resonator (SIR) filters. The measured filter performance is in good agreement with the simulated response.     

一种PDMS薄膜型微阀的制备与性能分析

通过厚胶光刻工艺在硅片上制备SU-8胶模板，利用该模板制备了高分子聚合物PDMS(Polvdimethvlsiloxane，聚二甲基硅氧烷)微流道和薄膜结构。通过对不同结构的两层PDMS的不可逆粘接得到一种简单的阀结构，在外加气源压力作用下薄膜产生变形实现对微流道的控制。实验测量了微阀的控制气源压力与被控制液体流量之间的关系，说明膜阀的开闭性能良好。根据弹性薄膜的变形理论，对影响微阀性能的参数进行了分析，并提出了几种可行的用于薄膜微阀控制的方法。