球栅阵列倒装焊封装中的热应变值的测试

利用高温云纹实验方法测试球栅阵列(BGA)封装焊点的热应变,采用硅橡胶试件光栅复制技术,使测试环境温度提高到200℃.通过实时热应变测量,得到各焊点的热应变关系以及封装材料、电路板各部分的热应变分布状况,为研究集成电路封装组件焊点的建模和热疲劳破坏机理提供了可靠的实验依据.     

雷达目标特征提取的一种方法

将小波变换和马氏距离相结合，提出了一种基于ISAR成像的雷达目标特征提取方法。对ISAR成像数据进行正交二进Symlet小波分解和门限处理，对数据进行压缩，然后计算压缩后坐标点的马氏（Mahalanobis)距离，得到目标稳定的特征向量。由实验结果看出，此向量具有在一定范围内的不变性，能够用于雷达目标识别。     

An experimental study of dynamic tensile properties of glass fiber at low-temperatures

Tensile impact experiments of EC8.0−24×7 glass fiber bundles at different low temperaturesT(14°C, −40°C and −10°C) and strain rates ɛ were carried out, and complete stress-strain curves were obtained. Within the range of the experiment temperatures and strain rates, it is found that the initial modulusE, the ultimate strength σ_max and the unstable strain ɛ _b of the glass fiber bundles all increase with ɛ at an identicalT. At an identical ɛ, with the decrease ofT, E and σ_max increase; but ɛ _b increases when 10°C>T>−40°C and decreases when −40°C>T>−100°C. The strain-rate- and temperature-dependent bimodal Weibull statistical constitutive theory was adopted for the statistical analysis of the experimental results, and the Weibull parameters of single fiber were obtained. The results show that the bimodal Weibull distribution function is suitable to represent the strength distribution of the glass fiber at low temperature and different strain rates. The differences in the mechanical properties between EC8.0−24×7 and EC5.5−12 ×14 glass fiber bundles were also discussed. Project supported by the National Natural Science Foundation of China (No. 19772058).     

具有多重PRF的雷达回波脉冲视频仿真电路的实现

在目标回波仿真原理的基础上，给出了一种新颖的脉冲多普勒雷达目标回波视频频脉冲仿真电路。通过计数分频和计数延时技术，该电路获得了大范围可变的脉冲重复频率和高精度的脉冲时延，能对距离不断变化的动目标进行实时模拟。给出了电路的结构框图，并对设计原理作了必要说明。     

全固态多波长飞秒脉冲激光系统

利用棱镜对引进频谱空间啁啾来补偿飞秒脉冲激光二次谐波产生中的相位失配,提高了倍频效率建立了一套全固态、多波长(1065nm, 532nm,823.1nm, 402nm)飞秒脉冲激光系统自制的Nd:YVO4激光器输出532nm绿光激光,最高平均功率可达5.6W当用2.5W绿光激光泵浦时,从自制的钛宝石激光器及经BBO倍频可分别输出中心波长为823.1nm和402nm,平均功率300mW和73mW,谱宽32.3nm和5.1nm,脉宽22fs和33.3fs、重复率108MHz的近红外和蓝光激光整个系统具有结构紧凑、倍频效率高、运行稳定的特点.     

QUATERNION GENERALIZED SINGULAR VALUE DECOMPOSITION AND ITS APPLICATIONS

This paper derives a theorem of generalized singular value decomposition of quaternion matrices （QGSVD）,studies the solution of general quaternion matrix equation AXB -CYD= E,and obtains quaternionic Roth＇s theorem. This paper also suggests sufficient and necessary conditions for the existence and uniqueness of solutions and explicit forms of the solutions of the equation.     

Simulation and fabrication of carbon nanotubes field emission pressure sensors

A novel field emission pressure sensor has been achieved utilizing carbon nanotubes (CNTs) as the electron source. The sensor consists of the anode sensing film fabricated by wet etching process and multi-wall carbon nanotubes (MWNTs) cathode in the micro-vacuum chamber. MWNTs on the silicon substrate were grown by thermal CVD. The prototype pressure sensor has a measured sensitivity of about 0.17-0.77 nA/Pa (101-550 KPa). The work shows the potential use of CNTs-based field-emitter in microsensors, such as accelerometers and tactile sensors.     

梯度棒折射率分布系数的计算和验证

本文推导了用离子交换法制作的径向折射率梯度棒的g,h_4和h_6与材料特性相联系的计算公式。根据测定的材料参数,并用本文公式算出的g值与用成像法测得的g值相比较,其结果基本相符。     

等离子体氧轰击硅生成缺陷的研究

本文对等离子体氧轰击硅产生的缺陷进行了研究。发现等离子体氧轰击在硅中引入两个缺陷E₁(E_c—0.46eV)及E₂(E_c—0.04eV)。测量了缺陷的光电离截面谱,分析表明,缺陷E₂的电子声子相互作用很强,其Frank-Condon移动达0.76eV,缺陷E₁的电子声子相互作用较小,其Frank-Condon移动为0.04eV。由实验结果得到与缺陷E₁、E₂相耦合的声子模分别为hω_p⁽¹⁾=28meV,hω_p⁽²⁾=20meV。 关键词：     

A few points on omnidirectional band gaps in one-dimensional photonic crystals

The universal condition for the formation of omnidirectional band gaps (OBG) in photonic crystal (PC) was derived with consideration of permeability of the materials. And it was found that there are four kinds of PCs: one of them has no OBG, and one always possesses OBG. For the other two kinds of PCs, there are OBG for only TM or TE waves respectively. Moreover, in all PCs, the OBG can be broadened by decreasing the refractive index of the ambient medium or/and increasing the contrast between the wave impedances of the component materials of the PC. PACS 42.70.Qs; 71.20.Tx