Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Finding structure in audio for music information retrieval

This paper presents a brief overview of recent approaches to two problems in music information retrieval: query by example and automated source separation. It describes the challenges inherent in musical query by example and the systems that take very different approaches to the problem. The paper also explores approaches to source separation in a musical context, focusing on systems that take distinct approaches to the problem. Finally, it comments about the future directions for digital signal processing (DSP) research in the context of music information retrieval.     

Protecting local access telecommunications networks: Toward a minimum-cost solution

The problem of designing fibre-optic networks for local-access telecommunications generates (at least) three non-trivial subproblems. In the first of these subproblems one must determine how many fibre-optic cables (fibres) are required at either end of a street. In the next subproblem a minimum-cost network must be designed to support the fibres. The network must also provide distinct paths from either end of the street to the central exchange(s). Finally, the fibre-optic cables must be placed in protective covers. These covers are available in a number of different sizes, allowing some flexibility when covering each section of the network. In this paper we describe a dynamic programming (DP) formulation for finding a minimum-cost (protective) covering for the network (the third of the subproblems). This problem is a generalised set covering problem with side constraints and is further complicated by the introduction of fixed and variable welding costs. The DP formulation selects covers along each arc (in the network), but cannot exactly model the fixed costs and so does not guarantee optimality. We also describe an integer programming (IP) formulation for assessing the quality of the DP solutions. The cost of the networks constructed by the IP model is less than those designed using the DP model, but the saving is not significant for the problems examined (less than 0.1%). This indicates that the DP model will generally give very good solutions. Furthermore, as the problem dimensions grow, DP gives significantly better solution times than IP.     

Fabrication, assembly, and characterization of molecular electronic components

One of the ultimate miniaturizations in nanotechnology is molecular electronics, where devices will consist of individual molecules. There are many complications associated with the use of molecules in electronic devices, such as the electronic perturbations in the molecule associated with being bonded to an electrode, how electrons traverse the metal-molecule junction, and the difficulty of macroscopically addressing single to very few molecules. Whether fabricating a test structure or a usable device, the use of self-assembly is fundamental to the fabrication of molecular electronic devices. We will discuss how to fabricate self-assembled monolayers into test assemblies and how to use intermolecular interactions to direct molecules into desired positions to create nanostructures and to connect functional molecules to the outside world. These assemblies serve as test structures for measurements on single or bundled molecules. The development of several experimental techniques, including various scanning probes, mercury drop junctions, break junctions, nanopores, crossed wires, and other techniques using nanoparticles have enabled the ability to test these structures and make reproducible measurements on single molecules. Many of these methods have been developed to test molecules with potential for integration into devices such as oligo (phenylene-ethynylene) molecules and other /spl pi/-conjugated molecules, in ensemble or single-molecule measurements.     

On optimal sequential prediction for general processes

This paper considers several aspects of the sequential prediction problem for unbounded, nonstationary processes under pth power loss /spl lscr//sub p/(u,v)=|u-v|/sup p/, 1相似文献   

Stability analysis of a feedback-controlled resonant DC-DC converter

This paper reports on the stability analysis of one member of a dual-channel resonant DC-DC converter family. The study is confined to the buck configuration in symmetrical operation. The output voltage of the converter is controlled by a closed loop applying constant-frequency pulsewidth modulation. The dynamic analysis reveals that a bifurcation cascade develops as a result of increasing the loop gain. The trajectory of the variable-structure piecewise-linear nonlinear system pierces through the Poincare plane at the fixed point in state space when the loop gain is small. For stability criterion the positions of the characteristic multipliers of the Jacobian matrix belonging to the Poincare map function defined around the fixed point located in the Poincare plane is applied. In addition to the stability analysis, a bifurcation diagram is developed showing the four possible states of the feedback loop: the periodic, the quasi-periodic, the subharmonic, and the chaotic states. Simulation and test results verify the theory.     

From Poldhu to the Italian station of Coltano: Marconi and the first years of transcontinental wireless

This paper presents the evolution of low-frequency, high-power transcontinental transmission, starting from the first successful transatlantic link from Poldhu up to the Italian transcontinental station of Coltano. The trend toward higher and higher transmitting power, and the dead end into which wireless was heading if it were not for research in the higher frequency ranges, are pointed out.     

Reducible rank codes and their applications to cryptography

We present a new family of so-called reducible rank codes which are a generalization of rank product codes . This family includes maximal rank distance (MRD) codes for lengths n>N in the field F/sub N/. We give methods for encoding and decoding reducible rank codes. A public key cryptosystem based on these codes and on the idea of a column scrambler is proposed. The column scrambler "mixes" columns of a generator (parity-check) matrix of a code. It makes the system more resistant to structural attacks such as Gibson's attacks. Possible attacks on the system are thoroughly studied. The system is found to be secure against known attacks for public keys of about 16 kbits and greater.     

Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta

Passivated single damascene copper SiO₂ damascene lines were evaluated in combination with TiSiN and Ta(N)/Ta diffusion barriers. Leakage current, breakdown and time-dependent dielectric breakdown properties were investigated on a wafer level basis for temperatures ranging between room temperature and 150 °C. It is found that the leakage performance of the wafers with a TiSiN barrier is better at room temperature, but at 150 °C the performance levels out with Ta(N)/Ta. Time-dependent dielectric breakdown measurements at 150 °C show that the lifetime of the interconnect is higher with the selected Ta(N)/Ta barrier than for TiSiN.