二阶Volterra系统对平稳正态激励的统计响应的表示定理的数学证明

1974年,Neal根据Kac和Siegert的思想,给出了一个在电子工程、海洋工程、建筑工程、航空工程、自动控制的随机振动中有重要应用的二阶Volterra非线性系统对平稳正态输入的统计响应的表示定理.1984年,Naess对此定理又给出了一个数学证明.经过研究后发现,他们对定理条件的叙述都是模糊的,而且其数学证明都是有问题的.本文重新讨论了这个表示定理,给出了明确的定理条件及严格的数学证明,为它的广泛应用奠定了理论基础.     

VOn±(n=0,1,2)的势能函数与光谱常数研究

用密度泛函B3LYP/6-311++G(d,p)方法和相对论有效实势(Lanl2dz基组)对VO^n±(n=0,1,2)分子离子的势能函数及光谱常数进行了分析. 结果表明它们都能稳定存在, 其基态电子状态分别是:⁴Σ(VO^2-), ³Σ(VO^-), ⁴Σ(VO), ³Σ(VO⁺)和²Σ(VO²⁺). 其中VO^2-和VO²⁺的势能函数曲线呈“火山口”型, 属于亚稳态分子离子. 用七参数Murell-Sorbie势拟合VO^2-和VO²⁺分子亚稳态双原子分子离子势能函数, 发现其拟合曲线与势能函数曲线符合得很好. 同时,讨论了电荷对势能函数和能级的影响. 关键词： 分子离子 密度泛函理论 势能函数 能级     

理想微裂纹系统中的随机扩展效应

本文讨论了在理想微裂纹系统中,由于微裂纹的随机性扩展,对微裂纹统计演化产生的效应。文中提供了一般的理论框架,给出了便于处理的转移概率的表达式。最后,用数值计算的例子展示了随机模型的统计演化特征,并比较了与确定性扩展模型下统计演化的异同。     

Preparation, characterization and photocatalytic activity of polycrystalline Bi2O3/SrTiO3 composite powders

Bi₂O₃/SrTiO₃ composite powders have been prepared and their photocatalytic activities were investigated by photooxidation of methanol. These powders were characterized by UV-Visible diffuse reflectance spectra, SEM and X-ray diffraction (XRD). The results revealed that all the Bi₂O₃/SrTiO₃ composite powders exhibited higher photocatalytic activity than pure SrTiO₃, Bi₂O₃ and TiO₂ (P25) under visible light irradiation (λ>440 nm). The effects of the Bi₂O₃ contents on the photocatalytic activities of the composite powders were examined, the photocatalytic activities increased with the content of Bi₂O₃ increasing to a maximum of 83% and then decreased under visible light irradiation. The effects of the calcination temperatures on the photocatalytic activities of the composite powders were also investigated.     

Non-destructive evaluation of residual stresses in thin films via x-ray diffraction topography methods

Quantitative x-ray diffraction topography techniques have been used to measure the residual strain magnitude and uniformity of deposition for Mo and W sputtered films on Si(100) substrates. High sensitivity rocking curve measurements were able to determine differential strains for films as thin as 2.5 nm; while Bragg angle contour mapping had similar sensitivity and was also able to assess coating uniformity and stress distribution over areas covering a whole wafer. Measurements of strain versus film thickness over a range of 2.5 nm to 80 nm showed that a critical thickness exists for maximum residual strain. Growth beyond this range produces stress relaxation. This non-destructive type of analysis could be employed on a wide range of film-substrate combinations.     

Effect of nonlinear wave-current interaction on flow fields and hydrodynamic forces

A fifth-order theory for solving the problem of interaction between Stokes waves and exponential profile currents is proposed. The calculated flow fields are compared with measurements. Then the errors caused by the linear superposition method and approximate theory are discussed. It is found that the total wavccurrent field consists of pure wave, pure current and interaction components. The shear current not only directly changes the flow field, but also indirectly does so by changing the wave parameters due to wave-current interaction. The present theory can predict the wave kinematics on shear currents satisfactorily. The linear superposition method may give rise to more than 40% loading error in extreme conditions. When the apparent wave period is used and the Wheeler stretching method is adopted to extrapolate the current, application of the approximate theory is the best. Project supported by the Chinese Academy of Sciences.     

3mm波段极近距离雷达

提出一种极近距离雷达概念，并导出其作用距离公式，在此基础上研制出一台３ｍｍ波段极近距离多普勒雷达样机．试验结果表明该雷达结构简单，成本低廉，在作用距离为零点几米至几米范围内可获得较高的定距精度．     

一种新颖的半导体光放大器镀膜监控方法

本文介绍了一种在半导体光放大器镀膜过程中监测端面反射率的简单而有效的方法。理论模型的建立考虑了光放大器的漏电流和自发发射速率随载流于浓度的非线性变化，并且基于实验测量的ＰＩ（输出功率与注入电流）曲线，采用曲线拟合的方法来修正一些依赖于器件的参数，理论计算结果与有关文献的测量结果较好地吻合。     

一种红外成像系统作用距离试验评估方法

进行红外成像系统作用距离考核试验时，由于外场试验中的目标特性及气象条件与指标提出对应的目标特性及气象条件有差别，因此需要进行必要的折算。提出一种基于信噪比准则的可行的红外成像系统作用距离试验评估方法。     

SMT互连组件在热循环中的可靠性预计模型

电子设备中表面安装器件和电路基板以及焊接材料的热膨胀系数差异,使得SMT互连组件在热循环条件下产生热膨胀失配,在焊接处产生热应力,在长时间的交变应力的作用下,焊接处遭到疲劳破坏而使设备工作失效,这就是SMT互连组件在热循环条件下的基本失效机理。文中还介绍了美国MIL—HDBK—217F NOTICE Ⅱ公布的表面安装连接组件可靠性预测lSMT模型。给出一系列具有实用价值的参数。