微杯电子纸及其后加工制程

SiPix利用独特的微杯(Microcup)结构和顶部灌注封装技术，通过连续整卷高速涂布的制程成功地制造出高性能的双稳性、装填电泳微粒的电子纸。SiPix可提供下列两种规格形式任意的EPD卷式成品：(A)用于有源矩阵EPD和直接驱动产品的可剥离保护膜／已灌装及密封的Microcup／无图案导体膜夹层卷；及（P）用于无源矩阵的行导体膜／已灌装及密封的Microcup／列导体膜夹层卷。已经开发出将EPD卷制成不同的显示模块或产品的简单的后续加工制程。     

基于有限状态的全周期序列混沌映射的研究

在有限长度的数字计算机中，混沌迭代序列是一个有限周期序列，其相关性能远远低于理想序列。基于skew tent映射，提出一种离散化的有限状态混沌映射，它允许精确的数值计算，没有舍入误差，通过选择合适的参数，映射能产生全周期长度的序列。仿真实验表明，归一化的序列平均周期对计算机精度不敏感，生成的二进制序列具有良好的相关性能。     

MRC分集接收的MQAM在Nakagami信道上的性能分析

Nakagami信道是一种适应性较强的信道模型，MQAM(M-ary quadrature amplitude modulation)是一种频谱利用率较高的调制方式。在存在多径影响的无线通信环境中，最大比合并(maximum ratio combining)方式的分集接收是克服衰落的有效方法。本文利用适用范围更广的Nakagami信道模型，在多径衰落的情况下对最大比合并分集接收的MQAM系统误符号率性能作了分析。仿真结果对分析实际信道下具体系统的性能具有一定的参考价值。     

An adaptive p-persistent MAC scheme for multimedia WLAN

The letter proposes an adaptive p-persistent-based (APP) medium access control (MAC) scheme for the IEEE 802.11e distributed WLAN supporting multimedia services. The APP MAC scheme adaptively gives differentiated permission probabilities to transmission stations which are in different access category and with various waiting delay. Simulation results show that the APP MAC scheme can improve the performance of multimedia WLAN, such as small voice packet dropping probability, low delay variation, and high system throughput, compared to conventional MAC algorithms     

射频电缆组件组装工艺浅谈

近年来国内外射频电缆组件的发展很快,射频电缆组件的性能不断提高,对射频电缆组件组装工艺也提出了更高的要求.射频电缆组件组装过程多是手工操作,产品的一致性及性能很难控制,要求有良好的工艺保证,为此介绍了射频电缆组件组装工艺,包括电缆的裁剪及剥皮、内导体的连接、外导体的连接和电气性能的测试;探讨了在组装过程中应注意的问题,以及针对内导体焊接易出现虚焊问题进行研究.     

含气率对PTS时压力容器内流动与传热的影响

本文对反应堆压力容器紧急安注时的流动与传热特性在1/10的模型上进行了流动可视化、局部传热系数以及混合函数的试验研究。针对三个热冲击敏感区域的部分测点,比较了环腔流速为0.5m/s、安注流速为1～30 m/s时不同含气率对下降环腔内流动与传热特性的影响,得出并分析了不同测点传热系数、混合函数的变化规律。研究结果表明:随着含气率增大,安注流体与环腔流体的混合增强;下降环腔内的含气率对小安注流速时的流动与传热影响显著,而对大安注流速时影响较小。     

ESD protection design to overcome internal damage on interface circuits of a CMOS IC with multiple separated power pins

This paper reports a real case of electrostatic discharge (ESD) improvement on a complementary metal oxide semiconductor integrated circuit (IC) product with multiple separated power pins. After ESD stresses, the internal damage have been found to locate at the interface circuit connecting between different circuit blocks with different power supplies. Some ESD designs have been implemented to rescue this IC product to meet the required ESD specification. By adding only an extra ESD clamp N-channel metal oxide semiconductor with a channel width of 10 /spl mu/m between the interface node and the ground line, the human-body-model (HBM) ESD level of this IC product can be improved from the original 0.5 to 3 kV. By connecting the separated vertical sync signal (VSS) power lines through the ESD conduction circuit to a common VSS ESD bus realized by the seal ring, the HBM ESD level of the enhanced version IC product with 12 separated power supplies pairs can be significantly improved from original 1 kV up to > 5 kV, without the noise coupling issue.     

Using buried capacitor in LTCC-MLC balun

A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation     

A study of density in electron-cyclotron-resonance plasma

A theory is developed for the density profile of low temperature plasmas confined by applied magnetic field and an experiment of the electron-cyclotron-resonance (ECR) plasma is conducted to compare the theoretical prediction and experimental measurements. Due to a large electron mobility along the magnetic field, electrons move quickly out of the system, leaving ions behind and building a space charge potential, which leads to the ambipolar diffusion of ions. In a steady-state condition, the plasma generation by ionization of neutral molecules is in balance with plasma loss due to the diffusion, leading to the electron temperature equation, which is expressed in terms of the plasma size, chamber pressure, and the ionization energy and cross section of neutrals. The power balance condition leads to the plasma density equation, which is also expressed in terms of the electron temperature, the input microwave power and the chamber pressure. It is shown that the plasma density increases, reaches its peak and decreases, as the chamber pressure increases from a small value (0.1 mTorr). These simple expressions of electron temperature and density provide a scaling law of ECR plasma in terms of system parameters. After carrying out an experimental observation, it is concluded that the theoretical predictions of the electron temperature and plasma density agree remarkably well with experimental data