A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.     

Colloidal adhesion of phospholipid vesicles: high-resolution reflection interference contrast microscopy and theory

High-resolution reflection interference contrast microscopy (HR-RICM) was developed for probing the deformation and adhesion of phospholipid vesicles induced by colloidal forces on solid surfaces. The new technique raised the upper limit of the measured membrane–substrate separation from 1 to 4.5 μm and improved the spatial resolution of the heterogeneous contact zones. It was applied to elucidate the effects of wall thickness, pH and osmotic stress on the non-specific adhesion of giant unilamellar vesicles (ULV) and multilamellar vesicles (MLV) on fused silica substrates. By simultaneous cross-polarization light microscopy and HR-RICM measurements, it was observed that ULV with the wall thickness of a single bilayer would be significantly deformed in its equilibrium state on the substrate as the dimension of its adhesive–cohesive zone was 29% higher than the theoretical value of a rigid sphere with the same diameter. Besides, electrostatic interaction was shown as a significant driving force for vesicle adhesions since the reduction in pH significantly increased the degree of deformation of adhering ULV and heterogeneity of the adhesion discs. The degree of MLV deformation on the solid surfaces was significantly less than that of ULV. When the wall thickness of vesicle increased, the dimension of contact zone was reduced dramatically due to the increase of membrane bending modulus. Most important, the adhesion strength of colloidal adhesion approached that of specific adhesion. Finally, the increase of osmotic stress led to the collapse of adhering vesicles on the non-deformable substrate and raised the area of adhesive contact zone. To interpret these results better, the equilibrium deformation of adhering vesicle was modeled as a truncated sphere and the adhesion energy was calculated with a new theory.     

基于弹簧管悬臂梁的FBG压力传感的研究

提出了一种等强度悬臂梁与弹簧管结合的高灵敏度的光纤布拉格光栅(FBG)压力传感器。将FBG粘贴在悬臂梁的下表面,粘贴方向与悬臂梁轴线一致。理论分析了FBG中心波长相对偏移量与压力的关系,实验测得该传感器的压力灵敏度为2.767×10-4/MPa,是裸FBG压强灵敏度系数的142倍。压力灵敏度与悬臂梁和弹簧管的几何参数有关,改变参数,可获得不同灵敏度的压力传感器。     

大功率LD封装技术的研究

提出一种新的LD列阵封装方法。把热沉形状改为台阶式，使稳态工作条件下的芯片前腔面散热速度提高，前后腔面温差大幅度降低，因此可以提高COD阈值，降低腔面退化率，且更方便于光纤耦合封装。利用Ansys软件对大功率LD稳态工作的温度分布进行模拟。结果发现：改进前的芯片前、后腔面温差为9．0K，改进后温差降为3．5K，降低了60%；热沉前、后端面的温差由原来的18．2K降为8．0K，降低了56％。     

功率型白光LED的热特性研究

大功率LED照明单元在光通量提高的同时伴随着散热，且普通功率型白光LED多采用蓝光芯片激发荧光粉的方法，随着温度的提升，荧光粉对应的波长会发生漂移。本文从功率型白光LED的发热原理出发，试验了其在脉冲源作用下，用于照明的可能性。试验表明，在此激励源的作用下，LED输出与散热很好，并从理论上进行了解释。     

环形腔高掺Er3 窄线宽光纤激光器实验研究

报道了采用光纤光栅（FBG）短直腔选频结构的环形腔窄线宽光纤激光器。采用约3m长高掺Er^3光纤，LD抽运阈值功率约为11mW，在25mW976nm有效抽运功率时输出信号功率为2．65mW，斜效率约为15％；输出激光3dB线宽小于0．01nm，20dB线宽小于0．04nm，边模抑制比（SMSR）为48dB；观察到输出信号光波长漂移范围为0．06nm。     

SOI基光学电流传感器的设计与仿真

将光纤与微电子机械系统(MEMS)技术相结合,设计了一种新颖的检测50Hz高压交流电的光学电流传感器(OCS)。用ANSYS软件分析了器件的模态、动态响应与热膨胀特性,并通过Matlab软件模拟了器件的工作性能。模拟计算表明:ANSYS与理论公式得到的结果基本一致;传感器的量程为100~3600A,对于大电流下的灵敏度可达到0.02dB/A,温度变化±50K时传感器相应的测试误差为0.2%。     

爆炸冲击的激光多普勒远距离测量技术的研究

利用激光多普勒效应和数字信号处理方法,获取爆炸冲击过程中的高速变形参数,以此作为对爆炸强度分析的依据。根据爆炸变形的特点,设计了外差式纵向激光多普勒测量系统,提出了相应的数字滤波和频谱分析的信号处理方法,实现了爆炸变形的动态测量。系统测量的位移量程为±30mm,速度量程为-10~+20m/s,测量距离为4.5m。与振动台的试验对比,位移测量相对误差小于1%。给出了圆筒钢制爆炸容器在300gTNT当量炸药爆炸过程中弹性变形的测量结果。     

基于FrFT的欠采样LFM信号分离与参数估计

基于分数阶傅里叶变换，本文提出了一种欠采样条件下的宽带与窄带线性调频信号分离与参数估计方法。该方法先由延迟相乘和牛顿迭代算法估计信号的调频斜率，然后在分数阶傅立叶变换域进行滤波，实现信号分离。最后对欠采样信号解频率模糊，估计信号的初始频率。仿真表明了该方法分离宽带与窄带线性调频信号的可行性与分离后信号参数估计的有效性。     

基于DSP56F805的直流无刷电机控制系统设计

介绍了基于Freescale公司DSP56F805的直流无刷电机控制系统的设计.DSP56F805数据处理能力强且具有丰富的专用电机控制模块,设计的控制器硬件电路简洁,控制可靠,已应用于机器人机械手控制中.对系统硬件实现和控制原理进行了详细论述.