光放大器前置可调光学滤波器

介绍Ｆ－Ｐ干涉滤波器实现中心波长可调的两种机理，给出通过改变腔距来改变中心波工的滤波器的典型结构，并且给出了相应的电压驱动电路，实验表明选择合适的光放大器前置滤波器可以提高系统的灵敏度。     

Many-body effects and electron tunneling in metal-insulator-p-type semiconductor structures

Investigation of the tunneling conductivity σ _d(V) of structures made on a highly doped, narrow-gap p-type semiconductor HgCdTe reveals an abrupt increase in this quantity at voltages corresponding to the start of tunneling into the conduction band. It is shown that the observed functions σ _d(V) cannot be described in the framework of a model based on single-particle tunneling. It is proposed that the abrupt increase in σ _d(V) is attributable to tunneling into exciton states. Fiz. Tekh. Poluprovodn. 32, 1069–1072 (September 1998)     

Integral points of P n −{2n+1 hyperplanes in general position}

Oblatum 4-VI-1990 &; 5-III-1991     

一类几乎最优循环图{C_p(m,m+1,p/a)}

本文比较了循环图类{c_p(n_1,…,n_p)}和{c-p(n_1…,n_p,p/α)}的直径下界。对于p和α满足一定条件的循环图类{c_p(n_1,n_2,p/α)},本文给出了达到或几乎达到此图类直径下界的一类几乎最优循环图{c_p(m,m+1,p/α)}。     

超声波在多糖降解及提取中的应用

本文支综合介绍了超声波在多糖降解和提取中应用的研究进展．着重对超声波在淀粉，壳多糖，细菌多糖的降解和真菌多糖的提取中的应用作了较详细的阐述．     

圆锥形零件冲压变形与成形载荷的分析

由于悬空侧壁部分的变形状态是圆锥形零件成形的关键，而径向拉应力是实现悬空部分成形的必要条件，同时也是该部分冲压成形成败的关键为此，经力学分析得出了侧壁部分径向拉应力的解析式和造成圆锥形零件破裂的最大径向拉应力的计算式。同时分析了圆锥形零件的成形载荷。     

混合方次的Waring——Goldbach问题

研究混合方次的Waring--Goldbach     

Angular and NiFe thickness dependence of exchange bias in IrMn/NiFe/IrMn thin film

Exchange biased IrMn/NiFe/IrMn thin films were studied as a function of NiFe thickness. In plane angular dependence of a resonance field distribution which is measured by FMR was analyzed as a combined effect of an unidirectional anisotropy and an uniaxial anisotropy. The unidirectional anisotropic field and the uniaxial anisotropic field were linearly varied with NiFe thickness while the films with a thicker NiFe layer do not follow the linear variation. Resonance field and linewidth variations were also analysed with NiFe thickness.     

线性递归序列模q

设{u_k}_k≥0为一个线性递归序列．序列{u_k(mod q)}_(k≥0)是周期的,很多人都对其周期有过研究．本文应用二次数域中理想的理论,较完全地刻面了二次线性递归序列模q的周期长度,所获结果加强并推广了Engstrom及Wall的结论．     

Degradation Behaviors of Metal-Induced Laterally Crystallized n-Type Polycrystalline Silicon Thin-Film Transistors Under DC Bias Stresses

Device degradation behaviors of typical-sized n-type metal-induced laterally crystallized polycrystalline silicon thin-film transistors were investigated in detail under two kinds of dc bias stresses: hot-carrier (HC) stress and self-heating (SH) stress. Under HC stress, device degradation is the consequence of HC induced defect generation locally at the drain side. Under a unified model that postulates, the establishment of a potential barrier at the drain side due to carrier transport near trap states, device degradation behavior such as asymmetric on current recovery and threshold voltage degradation can be understood. Under SH stress, a general degradation in subthreshold characteristic was observed. Device degradation is the consequence of deep state generation along the entire channel. Device degradation behaviors were compared in low V_d-stress and in high V_d-stress condition. Defect generation distribution along the channel appears to be different in two cases. In both cases of SH degradation, asymmetric on current recovery was observed. This observation, when in low V_d-stress condition, is tentatively explained by dehydrogenation (hydrogenation) effect at the drain (source) side during stress