Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

A novel compact ring dual-mode filter with adjustable second-passband for dual-band applications

In this letter, a novel compact ring dual-mode with adjustable second-passband for dual-band applications are presented. A ring resonator with two different geometric dimensions are derived and designed to have identical fundamental and the first higher-order resonant frequencies, and to establish appropriate couplings in the structure. Moreover, the proposed filter has smaller size as compared with the basic topology of stopband filters and stepped-impedance-resonator (SIR) filters. The measured filter performance is in good agreement with the simulated response.     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

激光水下成像技术及其进展

介绍了近年发展起来的三种主要的激光水下成像方法，即常规水下激光成像、高分辨率水下激光三维成像和偏振激光成像，分析了它们各自的工作原理、特点以及各自的发展状况。     

An adaptive p-persistent MAC scheme for multimedia WLAN

The letter proposes an adaptive p-persistent-based (APP) medium access control (MAC) scheme for the IEEE 802.11e distributed WLAN supporting multimedia services. The APP MAC scheme adaptively gives differentiated permission probabilities to transmission stations which are in different access category and with various waiting delay. Simulation results show that the APP MAC scheme can improve the performance of multimedia WLAN, such as small voice packet dropping probability, low delay variation, and high system throughput, compared to conventional MAC algorithms     

ESD protection design to overcome internal damage on interface circuits of a CMOS IC with multiple separated power pins

This paper reports a real case of electrostatic discharge (ESD) improvement on a complementary metal oxide semiconductor integrated circuit (IC) product with multiple separated power pins. After ESD stresses, the internal damage have been found to locate at the interface circuit connecting between different circuit blocks with different power supplies. Some ESD designs have been implemented to rescue this IC product to meet the required ESD specification. By adding only an extra ESD clamp N-channel metal oxide semiconductor with a channel width of 10 /spl mu/m between the interface node and the ground line, the human-body-model (HBM) ESD level of this IC product can be improved from the original 0.5 to 3 kV. By connecting the separated vertical sync signal (VSS) power lines through the ESD conduction circuit to a common VSS ESD bus realized by the seal ring, the HBM ESD level of the enhanced version IC product with 12 separated power supplies pairs can be significantly improved from original 1 kV up to > 5 kV, without the noise coupling issue.     

热作模具钢表面激光堆焊耐磨合金层的研究

本文主要通过在H13钢上用大功率CO_2激光束进行堆焊,阐述了激光堆焊工艺变化对堆焊组织和性能的影响,在本试验条件下,得到了高密度弥散金属化合物组织的激光堆焊层,平均硬度为HV800,与基体呈冶金结合,耐磨性比H13模具钢提高149%。     

Using buried capacitor in LTCC-MLC balun

A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation     

MIM隧道发光结的负阻现象

本文介绍了薄膜隧道发光结的基本结构、发光机理，阐述了其Ｉ－Ｖ特性中的负阻现象。简单介绍了ＭＩＭ结构负阻的几种解释，根据热像仪照片和低温测试结果分析，再结合Ｄｅａｒｍａｌｅｙ导电模型，我们提出了ＭＩＭ负阻的物理模型，理论与实验符合较好，最后分析了负阻现象的应用前景。     

经济实用的DSP电源解决方案

笔者介绍了两种低纹波的DSP电源解决方案:一为采用MAX1793和大电流EMI静噪滤波器NFM41P;二为改进的去耦p型滤波电路和大电流EMI静噪滤波器NFM41P。并对方案的特点及其实现进行了详细的解析。试验结果表明:所述方案的纹波小,仅100 mV左右;成本低,仅几十元;适用范围广,通过改变MAX1793芯片的输出电压,可将本方案移植到TI的C5000,C6000系列,且还可用于其他的脱机工作系统。