PNNI-based control plane for automatically switched optical networks

Much effort has been spent on the definition of control plane protocols for automatically switched optical networks (ASON). Most of the proposals brought into the standardization for an International Telecommunications Union-Telecommunication Sector, Internet Engineering Task Force, and Optical Internetworking Forum are based on Internet protocol concepts. One such proposal is the generalized multi-protocol label switching (GMPLS), an extension of the MPLS traffic engineering control plane model that includes nonpacket switched technologies (time, wavelength, and fiber switching). Recently, the potential use of private network-network interface (PNNI) in ASONs has been discussed as an alternative proposal by the standardization bodies. The goal of this paper is to appropriately adapt asynchronous transfer mode into an optical PNNI (O-PNNI) protocol that can be used as the control plane of ASONs. The paper also provides a critical viewpoint on the potential usage of either O-PNNI or GMPLS control plane and analyzes the pros and cons of each. The methodology adopted toward devising O-PNNI hinges on reviewing PNNI along with ASON recommendations in order to determine the set of PNNI features that require adaptation. Having identified these features we engineer and present appropriate solutions relating to routing, signaling and addressing aspects.     

Experimental real-time detector of GSM terminals

The authors present an experimental real-time GSM terminal detector, to be installed in a restricted area. The detector triggers terminal signaling, which can be captured.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.     

Self-organized public-key management for mobile ad hoc networks

In contrast with conventional networks, mobile ad hoc networks usually do not provide online access to trusted authorities or to centralized servers, and they exhibit frequent partitioning due to link and node failures and to node mobility. For these reasons, traditional security solutions that require online trusted authorities or certificate repositories are not well-suited for securing ad hoc networks. We propose a fully self-organized public-key management system that allows users to generate their public-private key pairs, to issue certificates, and to perform authentication regardless of the network partitions and without any centralized services. Furthermore, our approach does not require any trusted authority, not even in the system initialization phase.     

A multiwinding modeling method for high frequency transformers and inductors

This paper presents a method to obtain an electric model for transformers and inductors, including both frequency and geometry effects in the windings, which can be linked with existing core models. One-dimensional distributions for magnetic and electric fields are assumed, and from Maxwell's equations an equivalent electric circuit is easily obtained. This equivalent circuit has been included in analog simulators (Spice, AnalogWorkBench, Saber ...), and comparisons between measured and simulated results are shown, both in time domain and in AC sweep, which verify the model accuracy. The model described in this paper allows designers to deal with key issues in the design of high-frequency magnetic components (copper losses, leakage inductance, skin and proximity effects) by using analog simulators, which are usually more familiar to them than finite-element analysis tools.     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

Extracting Light from Polymer Light‐Emitting Diodes Using Stamped Bragg Gratings

In this paper, we describe a method for increasing the external efficiency of polymer light‐emitting diodes (LEDs) by coupling out waveguided light with Bragg gratings. We numerically model the waveguide modes in a typical LED structure and demonstrate how optimizing layer thicknesses and reducing waveguide absorption can enhance the grating outcoupling. The gratings were created by a soft‐lithography technique that minimizes changes to the conventional LED structure. Using one‐dimensional and two‐dimensional gratings, we were able to increase the forward‐directed emission by 47 % and 70 %, respectively, and the external quantum efficiency by 15 % and 25 %.     

Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta

Passivated single damascene copper SiO₂ damascene lines were evaluated in combination with TiSiN and Ta(N)/Ta diffusion barriers. Leakage current, breakdown and time-dependent dielectric breakdown properties were investigated on a wafer level basis for temperatures ranging between room temperature and 150 °C. It is found that the leakage performance of the wafers with a TiSiN barrier is better at room temperature, but at 150 °C the performance levels out with Ta(N)/Ta. Time-dependent dielectric breakdown measurements at 150 °C show that the lifetime of the interconnect is higher with the selected Ta(N)/Ta barrier than for TiSiN.     

Intelligent process analytics for CRM

Many organisations use decision models in their processes such as tables or trees to provide decision support to their operational divisions. For example, in fault management, customer contact centre operators usually use a decision model in the form of prescribed interviews. Based on the answers given by customers, the operator navigates through the decision model to reach an assessment of the problem. In order to achieve customer satisfaction and operational excellence, it is very important to constantly monitor the performance of a decision model not only on an overall level, but also on the level of individual decisions. In this paper we present a configurable business process analytics tool, known as the intelligent Universal Service Management System, that constantly monitors decision data and is capable of optimising the decisions based on high-level business objectives. We explain the various features of the software and show how it can be used to optimise decision processes. We also show how we can easily provide a customised version to monitor the performance of provision processes.