meso-四(2-羟基-5-磺酸苯基)卟啉的合成及其酸碱平衡的研究

本文对 meso-四(2-H-5-SP)P 的提纯方法进行了改进,同时以光度法研究了该试剂在水溶液中的酸碱平衡、测得其 pKa_1、pKa_2、pKa_3、pKa_4分别为2.99,4.21,8.68,10.28。     

A novel fermentation process for calcium magnesium acetate (CMA) production from cheese whey

Applied Biochemistry and Biotechnology - A novel, anaerobic fermentation process is developed to produce calcium magnesium acetate (CMA) from cheese whey. CMA can be used as a noncorrosive road...     

Reconfigurable fault tolerant networks for fast packet switching

The authors consider the design and analysis of reconfigurable networks for fast packet switching. The design constraints resulting from the use of fast packet switching that affect fault-tolerant network design are carefully studied. A reconfigurable network with high link redundancy is then proposed. An abstract replacement model that characterizes the proposed reconfigurable network is presented. Network fault tolerance problems are transformed into well known assignment problems. Two practical designs based on feasible technology are presented. An appreciable reliability improvements is achieved and full bandwidth is maintained up to a tolerable level of failures, with relatively few spare switches     

孤子掺杂光纤放大的半径典模型与分析

建立了孤子掺杂光纤放大的半经典模型，给出了分布放大透明传输的泵浦条件，详细讨论了激发态吸收的影响．文中结果为Ｅｒ￣３＋掺杂光纤孤子放大器的设计提供了重要理论依据．     

Study of coupling between circular groove guide and rectangular groove guide

On the basis of the studies of single circular groove guide and single rectangular groove guide, the coupling of the two waveguides has been researched and the characteristic equation of circular—rectangular groove guide has been given in this paper.     

射频放大器互调失真检测和载波抵消的研究

采用高功率射频信号内部互调失真的包络特性检测与比较技术,对射频功率带外信号进行检测和估计。设计用于高功率射频放大器前馈技术线性化的一个带外信号检测器。探讨如何进行射频载波抵消以及检测放大器互调失真信号。     

Protocol design for scalable and reliable group rekeying

We present the design and specification of a protocol for scalable and reliable group rekeying together with performance evaluation results. The protocol is based upon the use of key trees for secure groups and periodic batch rekeying. At the beginning of each rekey interval, the key server sends a rekey message to all users consisting of encrypted new keys (encryptions, in short) carried in a sequence of packets. We present a scheme for identifying keys, encryptions, and users, and a key assignment algorithm that ensures that the encryptions needed by a user are in the same packet. Our protocol provides reliable delivery of new keys to all users eventually. It also attempts to deliver new keys to all users with a high probability by the end of the rekey interval. For each rekey message, the protocol runs in two steps: a multicast step followed by a unicast step. Proactive forward error correction (FEC) multicast is used to reduce delivery latency. Our experiments show that a small FEC block size can be used to reduce encoding time at the server without increasing server bandwidth overhead. Early transition to unicast, after at most two multicast rounds, further reduces the worst-case delivery latency as well as user bandwidth requirement. The key server adaptively adjusts the proactivity factor based upon past feedback information; our experiments show that the number of NACKs after a multicast round can be effectively controlled around a target number. Throughout the protocol design, we strive to minimize processing and bandwidth requirements for both the key server and users.     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

铝基印制电路板制造工艺研究

此文对一种进口铝基印制电路板的制造工艺流程进行了介绍,对所采用的制造工艺技术进行了较为详细的论述。     

Low-resistance polysilicon process in contact application for high density devices

For the lowest resistance, it is required to have the epitaxial silicon contact between the silicon plug and the substrate and good step coverage at the high aspect-ratio contact holes, simultaneously. In this work, a double polysilicon (DPS) deposition technique was proposed for the requirements. The first, thin silicon layer is deposited in a single-wafer process chamber with an in-situ H₂-RTP (rapid thermal process) treatment for the epitaxial contact, and the second silicon layer is formed in a batch-type furnace for good step coverage. From chain resistance, Kelvin R_c, and current-voltage (I–V) measurement, the DPS process meets both low resistance and good uniformity, so that it suggests a breakthrough in the small-sized, semiconductor device application.