Highly reliable non-conductive adhesives for flip chip CSP applications

Non-conductive adhesives (NCA), widely used in display packaging and fine pitch flip chip packaging technology, have been recommended as one of the most suitable interconnection materials for flip-chip chip size packages (CSPs) due to the advantages such as easier processing, good electrical performance, lower cost, and low temperature processing. Flip chip assembly using modified NCA materials with material property optimization such as CTEs and modulus by loading optimized content of nonconductive fillers for the good electrical, mechanical and reliability characteristics, can enable wide application of NCA materials for fine pitch first level interconnection in the flip chip CSP applications. In this paper, we have developed film type NCA materials for flip chip assembly on organic substrates. NCAs are generally mixture of epoxy polymer resin without any fillers, and have high CTE values un-like conventional underfill materials used to enhance thermal cycling reliability of solder flip chip assembly on organic boards. In order to reduce thermal and mechanical stress and strain induced by CTE mismatch between a chip and organic substrate, the CTE of NCAs was optimized by filler content. The flip chip CSP assembly using modified NCA showed high reliability in various environmental tests, such as thermal cycling test (-55/spl deg/C/+160/spl deg/C, 1000 cycle), high temperature humidity test (85/spl deg/C/85%RH, 1000 h) and high temperature storage test (125/spl deg/C, dry condition). The material properties of NCA such as the curing profile, the thermal expansion, the storage modulus and adhesion were also investigated as a function of filler content.     

The quenching of nucleon yields in the nonmesonic weak decay of Λ -hypernuclei and the three-body weak decay process

Recent exclusive coincidence measurements of non-mesonic weak decays (NMWD) reported for the ratio of the partial decay width of neutron-induced-to-proton-induced NMWD, Γ_n/Γ_p , values of 0.45±0.11±0.03 and 0.51±0.13±0.04 for 5lam and ¹² _Λ C , respectively. These observations agree well with the improved theoretical Γ_n/Γ_p ratios which are in the range of 0.3-0.7. It appears that the long-standing discrepancy between the experimental and theoretical values of Γ_n/Γ_p has finally been solved. However, when compared to the results of intra-nuclear cascade (INC) calculations, the observed numbers of both single nucleons and coincident nucleon pairs are strongly quenched. The quenching of the proton yield observed previously has been interpreted as an increase of the Γ_n/Γ_p ratio. On the other hand, significant contributions from the two-nucleon-induced three-body process ΛNN → nNN are predicted. Indeed, the angular correlation of the emitted nucleon pairs in the NMWD of ¹² _Λ C showed not only decay events in back-to-back kinematics, but also events with non-back-to-back kinematics. In this paper we show that the difficulties to extract the correct Γ_n/Γ_p ratio from the proton spectra is related to the three-body weak-interaction process which strongly quenches the nucleon yields.     

Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications

In this paper, thermomechanical and rheological properties of nonconductive pastes (NCPs) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermomechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature (T/sub g/) and storage modulus at room temperature became higher while coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermomechanical properties such as modulus, CTE, and T/sub g/. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected and used as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.     

Interfacial structure and properties in polystyrene/epoxy bilayer films

The interfacial structure and properties of immiscible deuterated polystyrene (dPS)/epoxy bilayer films were investigated with neutron reflectivity as functions of the composition of the epoxy layer, the thickness of the dPS layer, and the annealing time. We have found that the interfacial width and its growth rate depend strongly on the compositions of the epoxy layer but only weakly on the thickness of the dPS layer. The effect of the resin/crosslinker composition on the interfacial width and its growth rate is likely due to the different near‐surface structures that result for different epoxy stoichiometries. For an ultra‐thin dPS film (thickness = 2R_g), the data suggest a slight suppression of the growth of the interfacial width that could be due to confinement effects for the long‐chain molecules such as have been previously reported for a thickness of less than approximately 4R_g, where R_g is the radius of gyration of polymer molecules. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2653–2660, 2002     

An Adaptive Framework for Forecasting Demand and Technological Substitution

This paper proposes a new model as a framework for forecasting demand and technological substitution, which can accommodate different patterns of technological change. This model, which we named, “Adaptive Diffusion Model,” is formalized from a conceptual framework that incorporates several underlying factors determining the market demand for technological products. The formulation of this model is given in terms of a period analysis to improve its explanatory power for dynamic processes in the real world, and is described as a continuous form which approximates a discrete derivation of the model. In order to illustrate the applicability and generality of this model, time-series data of the diffusion rates for some typical products in electronics and telecommunications market have been empirically tested. The results show that the model has higher explanatory power than any other existing model for all the products tested in our study. It has been found that this model can provide a framework which is sufficiently robust in forecasting demand and innovation diffusion for various technological products.     

Satellite-UMTS traffic dimensioning and resource managementtechnique analysis

The universal mobile telecommunications system (UMTS) will consist of space UMTS (S-UMTS) and terrestrial UMTS (T-UMTS) components. An algorithm for predicting the traffic capacity in terms of the number of subscribers for the satellite component of UMTS is presented. The algorithm takes into account the takeup characteristics of new products, the growth of gross domestic product (GDP), the projection of population, the tariff of the service, and price fall over the forecast period. The predicted traffic is used to generate a traffic grid in terms of Erlang of dimension 36×72 in steps of 5° in both the latitude and longitude directions. The traffic grid is used to evaluate the performance of a dynamic channel allocation (DCA) technique as, well as a fixed channel allocation (FCA) technique. Both channel allocation techniques have been considered with the queuing of handover (QH) requests. In order to compare the respective techniques' performance, a low-earth orbit mobile satellite system (LEO-MSS) mobility model is developed to take into account the effect of satellites' motion during interbeam handovers. A theoretical model for obtaining the values of blocking probabilities for low-traffic loads is presented. Finally, the performance of the DCA-QH technique is compared with the FCA-QH technique under suitably defined traffic and mobility conditions     

Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Anisotropic conductive film (ACF) has been used as interconnect material for flat-panel display module packages, such as liquid crystal displays (LCDs) in the technologies of tape automated bonding (TAB), chip-on-glass (COG), chip-on-film (COF), and chip-on-board (COB). Among them, COF is a relatively new technology after TAB and COG bonding, and its requirement for ACF becomes more stringent because of the need of high adhesion and fine-pitch interconnection. To meet these demands, strong interfacial adhesion between the ACF, substrate, and chip is a major issue. We have developed a multilayered ACF that has functional layers on both sides of a conventional ACF layer to improve the wetting properties of the resin on two-layer flex for better interface adhesion and to control the flow of conductive particles during thermocompression bonding and the resulting reliability of the interconnection using ACF. To investigate the enhancement of electrical properties and reliability of multilayered ACF in COF assemblies, we evaluated the performance in contact resistance and adhesion strength of a multilayered ACF and single-layered ACF under various environmental tests, such as a thermal cycling test (−55°C/+160°C, 1,000 cycles), a high-temperature humidity test (85°C/85% RH, 1,000 h), and a high-temperature storage test (150°C, 1,000 h). The contact resistance of the multilayered ACF joint was in an acceptable range of around a 10% increase of the initial value during the 85°C/85% RH test compared with the single-layered ACF because of the stronger moisture resistance of the multilayered ACF and flex substrate. The multilayered ACF has better adhesion properties compared with the conventional single-layered ACF during the 85°C/85% RH test because of the enhancement of the wetting to the surface of the polymide (PI) flex substrate with an adhesion-promoting nonconductive film (NCF) layer of multilayered ACF. The new ACF of the multilayered structure was successfully demonstrated in a fine-pitch COF module with a two-layer flex substrate.     

A compact V-band 2-bit reflection-type MEMS phase shifter

Air-gap overlay CPW couplers and low-loss series metal-to-metal contact microelectromechanical system (MEMS) switches have been employed to reduce the loss of reflection-type MEMS phase shifters at V-band. Phase shift is obtained by changing the lengths of the open-ended stubs using series MEMS switches. A 2-bit [135] reflection-type MEMS phase shifter showed an average insertion loss of 4 dB with return loss better than 11.7 dB from 50 to 70 GHz. The chip is very compact with a chip size as small as 1.5 mm /spl times/ 2.1 mm.     

Resynchronization of Modified JPEG Using a Power Allocation Scheme in a Direct Sequence CDMA System

In this paper, we discuss recovery schemes for errors occurring when image data encoded with variable length coding (VLC) is transmitted through additive white Gaussian noise (AWGN) and multiple–access interference in direct sequence code division multiple access (DS/CDMA) systems. VLC such as JPEG is so sensitive to channel errors that severe degradation in decoded images occurs even if only one or two bits have errors. This is due to the loss of synchronization at the image decoder. We propose a resynchronization scheme using a power allocation method in wireless DS/CDMA transmission. Through simulation, we know that the proposed method has a more robust resynchronization capability and higher objective and subjective quality than the conventional method.