首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   1571362篇
  免费   41338篇
  国内免费   15595篇
化学   685280篇
晶体学   20712篇
力学   77039篇
综合类   428篇
数学   245301篇
物理学   384460篇
无线电   215075篇
  2021年   17406篇
  2020年   19653篇
  2019年   19824篇
  2018年   15215篇
  2017年   13287篇
  2016年   32174篇
  2015年   24715篇
  2014年   36284篇
  2013年   82886篇
  2012年   44715篇
  2011年   40941篇
  2010年   43057篇
  2009年   47949篇
  2008年   43006篇
  2007年   39331篇
  2006年   46224篇
  2005年   37620篇
  2004年   38635篇
  2003年   36286篇
  2002年   37143篇
  2001年   35553篇
  2000年   31963篇
  1999年   29980篇
  1998年   28385篇
  1997年   28168篇
  1996年   27777篇
  1995年   25419篇
  1994年   24782篇
  1993年   24021篇
  1992年   23513篇
  1991年   23717篇
  1990年   22383篇
  1989年   21932篇
  1988年   21025篇
  1987年   19769篇
  1986年   18588篇
  1985年   25094篇
  1984年   26252篇
  1983年   22241篇
  1982年   23667篇
  1981年   22847篇
  1980年   22094篇
  1979年   21901篇
  1978年   23199篇
  1977年   22752篇
  1976年   22359篇
  1975年   21049篇
  1974年   20646篇
  1973年   21180篇
  1972年   15376篇
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
991.
The experimental data on observation of spontaneous and stimulated emission from thin epitaxial CdxHg1?x Te films optically pumped by Nd: YAG laser radiation are reported. A simple theoretical model is suggested to describe the initiation of population inversion under these conditions. The parameters realized under the experimental conditions are theoretically estimated.  相似文献   
992.
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported  相似文献   
993.
In this brief, the well-known switched-current (SI) filtering technique is revisited using the concept of the square-root domain (SRD) filtering. It is proved that SI filters are a subclass of the SRD filters, where sampled-data signal processing is performed. This is achieved by considering typical lossless and lossy SRD sampled-data integrator configurations, using a set of complementary SRD operators which are based on the quadratic I-V relationship of MOS transistor operated in the saturation. Circuit examples are given, where linear-domain integrator and third-order filter configurations were derived using appropriate SRD sampled-data building blocks  相似文献   
994.
Why does it pay to be selfish in a MANET?   总被引:2,自引:0,他引:2  
Routing protocols for a mobile ad hoc network have assumed that all mobile nodes voluntarily participate in forwarding others' packets. This was a reasonable assumption because all MNs in a MANET belonged to a single authority. In the near future, however, a MANET may consist of MNs that belong to many different organizations since numerous civilian applications are expected to crop up. In this situation, some MNs may run independently and purposely decide not to forward packets so as to save their own energy. This could potentially lead to network partitioning and corresponding performance degradation. To minimize such situations in MANETs, many studies have explored the use of both the carrot and the stick approaches by having reputation-based, credit-payment, and game theory schemes. This article summarizes existing schemes, identifies their relative advantages, and projects future directions  相似文献   
995.
A recent approach to solution of 2D scattering problems for electromagnetic waves scattered by thin screens is analyzed. With the use of examples of scattering by a strip and an unclosed cylindrical surface, it is shown that the proposed approach has no advantages in terms of the efficiency of numerical solution over a well-known approach based on exact integral equations for currents that have singular kernels and that are solved with the Krylov-Bogoliubov method.  相似文献   
996.
Magnetically induced non-Faraday nonreciprocity in a fiber-optic gyroscope   总被引:1,自引:0,他引:1  
Optical phase nonreciprocity is found to appear in fiber-optic gyroscopes as a result of a magnetically induced distortion of a propagating fiber mode. It is shown that this nonreciprocity places a limitation on the magnetic stability of a gyroscope.  相似文献   
997.
This paper presents a brief overview of recent approaches to two problems in music information retrieval: query by example and automated source separation. It describes the challenges inherent in musical query by example and the systems that take very different approaches to the problem. The paper also explores approaches to source separation in a musical context, focusing on systems that take distinct approaches to the problem. Finally, it comments about the future directions for digital signal processing (DSP) research in the context of music information retrieval.  相似文献   
998.
刘杨 《现代电子技术》2006,29(11):24-26,31
介绍了下行链路中基于循环前缀的单载波直接序列扩频技术(CP/CDMA)。这种技术结合了多载波系统中的循环前缀和频域均衡,具有较低的复杂度。同时保留了单载波系统发射端复杂度低的优点。在时变信道中,利用基于辅助数据的信道估计方法,即每隔一定帧数的数据帧发送一帧训练序列来估计信道。在仿真中使用了信道编码。  相似文献   
999.
Routing Correlated Data with Fusion Cost in Wireless Sensor Networks   总被引:1,自引:0,他引:1  
In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications  相似文献   
1000.
A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号