Structural hierarchy of rock masses and the mechanisms of its formation

The formation mechanisms for the structural hierarchy in geological media are discussed. It is shown that the formation of such a hierarchy is caused by certain external and internal circumstances. The first ones consist in the fact that, because of external actions, the Earth’s poles continuously execute the translational and rotational motions responsible for a regular structure of rock fracture and for the appearance of the scale factor √2. The second ones consist in the fact that, under the action of many random factors and because of external actions, during the formation of geological media there appear dissipative structures and, hence, some self-similar fractal structures are formed.     

32位MIPS微处理器中乘法器的设计和实现

在Booth算法的基础上,结合MIPS 4KC微处理器中的流水线结构和乘法器的工作过程,提出了一种改进的Booth乘法器的设计方法,并采用全制定方法实现,用这种方法实现的乘法器单元具有面积小、单元电路可重复性好、版图设计工作量小、功耗低等特点.     

AMBE-1000声码器接口电路设计方法

DVSI公司的AMBE-1000声码器芯片是一款高性能的全双工、实时语音压缩编解码芯片,可以应用于卫星通信、保密通信、视频会议等领域.文中简要介绍AMBE-1000声码器的A/D-D/A接口以及信道接口的工作原理;结合实例分别给出了AMBE-1000声码器与PCM编解码器MC14LC5480的A/D-D/A接口电路、与单片机AT89C51的信道接口电路的设计方法;最后指出了电路设计中应该注意的问题.     

基于LCoS芯片的微型电视系统设计与实现

介绍了LCoS芯片在电视接收系统中的应用，重点讨论了LCoS芯片的结构与特点。自主开发的LCoS模块采用模拟视频接口、兼容隔行和逐行扫描方式，可以简化系统电路设计，降低系统功耗。同时论述了LCoS微型电视机在信号接收、模拟视频处理、时序控制和音频电路等方面的特点，并给出了相关电路的设计方案。     

赴日无线电监测技术考察报告

首先介绍了日本总务省关东综合通信局电波监理部的情况，然后对日本安立公司生产的RR510A型无线电监测接收机和技术参数以及MS8609A型数字移动无线发射机测试仪的功能进行了分析和介绍。     

通信设计在通信工程建设中的作用及发展思路探讨

就通信设计在通信工程建设中的重要地位进行了思考，分析了加入WTO以后我国通信设计行业面临的挑战与机遇，探讨了新形势下我国通信设计行业的应对措施及发展思路。     

Miscibility and phase structure of binary blends of polylactide and poly(methyl methacrylate)

Blends of amorphous poly(DL‐lactide) (DL‐PLA) and crystalline poly(L‐lactide) (PLLA) with poly(methyl methacrylate) (PMMA) were prepared by both solution/precipitation and solution‐casting film methods. The miscibility, crystallization behavior, and component interaction of these blends were examined by differential scanning calorimetry. Only one glass‐transition temperature (T_g) was found in the DL‐PLA/PMMA solution/precipitation blends, indicating miscibility in this system. Two isolated T_g's appeared in the DL‐PLA/PMMA solution‐casting film blends, suggesting two segregated phases in the blend system, but evidence showed that two components were partially miscible. In the PLLA/PMMA blend, the crystallization of PLLA was greatly restricted by amorphous PMMA. Once the thermal history of the blend was destroyed, PLLA and PMMA were miscible. The T_g composition relationship for both DL‐PLA/PMMA and PLLA/PMMA miscible systems obeyed the Gordon–Taylor equation. Experiment results indicated that there is no more favorable trend of DL‐PLA to form miscible blends with PMMA than PLLA when PLLA is in the amorphous state. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 23–30, 2003     

Temperature dependence of the exafs spectrum in YBa2Cu3O7−δ compounds

The temperature dependence of the extended X-ray absorption fine structure (EXAFS) is studied in the high T_c superconductors, YBa₂Cu₃O_7−δ. The measurements were done at the Cu K-edge for samples of two orthorhombic phases (T_c≈90 K and ≈58 K, respectively) and a nonsuperconducting tetragonal phase. Interatomic distances and mean square relative displacements σ² for Cu-O bonds are determined by the least squares refinement. The results indicate that values of σ² increase near T_c for both the orthorhombic samples. It is concluded that this anomalous behavior related to T_c is caused by an anomalous vibration of oxygen atoms in the Ba-O layer. Changes in the Cu-O distances from 300 to 20 K are not found.     

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

In this paper we verified the submodeling technique applied in the thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since the steady-state creep model was implemented for the solder bump to better represent its realistic mechanical behavior, submodeling procedures developed specifically for path-dependent thermomechanical problems were considered. A detailed global model for the flip-chip BGA was built up to verify submodeling solutions. This model also served as a benchmark to examine solution discrepancies caused by different simplifications of the global model.