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171.
R. Pizzoferrato L. Lagonigro T. Ziller A. Di Carlo R. Paolesse F. Mandoj A. Ricci C. Lo Sterzo 《Chemical physics》2004,300(1-3):217-225
We study the infrared emission at 1.54 μm of an organolanthanide complex, Er(III)-tetraphenylporphyrin [Er(TPP)acac], both as a result of direct optical excitation and via energy transfer from host π-conjugate polymers of type poly(arylene–ethynylene) [PAE]. In the first case, the emission of the neat complex is characterized in inert transparent materials and a value of the quantum yield at 1.54 μm φIR=4×10−4 is measured. Then, fluorescence resonance transfer is investigated in blends of Er(TPP)acac with PAEs by monitoring the quenching of the polymer fluorescence along with the enhancement of both the visible emission of the ligand and the near-infrared band of Er3+. These different procedures allow a detailed analysis of the transfer efficiency within a specific implementation of the Förster model for polymeric donors. The experimental values of the critical radius R0, ranging from 1.3 to 2.5 nm for the different blends, are in good agreement with theory for a wide interval of the physical and spectroscopic parameters. This suggests that other mechanisms for excitation transfer do not play a significant role in these materials. 相似文献
172.
Michael S. Donovan Andrew B. Lowe Taylor A. Sanford Charles L. McCormick 《Journal of polymer science. Part A, Polymer chemistry》2003,41(9):1262-1281
A novel bifunctional acrylamido‐based reversible addition–fragmentation chain transfer (RAFT) chain‐transfer agent (CTA), N,N′‐ethylenebis[2‐(thiobenzoylthio)propionamide] (CTA2), has been synthesized and used for the controlled free‐radical polymerization of N,N‐dimethylacrylamide (DMA). A comparative study of CTA2 and the monofunctional CTA N,N‐dimethyl‐s‐thiobenzoylthiopropionamide (CTA1) has been conducted. Polymerizations mediated by CTA1 result in poly(N,N‐dimethylacrylamide) (PDMA) homopolymers with unimodal molecular weight distributions, whereas CTA2 yields unimodal, bimodal, and trimodal distributions according to the extent of conversion. The multimodal nature of the PDMAs has been attributed to termination events and/or chains initiated by primary radicals. The RAFT polymerization of DMA with CTA2 also results in a prolonged induction period that may be attributed to the higher local concentration of dithioester functionalities early in the polymerization. A series of ω‐ and α,ω‐dithioester‐capped PDMAs have been prepared in organic media and subsequently employed as macro‐CTAs for the synthesis of diblock and triblock copolymers in aqueous media with the zwitterionic monomer 3‐[2‐(N‐methylacrylamido)‐ethyldimethylammonio] propane sulfonate (MAEDAPS). Additionally, an ω‐dithioester‐capped MAEDAPS homopolymer has been used as a macro‐CTA for the block polymerization of DMA. To our knowledge, this is the first example of a near‐monodisperse, sulfobetaine‐containing block copolymer prepared entirely in aqueous media. The diblock and triblock copolymers form aggregates in pure water that can be dissociated by the addition of salt, as determined by 1H NMR spectroscopy and dynamic light scattering. In pure water, highly uniform, micellelike aggregates with hydrodynamic diameters of 71–93 nm are formed. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1262–1281, 2003 相似文献
173.
van Driel W.D. van Gils M.A.J. Xuejun Fan Zhang G.Q. Ernst L.J. 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):260-268
Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family. 相似文献
174.
On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages 总被引:1,自引:0,他引:1
Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported. 相似文献
175.
Shaker J. Chaharmir M.R. Cuhaci M. Ittipiboon A. 《Antennas and Propagation Magazine, IEEE》2008,50(4):31-52
It has been a decade since a research program began on reflectarray technology at the Communications Research Centre Canada (CRC). This endeavor has demonstrated the advantages and shortcomings of this technology, the issues that ought to be addressed, and future opportunities. This paper summarizes the outcome of this research in the context of projects that have been carried out, and the resulting insight into reflectarray technology. Design methodology, fabrication process, and measurements results will be briefly discussed for each particular development. 相似文献
176.
R. Hefelmann P. Mann A. Aignan F. Filsinger und H. Amsel 《Fresenius' Journal of Analytical Chemistry》1902,41(1):66-68
Ohne Zusammenfassung 相似文献
177.
Xin Sun Qiang Lu Moroz V. Takeuchi H. Gebara G. Wetzel J. Shuji Ikeda Changhwan Shin Tsu-Jae King Liu 《Electron Device Letters, IEEE》2008,29(5):491-493
A tri-gate bulk MOSFET design utilizing a low-aspect-ratio channel is proposed to provide an evolutionary pathway for CMOS scaling to the end of the roadmap. 3-D device simulations indicate that this design offers the advantages of a multi-gate FET (reduced variability in performance and improved scalability) together with the advantages of a conventional planar MOSFET (low substrate cost and capability for dynamic threshold-voltage control). 相似文献
178.
Ya. A. Ilyushin V. E. Kunitsyn 《Journal of Communications Technology and Electronics》2008,53(5):545-549
The possibility for determining the structure of the surface layer of a cometary nucleus from the data of bistatic radar sensing is investigated. A rigorous solution formulated for this problem on the basis of vector equations of the electromagnetic field is presented. 相似文献
179.
Rajoo R. Lim S.S. Wong E.H. Hnin W.Y. Seah S.K.W. Tay A.A.O. Iyer M. Tummala R.R. 《Advanced Packaging, IEEE Transactions on》2008,31(2):377-385
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps. 相似文献
180.
Yue Rong Yingbo Hua Swami A. Swindlehurst A.L. 《Signal Processing, IEEE Transactions on》2008,56(2):686-701
A space-time optimal power schedule for multiple distributed multiple-input multiple-output (MIMO) links without the knowledge of the instantaneous channel state information (CSI) at the transmitting nodes is proposed. A readily computable expression for the ergodic sum capacity of the MIMO links is derived. Based on this expression, which is a non-convex function of power allocation vectors, a projected gradient algorithm is developed to optimize the power allocation. For a symmetric set of MIMO links with independent identically distributed channels, it is observed that the space-time optimal power schedule reduces to a uniform isotropic power schedule when nominal interference is low, or to an orthogonal isotropic power schedule when nominal interference is high. Furthermore, the transition region between the latter two schedules is seen to be very sharp in terms of nominal interference-to-noise ratio (INR). For MIMO links with correlated channels, the corresponding space-time optimal power schedule is developed based on the knowledge of the channel correlation matrices. It is shown that the channel correlation has a great impact on the ergodic capacity and the optimality of different power scheduling approaches. 相似文献