Designing power heterojunction bipolar transistors with non-uniform emitter finger lengths to achieve high thermal stability

With the aid of a thermal-electrical model,a practical method for designing multi-finger power heterojunction bipolar transistors with finger lengths divided in groups is proposed.The method can effectively enhance the thermal stability of the devices without sacrificing the design time.Taking a 40-finger heterojunction bipolar transistor for example,the device with non-uniform emitter finger lengths is optimized and fabricated.Both the theoretical and the experimental results show that,for the optimum device,the peak temperature is lowered by 26.19 K and the maximum temperature difference is reduced by 56.67% when compared with the conventional heterojunction bipolar transistor with uniform emitter finger length.Furthermore,the ability to improve the uniformity of the temperature profile and to expand the thermal stable operation range is strengthened as the power level increases,which is ascribed to the improvement of the thermal resistance in the optimum device.A detailed design procedure is also summarized to provide a general guide for designing power heterojunction bipolar transistors with non-uniform finger lengths.     

基区重掺杂对SiGe HBT热学性能的影响

相对于同质结晶体管,异质结双极晶体管(HBT)由于异质结的存在,电流增益不再主要由发射区和基区掺杂浓度比来决定,因此可以通过增加基区掺杂浓度来降低基区电阻,提高频率响应,降低噪声系数,但基区掺杂浓度对器件热特性影响的研究却很少。以多指SiGeHBT的热电反馈模型为基础,利用自洽迭代法分析了基区重掺杂对器件集电极电流密度和发射极指温度的影响。通过研究发现,随着基区浓度的增加,SiGe HBT将发生禁带宽度变窄,基区反向注入发射区的空穴电流增大;同时,基区少子俄歇复合增强,这些都将减小集电极电流密度,降低发射极指温度,从而抑制发射极指热电正反馈,提高器件的热稳定性。     

用于改善多指SiGeHBT热特性的变指间距设计方法研究

通过引入表示发射指之间热耦合程度的耦合热阻,建立了多指异质结双极晶体管(HBT)热阻模型.基于该模型,得 到了耦合热阻与指间距的变化关系,并用于器件指间距的设计.当耦合热阻均匀分布时,所对应的一套非等值的指间距值便 是器件温度均匀分布所要求的指间距值.用该方法得到热阻分布与热模拟得到的温度分布相吻合.但这种方法不必通过...