GaAs/GaAlAs多量子阱激子吸收谱

在10K至292K温度范围内测量了GaAs/GaAlAs多量子阱结构的激子吸收谱.观察到轻、重空穴对应的激子吸收峰(LH和HH)及台阶状态密度.研究了轻、重空穴激子吸收峰的能量间隔及激子吸收峰的温度特性.发现多量子阱样品的LO声子展宽系数为6.1meV,比体GaAs的展宽系数略小.样品用国产MBE设备生长,采用化学选择腐蚀技术除去GaAs衬底.     

有并联电导的调制掺杂N-Al_xGa_(1-x)As/GaAs异质结

在分子束外延生长的调制掺杂N-A1_xGa_(1-x)As/GaAs异质结中,在Al_xG_a_(1-x)As层中常出现载流子未耗尽的薄层,对二维电子气会形成一个并联电导层。本文研究了有并联电导时这种结构在低温强磁场下的输运特性。     

Chloride-based fast homoepitaxial growth of 4H-SiC films in a vertical hot-wall CVD

Chloride-based fast homoepitaxial growth of 4H-SiC epilayers was performed on 4° off-axis 4H-SiC substrates in a home-made vertical hot-wall chemical vapor deposition (CVD) system using H₂-SiH₄-C₂H₄-HCl. The effect of the SiH₄/H₂ ratio and reactor pressure on the growth rate of 4H-SiC epilayers has been studied successively. The growth rate increase in proportion to the SiH₄/H₂ ratio and the influence mechanism of chlorine has been investigated. With the reactor pressure increasing from 40 to 100 Torr, the growth rate increased to 52 μm/h and then decreased to 47 μm/h, which is due to the joint effect of H₂ and HCl etching as well as the formation of Si clusters at higher reactor pressure. The surface root mean square (RMS) roughness keeps around 1 nm with the growth rate increasing to 49 μm/h. The scanning electron microscope (SEM), Raman spectroscopy and X-ray diffraction (XRD) demonstrate that 96.7 μm thick 4H-SiC layers of good uniformity in thickness and doping with high crystal quality can be achieved. These results prove that chloride-based fast epitaxy is an advanced growth technique for 4H-SiC homoepitaxy.     

Survey of plasmonic gaps tuned at sub-nanometer scale in self-assembled arrays

Frontiers of Physics - Recent progress in the observation of surface-enhanced Raman scattering (SERS) is reviewed to examine the possibility of finding a novel route for the effective...     

Advances and prospects in nitrides based light-emitting-diodes

Due to their low power consumption, long lifetime and high efficiency, nitrides based white light-emitting-diodes (LEDs) have long been considered to be a promising technology for next generation illumination. In this work, we provide a brief review of the development of GaN based LEDs. Some pioneering and significant experiment results of our group and the overview of the recent progress in this field are presented. We hope it can provide some meaningful information for the development of high efficiency GaN based LEDs and solid-state-lighting.     

AlGaN/GaN基HBTs的高频特性模拟

对n-p-n型AlGaN/GaN基HBTs的高频特性进行了模拟计算，分析了发射区、基区、集电区的一些材料参数对n-p-n型AlGaN/GaN基HBTs的高频特性的影响. 发现基区的设计对频率性能影响很大，减小基区厚度、增大空穴浓度和迁移率将有效提高HBTs的频率性能.     

预注入对Si_(1-x)C_x合金形成的影响

室温下在单晶Si中注入 (0 6— 1 5 )at%的C原子 ,部分样品在C离子注入之前在其中注入2 9Si 离子产生损伤 ,然后在相同条件下利用高温退火固相外延了Si1 -xCx 合金 ,研究了预注入对Si1 -xCx 合金形成的影响 .如果注入C离子的剂量小于引起Si非晶化的剂量 ,在 95 0℃退火过程中注入产生的损伤缺陷容易与C原子结合形成缺陷团簇 ,难于形成Si1 -xCx 合金 ,预注入形成的损伤有利于合金的形成 .随着C离子剂量的增大 ,注入产生的损伤增强 ,预注入反而不利于Si1 -xCx 合金的形成 ,但当注入C原子的浓度超过固相外延的溶解度时 ,预注入的影响可以忽略 .退火温度升高到 10 5 0℃ ,无论预注入还是未预注入样品 ,C含量低的合金相仍然保留 ,而C含量高的合金相大部分消失 .     

GSMBE外延生长SGOI材料的退火行为

在SIMOX SOI超薄硅衬底上外延生长了高质量SiGe合金薄膜来制备SGOI(SiGe on insulator)样品，并研究了其在1050℃氧化气氛中的高温退火行为．用Raman，DCXRD，RBS和光学显微镜等分析手段对SGOI样品在退火前后的性能进行了表征．分析结果表明：SGOI样品表面的穿透位错密度约为5e５ｃｍ－２；高温退火处理可以促进SGOI样品中异质外延生长SiGe合金薄膜的弛豫化和超薄Si夹层向SiGe合金薄膜的转化，进一步提高SiGe薄膜的晶体质量，并且有助于获得高Ge组分的SGOI材料．     

Fe掺杂CuO纳米粉末铁磁性研究

利用固态反应法制备了Fe掺杂CuO纳米粉末并实现了铁磁性。研究了Fe掺杂CuO纳米粉末的结构和磁学特性,X射线粉末衍射谱显示该样品为CuO单斜结构,不存在杂质相,证明Fe离子融入了CuO晶格,铁磁性起源于Fe离子与CuO晶格的相互作用。