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51.
Theoretical investigation of incomplete ionization of dopants in uniform and ion-implanted 4H-SiC MESFETs 下载免费PDF全文
The effects of incomplete ionization of nitrogen in 4H-SiC have
been investigated. Poisson's equation is numerically analysed by
considering the effects of Poole--Frenkel, and the effects of
the potential on $N^+_\dd$ (the concentration of ionized donors)
and $n$ (the concentration of electrons). The pinch-off voltages
of the uniform and the ion-implanted channels of 4H-SiC
metal-semiconductor field-effect transistors (MESFETs) and
the capacitance of the gate are given at different temperatures.
Both the Poole--Frenkel effect and the potential have influence on
the pinch-off voltage $V_{\rm p}$ of 4H-SiC MESFETs. Although the
$C$-$V$ characteristics of the ion-implanted and the uniform channel of
4H-SiC MESFETs have a clear distinction, the effects of incomplete
ionization on the $C$-$V$ characteristics are not significant. 相似文献
52.
Numerical simulation of transconductance of AlGaN/GaN heterojunction field effect transistors at high temperatures 下载免费PDF全文
Based on the investigation of the influence of temperatures on
parameters, including polarization, electron mobility, thermal conductivity,
and conduction band discontinuity at the interface between AlGaN and GaN,
the temperature dependence of transconductance for AlGaN/GaN heterojunction
field effect transistors (HFETs) has been obtained by using a
quasi-two-dimensional approach, and the calculated results are in good
agreement with the
experimental data. The reduction in transconductance at high
temperatures is
primarily due to the decrease in electron mobility in the channel.
Calculations also demonstrate that the self-heating effect becomes serious
as environment temperature increases. 相似文献
53.
With the combined use of the drift-diffusion (DD) model, experiment measured parameters and small-signal sinusoidM steady-state analysis, we extract the Y-parameters for 4H-SiC buried-channel metal oxide semicon- ductor field effect transistors (BCMOSFETs). Output short-circuit current gain G and Mason's invariant U are cMculated for extrapolating unity current gain frequency in the common-source configuration fT and the maximum frequency of oscillation fmax, respectively. Here fT = 800 MHz and fmax= 5 GHz are extracted for the 4H-SiC BCMOSFETs, while the field effect mobility reaches its peak value 87cm2/Vs when VGs = 4.5 V. Simulation results clearly show that the characteristic frequency of 4H-SiC BCMOSFETs and field effect mobility are superior, due to the novel structure, compared with conventional MOSFETs. 相似文献
54.
10 K条件下,采用光致发光(PL)技术研究了不同退火处理后非故意掺杂4H-SiC外延材料的低温PL特性.结果发现,在370—400 nm范围内出现了三个发射峰,能量较高的峰约为3.26 eV,与4H-SiC材料的室温禁带宽度相当.波长约为386 nm和388 nm的两个发射峰分别位于~3.21 eV和~3.19 eV,与材料中的N杂质有关.当退火时间为30 min时,随退火温度的升高,386 nm和388 nm两个发射峰的PL强度先增加后减小,且退火温度为1573 K时,两个发射峰的PL强度均达到最大.
关键词:
光致发光
退火处理
能级
4H-SiC 相似文献
55.
56.
57.
58.
利用水平式低压热壁CVD (LP-HW-CVD) 生长系统,台阶控制生长和衬底旋转等优化技术,在偏晶向的4H-SiC Si(0001) 晶面衬底上进行4H-SiC同质外延生长,生长温度和压力分别为1550℃和104 Pa,用高纯N2作为n型掺杂剂的4H-SiC原位掺杂技术,生长速率控制在5μm/h左右.采用扫描电镜(SEM)、原子力显微镜(AFM),傅里叶变换红外光谱(FTIR)和Hg/4H-SiC肖特基结构对同质外延表面形貌、厚度、掺杂浓度以及均匀性进行了测试.实验结果表明,4H-SiC同质外延在表面无明显缺陷,厚度均匀性1.74%, 1.99% 和1.32%(σ/mean),掺杂浓度均匀性为3.37%,2.39%和2.01%.同种工艺条件下,样品间的厚度和掺杂浓度误差为1.54%和3.63%,有很好的工艺可靠性.
关键词:
4H-SiC
同质外延生长
水平热壁CVD
均匀性 相似文献
59.
The interfacial characteristics of Al/Al2O3/ZnO/n-GaAs metal-oxide-semiconductor (MOS) capacitor are investigated. The results measured by X-ray photoelectron spectroscopy (XPS) and high-resolution transmission electron microscopy (HRTEM) show that the presence of ZnO can effectively suppress the formations of oxides at the interface between the GaAs and gate dielectric and gain smooth interface. The ZnO-passivated GaAs MOS capacitor exhibits a very small hysteresis and frequency dispersion. Using the Terman method, the interface trap density is extracted from C-V curves. It is found that the ZnO layer can effectively improve the interface quality. 相似文献
60.
Influence of Triangle Structure Defect on the Carrier Lifetime of the 4H-SiC Ultra-Thick Epilayer 下载免费PDF全文
Effect of triangle structure defects in a 180-μm-thick as-grown n-type 4H-SiC homoepitaxial layer on the carrier lifetime is quantitatively analyzed, which is grown by a horizontal hot-wall chemical vapor deposition reactor.By microwave photoconductivity decay lifetime measurements and photoluminescence measurements, the results show that the average carrier lifetime of as-grown epilayer across the whole wafer is 2.59μs, while it is no more than 1.34μs near a triangle defect(TD). The scanning transmission electron microscope results show that the triangle structure defects have originated from 3C-SiC polytype and various types of as-grown stacking faults.Compared with the as-grown stacking faults, the 3C-SiC polytype has a great impact on the lifetime. The reduction of TD is essential to increasing the carrier lifetime of the as-grown thick epilayer. 相似文献