选区外延生长半极性GaN材料上的肖特基接触特性

半极性GaN材料的研究在光电器件和电子器件领域有重要意义.采用选区外延生长技术在Si衬底上生长半极性GaN材料,并制备肖特基势垒二极管(SBD).通过测量SBD在不同温度下的Ⅰ-Ⅴ特性曲线,观察到电流的大小随着温度的增加而增加,且受反向偏压影响,证明半极性GaN基SBD的电流传输机制为热电子场发射模型.光致发光光谱和X射线光电子能谱测试进一步表明,相比极性c面GaN材料,半极性GaN材料表面存在较高的氧杂质原子浓度和氮空位,此为半极性GaN肖特基特性偏离热电子发射模型的主要因素.     

Abnormal phenomenon of source-drain current of AlGaN/GaN heterostructure device under UV/visible light irradiation

We report an abnormal phenomenon that the source-drain current (I_D) of AlGaN/GaN heterostructure devices decreases under visible light irradiation. When the incident light wavelength is 390 nm, the photon energy is less than the band gaps of GaN and AlGaN whereas it can causes an increase of I_D. Based on the UV light irradiation, a decrease of I_D can still be observed when turning on the visible light. We speculate that this abnormal phenomenon is related to the surface barrier height, the unionized donor-like surface states below the surface Fermi level and the ionized donor-like surface states above the surface Fermi level. For visible light, its photon energy is less than the surface barrier height of the AlGaN layer. The electrons bound in the donor-like surface states below the Fermi level are excited and trapped by the ionized donor-like surface states between the Fermi level and the conduction band of AlGaN. The electrons trapped in ionized donor-like surface states show a long relaxation time, and the newly ionized donor-like surface states below the surface Fermi level are filled with electrons from the two-dimensional electron gas (2DEG) channel at AlGaN/GaN interface, which causes the decrease of I_D. For the UV light, when its photon energy is larger than the surface barrier height of the AlGaN layer, electrons in the donor-like surface states below the Fermi level are excited to the conduction band and then drift into the 2DEG channel quickly, which cause the increase of I_D.     

Distribution of donor states on the surfaceof AlGaN/GaN heterostructures

The uniform distribution model of the surface donor states in AlGaN/GaN heterostructures has been widely used in the theoretical calculation. A common and a triple-channel AlGaN/GaN heterostructure Schottky barrier diodes have been fabricated to verify the models, but the calculation results show the uniform distribution model can not provide enough electrons to form three separate 2DEGs in the triple-channel AlGaN/GaN heterostructure. Our experiments indicate the uniform distribution model is not quite right, especially for the multiple-channel AlGaN/GaN heterostructures. Besides, it is found the exponential distribution model possibly matches the actual distribution of the surface donor states better, which allows the 2DEG to form in each channel structure during the calculation. The exponential distribution model would be helpful in the research field.     

Tuning a nano-pillar array for enhancing the photoluminescence extraction efficiency of GaN-based light-emitting diodes

We demonstrate the fabrication of hexagonal nano-pillar arrays at the surface of GaN-based light-emitting diodes (LEDs) by nanosphere lithography. By varying the oxygen plasma etching time, we could tune the size and shape of the pillar. The nano-pillar has a truncated cone shape. The nano-pillar array serves as a gradual effective refractive index matcher, which reduces the reflection and increases light cone. It is found that the patterned surface absorbs more pumping light. To compare extraction efficiencies of LEDs, it is necessary to normalize the photoluminescence power spectrum with total absorption rate under fixed pumping power, then we could obtain the correct enhancement factor of the photoluminescence extraction efficiency and optimized structure. The highest enhancement factor of the extraction efficiency is 10.6.     

Influence of adatom migration on wrinkling morphologies of AlGaN/GaN micro-pyramids grown by selective MOVPE

Ga N micro-pyramids with AlGaN capping layer are grown by selective metal–organic–vapor phase epitaxy(MOVPE). Compared with bare Ga N micro-pyramids, AlGaN/Ga N micro-pyramids show wrinkling morphologies at the bottom of the structure. The formation of those special morphologies is associated with the spontaneously formed AlGaN polycrystalline particles on the dielectric mask, owing to the much higher bond energy of Al–N than that of Ga–N. When the sizes of the polycrystalline particles are larger than 50 nm, the uniform source supply behavior is disturbed, thereby leading to unsymmetrical surface morphology. Analysis reveals that the scale of surface wrinkling is related to the migration length of Ga adatoms along the AlGaN {1ī01} facet. The migration properties of Al and Ga further affect the distribution of Al composition along the sidewalls, characterized by the μ-PL measurement.     

低波长漂移的电吸收调制DFB激光器

采用端面有效反射率法 ,从理论上计算了单片集成电吸收调制 DFB激光器 (Electroabsorption ModulatedDFB L aser,EML)的腔面反射率、耦合强度 (κL)对其波长漂移的影响 .同时在实验中通过改变腔面的反射率来验证计算结果 .理论与实验的结果表明 :为提高 EML 的模式稳定性 ,必须减小调制器一端的反射率 ,同时增加DFB激光器的 κL.最终我们采用选择区域生长 (Selective Area Growth,SAG)的方法 ,制作了低光反馈出光面的单脊条形 EML,在 2 .5 Gb/ s的非归零 (NRZ)码调制下 ,经过 2 80 km的标准光纤传输后 ,没有发现色散代价 .     

选择区域生长高质量InGaAsP多量子阱材料

采用 L P- MOVPE在 Si O2 掩膜的 In P衬底上实现了高质量的 In Ga As P多量子阱 (MQW)的选择区域生长(SAG) .通过改变生长温度和生长压力 ,MQW的适用范围由 C波段扩展至 L 波段 ,即 MQW的光致发光波长从15 46 nm延展至 16 2 1nm.光致发光 (PL)测试表明 :在宽达 75 nm的波长范围内 ,MQW的质量与非选择生长的MQW质量相当 ,并成功制作出电吸收调制 DFB激光器 (EML) .     

可调谐DBR激光器、电吸收调制DFB激光器用高质量InGaAsP-MQW材料的选择区域生长

本文报道了采用选择区域生长（Ｓｅｌｅｃｔｉｖｅ ａｒｅａ ｇｒｏｗｔｈ, ＳＡＧ）方法,在 ＳｉＯ２作掩膜的 ＩｎＰ衬底上选择生长出高质量的 ＩｎＧａＡｓＰ－ＭＱＷ,并成功地制作出波长调谐范围达 ６．５ ｎｍ的可调谐 ＤＢＲ激光器和性能可靠的电吸收调制ＤＦＢ激光器．ＳＡＧ成为实现光子集成器件的有效途径,得到广泛的研究,并已实现了ＤＦＢ激光器与电吸收调制器的单片集成 （ｅｌｅｃｔｒｏａｂｓｏｒｐｔｉｏｎ ｍｏｄｕｌａｔｅｄ ＤＦＢ Ｌａｓｅｒ, ＥＭＬ）．我们在国内率先开展这方面的研究,并取得重大的突破． 采用 …     

Electrical properties of MOCVD-grown GaN on Si （111） substrates with low-temperature AIN interlayers

The electrical properties of the structure of GaN grown on an Si （111） substrate with low-temperature （LT） A1N interlayers by metal-organic chemical-vapour deposition are investigated. An abnormal P-type conduction is observed in our GaN-on-Si structure by Hall effect measurement, which is mainly due to the A1 atom diffusing into the Si substrate and acting as an acceptor dopant. Meanwhile, a constant n-type conduction channel is observed in LT-A1N, which causes a conduction-type conversion at low temperature （50 K） and may further influence the electrical behavior of this structure.     

大功率LED多芯片集成封装的热分析

随着高亮度白光LED在室内、室外照明领域的应用,多芯片LED的集成封装方式是其发展的主要趋势之一,而热问题却是多芯片LED集成封装的瓶颈问题之一。建立了多芯片LED集成封装的等效热路模型,并采用有限元分析(FEA)的方法对多芯片LED集成封装的稳态热场分布进行了分析,同时通过制作实际样品研究大功率LED多芯片集成封装的热阻、发光效率与芯片工作数量的关系。结果表明集成封装的多芯片白光LED结温随着集成芯片数量的增加成线性增长,芯片到基板底面的热阻随着芯片工作数量的增加而增大,而其发光效率随着集成芯片数量的增加成线性减小。