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Effect of heavy ion irradiation on the interface traps of AlGaN/GaN high electron mobility transistors 下载免费PDF全文
Zheng-Zhao Lin 《中国物理 B》2022,31(3):36103-036103
AlGaN/GaN high electron mobility transistors (HEMTs) were irradiated with heavy ions at various fluences. After irradiation by 2.1 GeV181 Ta32+ ions, the electrical characteristics of the devices significantly decreased. The threshold voltage shifted positively by approximately 25% and the saturation currents decreased by approximately 14%. Defects were induced in the band gap and the interface between the gate and barrier acted as tunneling sites, which increased the gate current tunneling probability. According to the pulsed output characteristics, the amount of current collapse significantly increased and more surface state traps were introduced after heavy ion irradiation. The time constants of the induced surface traps were mainly less than 10 μs. 相似文献
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AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 1015 cm-2. The dc characteristics of the devices, such as the drain saturation current and the maximum transconductance, decreased after neutron irradiation. The gate leakage currents increased obviously after neutron irradiation. However, the rf characteristics, such as the cut-off frequency and the maximum frequency, were hardly affected by neutron irradiation. The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism. It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas (2DEG) decreased after neutron irradiation. There was no evidence of the full-width at half-maximum of X-ray diffraction (XRD) rocking curve changing after irradiation, so the dislocation was not influenced by neutron irradiation. It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices. 相似文献
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将电磁带隙(EBG)结构加载在电源/地平面之间,依据理论分析对模型结构以及各项参数进行优化.设计出抑制深度为-80 dB、禁带宽度为10 GHz的超宽禁带电源/地平面,在拥有优良抑制电磁干扰能力的同时,也保证了信号的完整性.在禁带内,该平面可以有效地抑制电路之间特别是共用电源/地平面的数字电路与射频电路之间所引起的电磁干扰.仿真实验表明,该设计取得了理想的效果. 相似文献
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