陶瓷衬底上多晶硅薄膜太阳电池研究进展

多晶硅薄膜太阳电池在提高电池效率和大幅度降低成本等方面具有极大潜力.陶瓷材料是高温路线制备多晶硅薄膜电池最常用的衬底材料之一.本文介绍了陶瓷衬底上多晶硅薄膜的制备方法及其电池结构和相关工艺,最后综述了当前该领域的最新研究进展.     

多孔硅在太阳能电池应用中的相关研究

本文用化学腐蚀法在多晶硅基片上制作多孔硅,通过SEM、XPS对多孔硅的表面微结构及其组成进行了研究,定性地分析了氧在多孔硅层中的作用及主要热行为.分析了多孔硅用于太阳能电池时应注意的问题:多孔层微孔尺寸、太阳电池工艺中各热处理过程的温度和时间、多孔层与电极材料是否形成欧姆接触及快速热氧化(RTO)的钝化效果.     

PECVD沉积微晶硅薄膜过程中氢原子对透明导电膜的影响

研究了等离子体放电过程中氢原子对单层SnO2和SnO2/ZnO双层透明导电膜的影响.发现当衬底温度超过150℃,H等离子体处理使SnO2薄膜的透光率显著降低.当在SnO2薄膜表面沉积一层ZnO时,既使ZnO膜的厚度为50nm,也可有效地抑制H原子对SnO2的还原效应,并在SnO2/ZnO双层膜上制备了转换效率为3.8%的微晶硅薄膜太阳电池.     

N+注入ZnO薄膜表面性质的变化

用直流反应磁控溅射法制备ZnO薄膜,将N+注入ZnO薄膜经快速热退火(RTA)后,通过XRD,AFM,UV-VIS-NIR分光光度计等比较了N+注入后ZnO薄膜的电阻率、导电类型、表面形貌和可见光透过率等的变化。经不同条件处理后的ZnO薄膜均具有相同的择优取向(002)。经RTA后颗粒普遍增大;N+注入后经RTA颗粒增大明显,最大有1μm。N+注入后,使ZnO膜的导电类型由原来的n型转变为弱p型。     

The effect of initial discharge conditions on the properties of microcrystalline silicon thin films and solar cells

This paper studies the effects of silane back diffusion in the initial plasma ignition stage on the properties of microcrystalline silicon ($\mu $c-Si:H) films by Raman spectroscopy and spectroscopic ellipsometry, through delaying the injection of SiH7280N, 7830G, 8115Hhttp://cpb.iphy.ac.cn/CN/10.1088/1674-1056/19/5/057205https://cpb.iphy.ac.cn/CN/article/downloadArticleFile.do?attachType=PDF&id=111771back diffusion, microcrystalline silicon, thin film, Raman crystallinityProject supported by the State Key Development Program for Basic Research of China (Grant No.~2006CB202601).This paper studies the effects of silane back diffusion in the initial plasma ignition stage on the properties of microcrystalline silicon ($\mu $c-Si:H) films by Raman spectroscopy and spectroscopic ellipsometry, through delaying the injection of SiH$_{4}$ gas to the reactor before plasma ignition. By comparing with standard discharge condition, delayed SiH$_{4}$ gas condition could prevent the back diffusion of SiH$_{4}$ from the reactor to the deposition region effectively, which induced the formation of a thick amorphous incubation layer in the interface between bulk film and glass substrate. Applying this method, it obtains the improvement of spectral response in the middle and long wavelength region by combining this method with solar cell fabrication. Finally, results are explained by modifying zero-order analytical model, and a good agreement is found between model and experiments concerning the optimum delayed injection time.back;diffusion;microcrystalline;silicon;thin;film;Raman;crystallinityThis paper studies the effects of silane back diffusion in the initial plasma ignition stage on the properties of microcrystalline silicon(μc-Si:H) films by Raman spectroscopy and spectroscopic ellipsometry,through delaying the injection of SiH4 gas to the reactor before plasma ignition.Compared with standard discharge condition,delayed SiH4 gas condition could prevent the back diffusion of SiH4 from the reactor to the deposition region effectively,which induced the formation of a thick amorphous incubation layer in the interface between bulk film and glass substrate.Applying this method,it obtains the improvement of spectral response in the middle and long wavelength region by combining this method with solar cell fabrication.Finally,results are explained by modifying zero-order analytical model,and a good agreement is found between the model and experiments concerning the optimum delayed injection time.     

VHF-PECVD制备微晶硅薄膜的微结构研究

用甚高频等离子体化学气相沉积(VHF-PECVD)法在玻璃衬底上低温制备了不同沉积时间微晶硅薄膜.用拉曼散射光谱仪、X射线衍射(XRD)、原子力显微镜(AFM)等表征手段对薄膜的微观结构进行了研究.研究结果表明:随着沉积时间的延长,薄膜呈岛状生长,薄膜晶粒度在微晶核形成后迅速升高并逐渐饱和;其微观结构经历了"非晶相→非晶/微晶混合相→微晶相"的演变过程.本实验制备的微薄膜仍以(111)为优化取向.     

脉冲退火法制备多晶硅薄膜的研究

用射频等离子体化学气相沉积(RF-PECVD)法在普通玻璃衬底上低温制备了μc-Si:H薄膜.采用快速光热退火炉(RTP),分别用低温(＜650℃)和中温(＜750℃)脉冲法(PRTP)对薄膜进行了退火处理.用拉曼光谱和扫描电子显微镜(SEM)研究了不同条件下退火薄膜散射谱的特征和表面形貌.结果显示,脉冲退火法晶化的薄膜,晶化率达到了53;,部分颗粒团簇的尺寸已达到200nm左右.用声子限域理论和表面尺寸效应对薄膜频谱的"红移"和"蓝移"现象进行了分析.     

脉冲式退火法对AZO薄膜性能的研究

用磁控溅射法在玻璃衬底上制备了掺铝氧化锌(AZO)薄膜,然后用脉冲式快速光热处火(PRTP)法对样品进行了600～800℃的退火处理.采用X射线衍射仪(XRD)、分光光度计、四探针等测试手段对AZO薄膜的结晶性能、透光率和导电性能进行了表征.结果表明:(1)薄膜退火后透光率基本维持在退火前(82～92;)的水平,而电阻率则由10-4Ω·cm 上升了1到6个数量级,已丧失了"导电膜"意义;(2)样品具有好的结构性能有利于提高样品的导电性能.对此现象进行了理论分析.     

SiH4/H2等离子体气相生长硅薄膜的动力学模型

在化学气相沉积微晶硅薄膜过程中,为了降低成本,必须提高生长速率,但薄膜的微观结构和光电性能则随之降低,原因是成膜先驱物在薄膜表面上的扩散长度降低了. 本文利用量子化学的反应动力学理论建立有关成膜先驱物SiH₃和H的反应平衡方程,求解薄膜生长速率和成膜先驱物的扩散长度,并找出影响生长速率与扩散长度的微观参数,发现生长速率不仅与流向衬底的SiH₃的通量密度有关,而且与H的通量密度有关;SiH₃的扩散长度与衬底温度和薄膜表面的硅氢键的形态有关,当     

衬底温度和硼掺杂对p型氢化微晶硅薄膜结构和电学特性的影响

以B₂H₆为掺杂剂,采用射频等离子体增强化学气相沉积技术在玻璃衬底上制备p型氢化微晶硅薄膜.研究了衬底温度和硼烷掺杂比对薄膜的微结构和暗电导率的影响.结果表明：在较高的衬底温度下很低的硼烷掺杂比即可导致薄膜非晶化;在实验范围内,随着衬底温度升高薄膜的晶化率单调下降,暗电导率先缓慢增加然后迅速下降,变化趋势与硼烷掺杂比的影响极为相似.最后着重讨论了p型氢化微晶硅薄膜的生长机理. 关键词： p型氢化微晶硅薄膜 衬底温度 晶化率 电导率