热退火对等离子体增强化学气相沉积SiCOH薄膜结构与性能的影响

热退火是多孔低介电常数薄膜制备过程中的重要一环, 对薄膜结构及性能具有重要影响. 本文以四乙氧基硅烷和双戊烯为前驱体, 采用等离子体增强化学气相沉积方法制备了SiCOH薄膜, 对其进行了氮气氛围下的热退火处理, 分析了热退火对薄膜结构与性能的影响, 探究了退火过程中薄膜结构变化的可能的反应机理. 傅里叶变换红外光谱和固体核磁共振谱结果表明, 沉积薄膜是一种有机无机杂化薄膜. 退火过程中, 薄膜中的-CH₂, -CH₃等有机组分被分解除去, 形成了以稳定的Si-O-Si等无机组分为骨架的多孔结构, 并通过氮气吸附/脱附等温线测试得到了验证. 在此期间, 薄膜骨架微结构亦发生一系列调整, C=C, Si-C含量增加, Si、O、C等元素间发生进一步键合. C=C 含量的提高, 使得薄膜的消光系数和漏电流密度增大. 实验证明, 退火后薄膜具有低折射率、低介电常数特性, 是一类具有优异的介电性能和力学性能的材料, 作为芯片后端互连层间介质具有极大的应用潜力.     

非平衡定态相图在含氮体系低压金刚石沉积中的应用

０前言最近几年低压金刚石制备研究中,出现了一类以含氮气相混合物为原料的制备方法,正逐渐被人们所重视：少量氮原子的存在（甚至是ｐｐｍ级）可以显著提高金刚石薄膜的淀积速率,改善薄膜质量［１,７］。本文报道根据非平衡热力学耦合理论［１０］,首次计算得到了含...     

POROUS AMORPHOUS FLUOROPOLYMER FILMS WITH ULTRALOW DIELECTRIC CONSTANT

With the development of ultralarge scale integrated circuit, new interlayer dielectrics with low dielectric constant for multilevel interconnections are required, instead of conventional SiO₂ films. For the sake of seeking perfect dielectrics, amorphous fluoropolymer (AF) thin film with a thickness of about 0.9μm has been prepared by spin-coating method, following the principle of phase separation. By capacitance-voltage (C-V) measurements the dielectric constant of the thin film is equal to 1.57 at 1 MHz, which is attributed to numerous pores contained in the film matrix. X-ray photoelectron spectroscopy (XPS) spectra show that after annealing, about 71% CF₃ groups in the AF film have decomposed into CF₂, CF, etc. This leads to the increase of CF₂ groups by three times and CF groups by 8% in the AF film. In a word, compared with the film without being annealed, about 25% carbon, 7% fluorine and 12% oxygen atoms will be lost after annealing at 400℃ for 30min.     

Low voltage program-erasable Pd-Al_2O_3-Si capacitors with Ru nanocrystals for nonvolatile memory application

Pd-Al2O3-Si capacitors with Ru nanocrystals are fabricated and electrically characterized for nonvolatile memory application.While keeping the entire insulator Al2O3thickness fixed,the memory window has a strong dependence on the tunneling layer thickness under low operating voltages,whereas it has weak dependence under high operating voltages.As for the optimal configuration comprised of 6-nm tunneling layer and 22-nm blocking layer,the resulting memory window increases from 1.5 V to 5.3 V with bias pulse increasing from 10 5s to 10 2s under±7 V.A ten-year memory window as large as 5.2 V is extrapolated at room temperature after±8 V/1 ms programming/erasing pulses.     

Ta和TaN底电极对原子层淀积HfO2介质MIM电性能的影响

以Ta,TaN为衬底,采用原子层淀积方法制备高介电常数HfO2介质,比较研究了不同衬底电极对金属-绝缘体-金属(MIM)电容的性能影响.结果表明,采用TaN底电极能够获得较高的电容密度和较小的电容电压系数(VCC),在1MHz下的其电容密度为7.47fF/μm2,VCC为356ppm/V2和493ppm/V,这归因于TaN底电极与HfO2介质之间良好的界面特性.两种电容在3V时漏电流为5×10-8A/cm2左右,基于TaN底电极的MIM电容表现出具有较高的击穿强度,其在室温下的导电机理为肖特基发射.     

Memory Effect of Metal--Insulator--Silicon Capacitors with SiO2/HfO2/Al2O3 Dielectrics

Charge trapping characteristics of the metal-insulator-silicon （MIS） capacitors with Si02/HfO2//A12O3 stacked dielectrics are investigated for memory applications＇. A capacitance-voltage hysteresis memory window as large as 7.3 V is achieved for the gate voltage sweeping of ±12 V, and a fiat-band voltage shift of 1.5 V is observed in terms of programming under 5 V and I ms. Furthermore, the time- and voltage-dependent charge trapping characteristics are also demonstrated, the former is related to charge trapping saturation and the latter is ascribed to variable tunnelling barriers for electron injecting and discharging under different voltages.     

低介电常数非晶氟碳薄膜光谱表征

以C4F8和CH4为原料气,通过等离子体增强化学气相淀积的方法制备了非晶氟碳薄膜,在实验条件下所得薄膜的介电常数为2.3。薄膜的傅里叶变换红外光谱表明该薄膜中除了含有CFn(n=1-3）基团外,还含有少量的C=O,C=C等不饱和双键,没有迹象表明C-H和O-H的存在。X射线光电子能谱进一步证明了薄膜中的碳元素有六种不同的化学状态分别为CF3（8%）、CF2（19%）,CF（26.7%)、C↓-—CF。（42.5%),C↓-—C(3.3%)和C=O（0.5%),表明薄膜中大约54%的碳原子与氟成键,大约43%的碳原子不是与氟成键,而是与碳氟基团CFn中的碳原子成键,毗连的两个碳原子上均没有氟参与成键的几率很小。     

掺氮氧化铪的光学特性研究

掺氮氧化铪是半导体工业非常重要的材料。在本论文中,我们利用Hf[N(C₂H₅)(CH₃)]₄ 和 H₂O₂作为原子层淀积的前驱体,制备了二氧化铪材料。然后,我们使用快速热退火的办法,在不同温度下,对二氧化铪进行了氮掺杂工艺。我们对掺氮二氧化铪的组分,跟硅界面的稳定性以及薄膜材料的光学特性随退火温度的变化进行了细致的研究。研究发现,随着退火温度的提高,二氧化铪薄膜材料的氮组分从1.41% 上升至 7.45%,相应的,薄膜材料的禁带宽度从5.82 eV 降低为 4.94 eV。     

基于Al2O3/Pt纳米晶/HfO2叠层的MOS电容存储效应研究

采用电子束蒸发Pt和后快速热退火的方法,研究了退火条件对Pt纳米晶的生长特性的影响,结果显示Pt纳米晶的密度随退火温度的升高和退火时间的延长均表现出先增大后减小的趋势.在800℃下退火20 s能得到分布均匀的、密度为30×10¹¹ cm^-2的Pt纳米晶.进一步研究了基于Al₂O₃/Pt纳米晶/HfO₂叠层的MOS电容结构的存储效应,表明其在-3—+8 V扫描电压范围下C-V< 关键词： Pt纳米晶 快速热退火 原子层淀积 存储效应