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111.
The article referenced above was first published online on 7 August 2007 with incorrect pagination; the pagination has now been corrected online and in print. Copyright © 2007 John Wiley & Sons, Ltd. 相似文献
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Frame Wavelets with Compact Supports for L^2(R^n) 总被引:1,自引:0,他引:1
De Yun YANG King Wei ZHOU Zhu Zhi YUAN 《数学学报(英文版)》2007,23(2):349-356
The construction of frame wavelets with compact supports is a meaningful problem in wavelet analysis. In particular, it is a hard work to construct the frame wavelets with explicit analytic forms. For a given n × n real expansive matrix A, the frame-sets with respect to A are a family of sets in R^n. Based on the frame-sets, a class of high-dimensional frame wavelets with analytic forms are constructed, which can be non-bandlimited, or even compactly supported. As an application, the construction is illustrated by several examples, in which some new frame wavelets with compact supports are constructed. Moreover, since the main result of this paper is about general dilation matrices, in the examples we present a family of frame wavelets associated with some non-integer dilation matrices that is meaningful in computational geometry. 相似文献
114.
Hydroxyapatite coating on porous silicon substrate obtained by precipitation process 总被引:2,自引:0,他引:2
Chen Shaoqiang Zhu Ziqiang Zhu Jianzhong Zhang Jian Shi Yanling Yu Ke Wang Weiming Wang Xiaohua Feng Xiao Luo Laiqiang Shao Li 《Applied Surface Science》2004,230(1-4):418-424
Hydroxyapatite Ca10(PO4)6(OH)2 (HAP) is known as a bioactive and biocompatible material, HAP coatings were used to improve the biocompatible of substrate by many researcher, In this work, HAP thin films on porous silicon (PS) substrates have been prepared by aqueous precipitation method with rapid thermal annealing (RTA) processes. The HAP films had been prepared under the annealing temperature ranging from 300 to 1000 °C. By the measurement of X-ray diffraction (XRD), it was found that for the crystallinity optimization, the heat-treatment at 850–950 °C for 1 h would be favorable. Atomic force microscopy (AFM) and scanning electron microscope (SEM) measurements reveal a dense and smooth surface of the HAP film, and tightly adherence of the coating on porous silicon substrate after sintered. Thus, by this method, porous silicon could be increased its bioactivity and so that could be used in the biomedical area. 相似文献
115.
Li Taihua An Zhu Luo Zhengming Center for Radiation Physics Institute of Nuclear Science Technology Sichuan Union University Chengdu 《原子与分子物理学报》1997,(1)
MEASUREMENTSOFFeANDCuK-ShelIONIZATIONCROSSSECTIONSBYSLOWELECTRONIMPACTLiTaihuaAnZhuLuoZhengmingCenterforRadiationPhysics,Ins... 相似文献
116.
超重元素(新核素)合成研究进展情况分析和展望 总被引:2,自引:0,他引:2
本文在介绍和分析国际、国内在超重元素(新核素)合成实验研究与理论研究进展情况的基础上对我国今后如何从理论与实验的结合上开展超重元素(核)合成研究工作提出一些看法和建议,提供讨论。 相似文献
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王健 《新疆大学学报(理工版)》2002,19(1):108-109
使用计算机进行结构设计虽然能大大减轻计算工作量,但不能取代人的设计概念,只有在设计人员具备较全面的设计概念;有一定设计经验;同时深入了解程度的情况下,才能确保工程设计的质量。 相似文献
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Measurement of small-signal and large-signal responses of packaged laser modules at high temperature
Ning Hua Zhu Ji Min Wen Hai Peng Song Shang Jian Zhang Liang Xie 《Optical and Quantum Electronics》2006,38(15):1245-1257
In this paper, the pulsed injection method is extended to measure the chip temperature of various packaged laser modules,
such as the DFB laser modules, the FP laser modules, and the EML laser modules. An optimal injection condition is obtained
by investigating the dependence of the lasing wavelength on the width and period of the injection pulse in a relatively wide
temperature range. The small-signal frequency responses and large-signal performances of packaged laser modules at different
chip temperature are measured. The adiabatic small-signal modulation characteristics of packaged LD are first extracted. In
the large-signal measurement, the effects of chip temperature, bias current and driving signal on the performances of the
laser modules are discussed. It has been found that the large-signal performances of the EML modules depend on the different
red-shift speeds of the DFB and EAM sections as chip temperature varying, and the optimal characteristics may be achieved
at higher temperature. 相似文献