Thermal stability study of palladium and cobalt Schottky contacts on n-Ge (1 0 0) and defects introduced during contacts fabrication and annealing process

Palladium (Pd) and cobalt (Co) Schottky barrier diodes were fabricated on n-Ge (1 0 0). The Pd-Schottky contacts were deposited by resistive evaporation while the Co-contacts were deposited by resistive evaporation and electron beam deposition. Current-voltage (I-V), capacitance-voltage (C-V) and deep level transient spectroscopy (DLTS) measurements were performed on as-deposited and annealed samples. Electrical properties of Pd and Co samples annealed between 30 and 600 °C indicate the formation of one phase of palladium germanide and two phases of cobalt germanide. No defects were observed for the resistively evaporated as-deposited Pd-and Co-Schottky contacts. A hole trap at 0.33 eV above the valence band was observed on the Pd-Schottky contacts after annealing at 300 °C. An electron trap at 0.37 eV below the conduction band and a hole trap at 0.29 eV above the valence band was observed on as-deposited Co-electron beam deposited Schottky contacts. Rutherford back scattering (RBS) technique was also used to characterise the Co-Ge, for as-deposited and annealed samples.     

Annealing and surface conduction on Hydrogen peroxide treated bulk melt-grown,single crystal ZnO

We report on the studies carried out on hydrogen peroxide treated melt-grown, bulk single crystal ZnO samples. Results show the existence of two shallow donors in the as-received ZnO samples with energy levels (37.8±0.3) meV that has been suggested as Zn_i related and possibly H-complex related and (54.5±0.9) meV, which has been assigned to an Al-related donor. Annealing studies performed on the hydrogen peroxide treated samples reveal the existence of a conductive channel in the samples in which new energy levels have been observed, Zn vacancies, related to the Group I elements, X_Zn. The surface donor volume concentration of the conductive channel was calculated from a theory developed by Look (2007) [1]. Results indicate an increase in the surface volume concentration with increasing annealing temperature from 60×10¹⁷ cm⁻³ at 200 °C to 4.37×10¹⁸ cm^-3 at 800 °C.     

A comparison of the M3/M4 metastable defect detected in hydrogen and ICP Ar plasma treated n-GaAs

Defects created by a dc hydrogen plasma have been compared to those observed in n-GaAs exposed to an inductively coupled (ICP) Ar plasma. The reference sample (in the case of H-plasma treated material) contained two prominent native deep level electron traps, possibly M4 and E_C−0.56 eV, which were both passivated by hydrogen. Plasma treatment also resulted in the formation of a defect observed at 0.58 eV (M3) below the conduction band. This defect transforms back into what is believed to be M4 when annealed at 350 K for 3 h under reverse bias. These two defects compare well with two similar defects observed in the Ar ICP treated samples also showing metastable behavior. Additionally, the electrical characterization of Schottky barrier diodes on n-GaAs, prior to and after hydrogen passivation shows that, depending on the plasma conditions, the plasma ions significantly damage the surface resulting in poor rectifying contacts. The damage is considerably reversed/repaired upon annealing between the room temperature and 573 K (300 °C).     

Improved GaSb surfaces using a (NH4)2S/(NH4)2S04 solution

Bulk (1 0 0) n-GaSb surfaces have been treated with a sulphur based solution ((NH₄)₂S/(NH₄)₂SO₄) to which sulphur has been added, not previously reported for the passivation of GaSb surfaces. Au/n-GaSb Schottky barrier diodes (SBDs) fabricated on the treated material show significant improvement compared to that of the similar SBDs on the as-received material as evidenced by the lower ideality factor (n), higher barrier height (?_b) and lower contact resistance obtained. Additionally, the reverse leakage current, although not saturating, has been reduced by almost an order of magnitude at −0.2 V. The sample surfaces were studied by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The native oxide, Sb–O, present on the as-received material is effectively removed on treating with ([(NH₄)₂S/(NH₄)₂SO₄]+S) and (NH₄)₂S. Analysis of the as-received surface by XPS, prior to and after argon sputtering, suggests that the native oxide layer is ≤8.5 nm.     

A Note on FBSDE characterization of mean exit times

In this Note, we present a new explicit characterization for a mean exit time problem recently treated by the author, in form of a quadratic Forward–Backward Stochastic Differential Equation (FBSDE) with a random terminal time. An a priori estimate and a uniqueness result for such a type of FBSDE are also proved, under certain conditions. To cite this article: C. Makasu, C. R. Acad. Sci. Paris, Ser. I 347 (2009).