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11.
Owing to the fifll isolation and minimization of the silicon active volume, silicon-on-insulator (SOI) tech- nology has better resistance against transient ionizing effects like single event effects (SEE) or latch up.However, the total ionizing dose (TID) irradiation responses of SOI transistors are more complex than bulk-silicon devices. In addition to the gate and par- asitic field leakage current, which are common to SOI and bulk-silicon devices, irradiation induced charges trapped in the SOI buried oxide (BOX) can also affect SOI device performance. Typically, there is a par- asitic edge transistor in the back-gate of SOI devices paralleled with the main transistor, which is formed by the corner region of the silicon island. Due to the high electric field induced by the back-gate voltage at the corner of the silicon island, the threshold of the parasitic edge transistor is lower than the main transistor, resulting in a sub-threshold hump in the transfer characteristic of the back-gate transistor. Even though the threshold of the parasitic edge tran- sistor is lower than the main transistor, it is still larger than zero, which has no effect on the front- gate of devices. However, the sub-threshold hump in the back-gate is the 'Achilles heel' for total dose responses of deep sub-micron SOI n-type metal-oxide- semiconductor field-effect transistors (MOSFETs) iso- lated by shallow trench isolation (STI). As reported in Refs., the threshold of the parasitic edge transis- tor is negative shifted by radiation-induced charges trapped in STI, leading to off-state leakage in the front-gate of devices.  相似文献   
12.
张兴尧  郭旗  陆妩  张孝富  郑齐文  崔江维  李豫东  周东 《物理学报》2013,62(15):156107-156107
对一款商用串口I2C型铁电存储器进行了60Coγ 辐射和退火实验, 研究了铁电存储器的总剂量效应和退火特性. 使用了超大规模集成电路测试系统测试了铁电存储器的DC, AC, 功能参数, 分析了辐射敏感参数在辐射和退火过程中的变化规律. 实验结果表明: 总剂量辐射在器件内产生大量氧化物陷阱电荷, 造成了铁电存储器外围控制电路MOS管阈值向负向漂移, 氧化物陷阱电荷引入附加电场使铁电薄膜受肖特基发射或空间电荷限制电流的作用, 产生辐射感生漏电流. 由于浅能级亚稳态的氧化物陷阱电荷数量上多于深能级氧化物陷阱电荷, 使得器件功能和辐射敏感参数在常温退火过程中快速恢复. 关键词: 铁电存储器 总剂量辐射 退火特性  相似文献   
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