宽窄导轨上纯滚动双钢球碰撞实验

在宽窄水平导轨上进行纯滚动双钢球碰撞实验,发现它与滑动运动中的双钢球碰撞实验明显不同;其原因在于纯滚动双钢球的碰撞是在碰撞点的正碰和切向碰撞的复合碰撞,两类碰撞遵从不同的动力学规律;碰撞过后,两钢球的运动状态都不再是纯滚动,要恢复成纯滚动,每一个钢球都必须通过自身与导轨之间的相互作用,经历一次自调整阶段;而自调整阶段的能量损耗,与钢球的滚动半径和它的即时状态与纯滚动的偏离有关.     

水汽“吸收再发射模型”的解释与应用

卫星水汽图像的基本原理是卫星云图教学中的难点.通过构建概念模型——“吸收再发射模型”直观地展现水汽吸收再发射过程,加深学生对概念的理解,使其在天气预报业务中更加准确地解译卫星水汽图像.     

薄膜生长初期多原子移动影响的模拟

模拟了在低温底上沉积单层薄膜初期的表面形貌．提出了新的算法，实现了多个原子同时在沉积基底上移动的过程，克服了以往只能模拟基底上仅有一个运动原于的缺点，同时引入了沉积流量，并在此基础上讨论了移动步数、沉积流量等因素对生长的影响作用．模拟结果与实验相近，获得的花样具有分形特征．     

Fabrication and Magnetic Properties of Co-Doped TiO2 Powders Studied by Nuclear Magnetic Resonance

Co0.04 Ti0.96O2 powders are fabricated by sol-gel method. The structure and magnetic properties are investigated under different annealing conditions systematically with emphasis on the influence of oxygen pressure. Pure anatase structure was acquired for all the samples annealed at 450℃ for one hour. The samples annealed in air exhibit evident room-temperature ferromagnetism (RTFM) with a small magnetic moment of 0.029μB per Co atom and coercivity Hc of 26 Oe, while the samples annealed in vacuum have strong RTFM with a larger magnetic moment of 1.18μB per Co atom and Hc of 430 Oe. The zero-field spin echo nuclear magnetic resonance spectrum of ^59Co is obtained to prove the existence of Co dusters in the latter samples, implying that the Co dusters are responsible for the strong RTFM in the samples annealed in vacuum. No Co cluster could be observed using both XPS and NMR techniques in the samples annealed in air, implying that the RTFM found in these sample sis intrinsic.     

手性多孔嵌段共聚物薄膜诱导手性金纳米粒子的手性组装

以手性酒石酸(TA)分子诱导嵌段共聚物聚丁二烯-b-聚环氧乙烷(PBd-b-PEO)手性组装,通过除去TA分子形成手性多孔薄膜,并作为模板诱导手性金纳米粒子(Au NPs)手性组装。利用透射电子显微镜(TEM)和圆二色光谱(CD)表征了手性PBd-b-PEO/Au NPs复合薄膜的组装特性。结果表明:当手性Au NPs与孔道结构的手性一致时,更有利于手性Au NPs手性信号的表达。同时,当手性Au NPs沉积量比较少时,复合薄膜只表现出手性Au NPs的手性排列信号;而当Au NPs沉积量大时,复合薄膜表现出手性Au NPs本身和组装体的共同手性信号。     

High-power vertical-cavity surface-emitting lasers bonded with efficient packaging

<正>High-power vertical-cavity surface-emitting lasers(VCSELs) are processed using a wet thermal-selective oxidation technique.The VCSEL chips are packaged by employing three different bonding methods of silver solder,In-Sn solder,and metalized diamond heat spreader.After packaging,optical output power, wavelength shift,and thermal resistance of the devices are measured and compared in an experiment.The device packaged with a metalized diamond heat spreader shows the best operation characteristics among the three methods.The 200-μm-diameter device bonded with a metalized diamond heat spreader produces a continuous wave optical output power of 0.51 W and a corresponding power density of 1.6 kW/cm~2 at room temperature.The thermal resistance is as low as 10 K/W.The accelerated aging test is also carried out at high temperature under constant current mode.The device operates for more than 1000 h at 70℃,and the total degradation is only about 10%.