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本文中研究了O+(200keV,1.8×1018/cm2)和N+(190keV,1.8×1018/cm2)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O+的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO2相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N+的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。
关键词: 相似文献
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采用了一种用离子束增强沉积从V2O5粉末直接制备VO2薄膜的新方法,将纯度为997%的V2O5粉末压成溅射靶,在用Ar离子束溅射的同时,用氩氢混合束对沉积膜作高剂量离子注入,使沉积膜中V2O5的V—O键断裂,进而被注入的氢还原,退火后获得热电阻温度系数(TCR)高达4%的VO2薄膜.高剂量的氩氢混合束注入对薄膜引入应力,使薄膜的转换温度降低、电阻温度曲线斜率变大,是薄膜TCR增大的原因
关键词:
离子束增强沉积
VO2薄膜
热电阻温度系数 相似文献
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一种新型SOI结构——SiGe-OI材料研究进展 总被引:2,自引:0,他引:2
SOI(silicon on insulator,绝缘层上的硅)技术和SiGe(silicon germanium,锗硅)技术都是微电子领域的前沿技术,SiGe-OI(SiGe-on-insulator,绝缘层上的锗硅)新型材料是最近几年来才出现的一种新型SOI材料,它同时具备了SOI技术和SiGe技术的优势,因而成为当前微电子研究领域的最前沿课题之一。文章结合中国科学院上海微系统与信息技术研究所的工作,综述了SiGe-OI材料研究情况和应用前景,详细介绍了其主要的制备方法,最后报道了作才在SiGe-OI材料研究上的一些实验结果。 相似文献
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Ultra-thin and near-fully relaxed SiCe substrate is fabricated using a modified Ce condensation technique, and then a 25-nm-thiek biaxially tensile strained-Si with a low rms roughness is epitaxially deposited on a SiGe- on-Insulator (SGOI) substrate by ultra high vacuum chemical vapor deposition (UHVCVD). High-Resolution cross-sectional transmission electron microscope (HR-XTEM) observations reveal that the strained-Si/SiGe layer is dislocation-free and the atoms at the interface are well aligned. Furthermore, secondary ion mass spectrometry (SIMS) results show a sharp interface between layers and a uniform distribution of Ge in the SiCe layer. One percent in-plane tensile strain in the strained-Si layer is confirmed by ultraviolet (UV) Raman spectra, and the stress maintained even after a 30-s rapid thermal annealing (RTA) process at 1000℃. According to those results, devices based on strained-Si are expected to have a better performance than the conventional ones. 相似文献
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In this work, we investigate the back-gate I-V characteristics for two kinds of NMOSFET/ SIMOX transistors with H gate structure fabricated on two different SOI wafers. A transistors are made on
the wafer implanted with Si+ and then annealed in N2,and B transistors are made on the wafer without implantation and annealing. It is demonstrated experimentally that A transistors have much less back-gate threshold voltage shift ΔVth than B transistors under X-ray total dose irradiation. Subthreshold charge separation technique is employed to estimate the build-up of oxide charge and interface traps during irradiation, showing that the reduced ΔVth for A transistors is mainly
due to its less build-up of oxide charge than B transistors.
Photoluminescence (PL) research indicates that Si implantation results in the formation of silicon nanocrystalline (nanocluster) whose size increases with the implant dose. This structure can trap electrons to compensate the positive charge build-up in the buried oxide during irradiation, and thus reduce the threshold voltage negative shift. 相似文献
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Investigation of SOI Substrates Incorporated with Buried MoSi2 for High Frequency SiGe HBTs 下载免费PDF全文
Highly arsenic-doped Si-on-insulator (SOI) substrate incorporated with buried MoSi2 layers is fabricated aiming at decreasing the collector series resistance of SiGe heterojunction bipolar transistors (HBTs) on SOI, thereby enhancing cutoff frequency (fT) performance and increasing the maximum value of fT (fTMAX ). The .fT performance at medium current is enhanced and current required for fT = 15 GHz is reduced by half The value of fTMAX is improved by 30%. 相似文献
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SOI新结构——SOI研究的新方向 总被引:1,自引:0,他引:1
SOI(silicon-on-insulator绝缘体上单晶硅薄膜)技术已取得了突破性的进展,但一般SOI结构是以SiO2作为绝缘埋层,以硅作为顶层的半导体材料,这样导致了一些不利的影响,限制了其应用范围.为解决这些问题和满足一些特殊器件/电路的要求,探索研究新的SOI结构成为SOI研究领域新的热点.如SOIM,GPSOI,GeSiOI,Si on AlN, SiCOI, GeSiOI,SSOI等.文章将结合作者的部分工作,报道SOI新结构研究的新动向及其应用. 相似文献
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